PINNING - TO92 variant PIN CONFIGURATION SYMBOL. 3 anode g
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1 BT9 series GENERAL DESCRIPTION QUICK REFERENCE DATA Glass passivated, sensitive gate SYMBOL PARAMETER MAX. MAX. MAX. MAX. UNIT thyristors in a plastic envelope, intended for use in general purpose BT9 B D E G switching and phase control V DRM, Repetitive peak 5 6 V applications. These devices are V RRM off-state voltages intended to be interfaced directly to I T(AV) Average on-state A microcontrollers, logic integrated current circuits and other low power gate I T(RMS) RMS on-state current A trigger circuits. I TSM Non-repetitive peak A on-state current PINNING - TO9 variant PIN CONFIGURATION SYMBOL PIN DESCRIPTION cathode gate a k anode g LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC ). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V DRM, V RRM Repetitive peak off-state - B D E 5 G 6 voltages V I T(AV) Average on-state current half sine wave; -.5 A T lead 8 C I T(RMS) RMS on-state current all conduction angles -.8 A I TSM Non-repetitive peak t = ms - 8 A on-state current t = 8. ms half sine wave; - 9 A T j = 5 C prior to surge I t I t for fusing t = ms -. A s di T /dt Repetitive rate of rise of I = A; I = ma; - 5 A/µs on-state current after TM G di G /dt = ma/µs triggering GM I GM V Peak gate current Peak gate voltage A V V RGM Peak reverse gate voltage - 5 V P GM Peak gate power - W P G(AV) Average gate power over any ms period -. W T stg Storage temperature - 5 C T j Operating junction - 5 C temperature Although not recommended, off-state voltages up to 8V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 5 A/µs. September 997 Rev.
2 BT9 series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-lead Thermal resistance K/W junction to lead R th j-a Thermal resistance pcb mounted; lead length = mm K/W junction to ambient STATIC CHARACTERISTICS T j = 5 C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT I GT Gate trigger current V D = V; I T = ma; gate open circuit - 5 µa I L Latching current V D = V; I GT =.5 ma; R GK = kω - 6 ma I H Holding current V D = V; I GT =.5 ma; R GK = kω - 5 ma V T On-state voltage I T = A -..5 V V GT Gate trigger voltage V D = V; I T = ma; gate open circuit V V D = V DRM(max) ; I T = ma; T j = 5 C;.. - V gate open circuit I D, I R Off-state leakage current V D = V DRM(max) ; V R = V RRM(max) ; T j = 5 C; -.5. ma R GK = kω DYNAMIC CHARACTERISTICS T j = 5 C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT dv D /dt Critical rate of rise of V DM = 67% V DRM(max) ; T j = 5 C; V/µs t gt off-state voltage exponential waveform; R GK = kω Gate controlled turn-on I TM = A; V D = V DRM(max) ; I G = ma; time di G /dt =. A/µs - - µs t q Circuit commutated V D = 67% V DRM(max) ; T j = 5 C; - - µs turn-off time I TM =.6 A; V R = 5 V; di TM /dt = A/µs; dv D /dt = V/µs; R GK = kω September 997 Rev.
3 BT9 series Ptot / W conduction angle degrees form factor a BT69..9 Tc(max) / C 77 a = ITSM / A 8 6 BT69 I ITSM T T time Tj initial = 5 C max IF(AV) / A Fig.. Maximum on-state dissipation, P tot, versus average on-state current, I T(AV), where a = form factor = I T(RMS) / I T(AV). Number of half cycles at 5Hz Fig.. Maximum permissible non-repetitive peak on-state current I TSM, versus number of cycles, for sinusoidal currents, f = 5 Hz. ITSM / A BT69 IT(RMS) / A BT69.5 I ITSM T T time Tj initial = 5 C max.5 us us ms ms T / s Fig.. Maximum permissible non-repetitive peak on-state current I TSM, versus pulse width t p, for sinusoidal currents, t p ms... surge duration / s Fig.5. Maximum permissible repetitive rms on-state current I T(RMS), versus surge duration, for sinusoidal currents, f = 5 Hz; T lead 8 C. IT(RMS) / A BT69.6 VGT(Tj) VGT(5 C) BT5.8 8 C Tlead / C Fig.. Maximum permissible rms current I T(RMS), versus lead temperature, T lead Fig.6. Normalised gate trigger voltage V GT (T j )/ V GT (5 C), versus junction temperature T j. September 997 Rev.
4 BT9 series IGT(Tj) IGT(5 C) BT69 IT / A 5 Tj = 5 C Tj = 5 C BT69.5 Vo =.67 V Rs =.87 ohms typ max Fig.7. Normalised gate trigger current I GT (T j )/ I GT (5 C), versus junction temperature T j VT / V Fig.. Typical and maximum on-state characteristic. IL(Tj) IL(5 C) BT69 Zth j-lead (K/W) BT P D t p Fig.8. Normalised latching current I L (T j )/ I L (5 C), versus junction temperature T j, R GK = kω.. us.ms ms ms.s s s tp / s Fig.. Transient thermal impedance Z th j-lead, versus pulse width t p. t IH(Tj) IH(5 C) BT69 dvd/dt (V/us).5 RGK = kohms Fig.9. Normalised holding current I H (T j )/ I H (5 C), versus junction temperature T j, R GK = kω. 5 5 Fig.. Typical, critical rate of rise of off-state voltage, dv D /dt versus junction temperature T j. September 997 Rev.
5 BT9 series MECHANICAL DATA Dimensions in mm Net Mass:. g max. max 5. max.7 min.5 max.8.. min Fig.. TO9; plastic envelope. Notes. Epoxy meets UL9 V at /8". September Rev.
6 BT9 series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC ). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September Rev.
7 This datasheet has been download from: Datasheets for electronics components.
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