HVQFN16; Reel pack, SMD, 13" Q2/T3 standard product orientation Orderable part number ending,128 or HP Ordering code (12NC) ending 128.
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1 Rev December 2015 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning Circular sprocket holes opposite the label side of reel PQ-label (permanent) Cover tape Carrier tape 001aak603 Fig 1. Reel pack for SMD
2 Table 1. Reel dimensions d w [1] 2. Product orientation Dimensions and quantities SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h [1] d = reel diameter; w = tape width. [2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact your local NXP representative. Fig 2. Carrier tape pocket quadrants. Product orientation in carrier tape Pin 1 is in quadrant Q2/T3. 3. Carrier tape dimensions 4 mm A 0 K 0 W B 0 P 1 direction of feed T 001aao148 Fig 3. Carrier tape dimensions Table 2. Carrier tape dimensions In accordance with IEC A 0 B 0 K 0 T P 1 W _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
3 4. Reel dimensions A Z W2 B Ø C Ø D detail Z 001aao149 Fig 4. Schematic view of reel Table 3. Reel dimensions In accordance with IEC A [nom] W2 [max] B [min] C [min] D [min] _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
4 5. Barcode label Fixed text Country of origin i.e. "Made in..." or "Diffused in EU [+] Assembled in... Packing unit (PQ) identification 2 nd traceability lot number* 2 nd (youngest) date code* 2 nd Quantity* Traceability lot number Date code Quantity Type number NXP 12NC NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (33T) PUID: B (30T) LOT2 (30D) DATE2 (30Q) QTY2 (1T) LOT (9D) DATE (31D) REDATE (32T) ORIG (31T) PMC (31P) MSL/PBT MSL/PBT (Q) QTY HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) Additional info if halogen free product Additional info on RoHS Lead-free symbol 001aak714 Fig 5. Example of typical box and reel information barcode label Table 4. Box barcode label l w Barcode label dimensions Reel barcode label l w _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
5 6. Revision history Table 5. Revision history Document ID Release date Packing document status Change notice Supersedes _ Packing information - - Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors N.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 14 December 2015 Document identifier: _128
HVQFN36; Reel pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending,431 or Z Ordering code (12NC) ending 431
Rev. 1 25 November 2015 Packing information 1. Packing method Fig 1. Reel pack for SMD: guard band; ESD shielding bag Table 1. Reel dimensions d w [1] 2. Product orientation Dimensions and quantities SPQ/PQ
D2PAK; Reel pack; SMD, 13" Q2/T3 standard product orientation Orderable part number ending,118 or J Ordering code (12NC) ending 118
Rev. 2 4 August 2016 Packing information 1. Packing method Fig 1. Reel pack for SMD Table 1. Dimensions and quantities Reel dimensions d w [1] SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h
SOD Packing method
DSN0402-2; Leadless super small package; Reel pack, SMD, 7" Rev. 1 1 February 2016 Packing information 1. Packing method Fig 1. Reel pack for SMD Table 1. Reel dimensions d w [1] 2. Product orientation
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
USB PD and type C current-limited power switch
Rev. 1 1 August 2016 Product data sheet 1. General description The is a precision adjustable current-limited power switch for USB PD application. The device includes under voltage lockout, over-temperature
D (double) Package type descriptive code. SC-73 Package type industry code. SC-73 Package style descriptive code
heatsink; leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code Package type industry code Package style descriptive code SO (small
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP8 leads; body width 3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP8 Package type industry code TSSOP8 Package style
D (double) Package type descriptive code. SMA; PMOS Package type industry code. SMA; PMOS Package style descriptive code
SMA PMOS rectangular surface mounted package; 2 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SMA; PMOS Package type industry code
DFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date Manufacturer package code
DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 23 January 2017 Package information 1. Package summary Table 1.
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package body material type
TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code VSSOP8. P (plastic) JEDEC package outline code. MO-187 Mounting method type
VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 5 July 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code VSSOP8
B (bottom) Package type descriptive code Package type industry code. VFBGA Package style descriptive code
VFG64 20 ecember 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG64 Package type industry code VFG Package style descriptive code VFG (very
plastic leaded chip carrier; 44 leads Q (quad) Package type descriptive code PLCC44 PLCC (plastic leaded chip carrier) Package style suffix code
PLCC44 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code PLCC44 Package type industry code PLCC44 Package style descriptive code PLCC
SOT023_fr SOT023_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 2.9 x 1.3 x 1 Terminal
D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code
terminals; body 0.6 x 0.3 x 0.3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SOD2 Package type industry code DSN0603-2 Package
SOD323_fr SOD323_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 1.7 x 1.25 x 0.95 Terminal
Q (quad) Package type descriptive code. SQFP240 Package type industry code. SQFP240 Package style descriptive code
length 1.3 mm); body 32 x 32 x 3.4 mm; high 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code SQFP240 Package type industry code SQFP240
Q (quad) Package type descriptive code LQFP64. LQFP (low profile quad flat package) Package style suffix code
LQFP64 body 10 x 10 x 1.4 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP64 Package type industry code LQFP64 Package style
Q (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code
LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm 19 July 2017 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP32
B (bottom) Package type descriptive code. VFBGA176 Package style descriptive code
VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm 30 July 2018 Package information 1 Package summary Terminal position code B (bottom) Package type
D (double) Package type descriptive code SO8. SO (small outline) Package body material type. P (plastic) IEC package outline code
SO8 plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body 7 December 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code XSON16. P (plastic) JEDEC package outline code. MO-252 Mounting method type
XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code. TSOP6 Package type industry code. TSOP6 Package style descriptive code
plastic, surface-mounted package (TSOP6); 6 leads; mm pitch; 2.9 mm x 1.5 mm x 1 mm body 5 May 2018 Package information 1. Package summary Terminal position code D (double) Package type descriptive code
D (double) Package type descriptive code TSSOP14. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP14 leads; body width 4.4 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP14 Package type industry code TSSOP14 Package
HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Manufacturer package code
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 7 mm x 7 mm x 0.85 mm 5 February 2018 Package information 1. Package summary Table 1. Package summary Terminal position
D (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type
HSOP44 plastic, heatsink small outline package; 44 leads; low standoff height, mm pitch, 15.9 mm x 11.0 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type
SOT Package summary
1 Package summary HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad 7 August 2018 Package information
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BAS16J. 1. Product profile. Single high-speed switching diode. 1.1 General description. 1.2 Features. 1.3 Applications. 1.4 Quick reference data
Rev. 01 8 March 2007 Product data sheet 1. Product profile 1.1 General description, encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features
UHF variable capacitance diode. Voltage Controlled Oscillators (VCO) Electronic tuning in UHF television tuners
Rev. 01 8 June 2009 Product data sheet 1. Product profile 1.1 General description The is a planar technology variable capacitance diode in a SOD523 ultra small leadless plastic SMD package. The excellent
D (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code
plastic, heatsink small outline package; 36 leads; low standoff height, mm pitch, 11 mm x 15.9 mm 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA V P ZSM. non-repetitive peak reverse power dissipation
Rev. 5 26 January 2011 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages.
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
PMEG3030EP. 1. Product profile. 3 A low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features. 1.
Rev. 0 9 December 2009 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress
plastic ball grid array package; 426 balls B (bottom) Package type descriptive code BGA426 Package type industry code
8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code BG426 Package type industry code BG426 Package style descriptive code BG (ball grid
IMPORTANT NOTICE. use
Rev. 02 3 January 2008 Product data sheet IMPORTANT NOTICE Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets
SOT1688-1(SC) 1 Package summary
1 Package summary HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 16 July 2018 Package information Terminal position code
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BAS16VV; BAS16VY. Triple high-speed switching diodes. Type number Package Configuration. BAS16VV SOT666 - triple isolated BAS16VY SOT363 SC-88
Rev. 03 20 April 2007 Product data sheet 1. Product profile 1.1 General description, encapsulated in very small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package
PMD5003K. 1. Product profile. MOSFET driver. 1.1 General description. 1.2 Features. 1.3 Applications. Quick reference data
Rev. 0 6 November 2006 Product data sheet. Product profile. General description PNP low V CEsat Breakthrough In Small Signal (BISS) transistor and high-speed switching diode to protect the base-emitter
PMEG3020BER. 1. Product profile. 2 A low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features. 1.
Rev. 6 April 9 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
CAN bus ESD protection diode
Rev. 04 15 February 2008 Product data sheet 1. Product profile 1.1 General description in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package designed to protect two automotive Controller
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
MHz SAW Filter
Applications General Purpose For IF applications Product Features Typical 1 db Bandwidth of 1.2 MHz Low loss High attenuation Single-ended operation Ceramic Surface Mount Package (SMP) Small Size Dimensions:
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
IMPORTANT NOTICE. use
Rev. 03 2 January 2008 Product data sheet IMPORTANT NOTICE Dear customer, As from October 1st, 2006 Philips Semiconductors has a new trade name - NXP Semiconductors, which will be used in future data sheets
PVR100AZ-B series. Integrated Zener diode and NPN bipolar transistor in one package. Table 1. Product overview Type number Package SOT457 complement
Rev. 1 16 November 26 Product data sheet 1. Product profile 1.1 General description Integrated Zener diode and NPN bipolar transistor in one package. Table 1. Product overview Type number Package SOT457
B (bottom) Package type descriptive code. VFBGA144 Package type industry code. VFBGA144 Package style descriptive code
8 February 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG144 Package type industry code VFG144 Package style descriptive code VFG (very thin
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Low Current LED in Ø 5 mm Tinted Diffused Package
TLLR54., TLLY54., TLLG54. Low Current LED in Ø 5 mm Tinted Diffused Package 9223 PRODUCT GROUP AND PACKAGE DATA Product group: LED Package: 5 mm Product series: low current Angle of half intensity: ± 25
Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA
SOT23 Rev. 6 6 March 2014 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. The
UV SMD LED with Silicone Lens
UV SMD LED with Silicone Lens VLMU52-...-14 DESCRIPTION The VLMU52-...-14 series comprises 3 high brightness UV LED types within an overall wavelength range from 38nm to 41nm. The ceramic based high power
60 V, 1 A PNP medium power transistors
Rev. 8 25 February 28 Product data sheet. Product profile. General description PNP medium power transistor series. Table. Product overview Type number [] Package NPN complement NXP JEITA JEDEC BCP52 SOT223
OnBoard SMD GSM/NB-IoT antenna
Page 1 Rev 1.5 Application note and implementation guideline for NB-IoT operations OnBoard SMD GSM/NB-IoT antenna Patent: SE537042 + Pending Page 2 Rev 1.5 Table of contents 1. General... 3 2. Intended
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
MHz SAW Filter
Applications General Purpose For IF applications Product Features Typical 3 db bandwidth of 18.5 MHz Low loss High Attenuation Single-ended operation Ceramic Surface Mount Package (SMP) Small Size Dimensions:
PESD5V0F1BSF. 1. Product profile. 2. Pinning information. Extremely low capacitance bidirectional ESD protection diode. 1.1 General description
Rev. 1 10 December 2012 Product data sheet 1. Product profile 1.1 General description Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless
Highbright 0603 ChipLED
Highbright 63 ChipLED DESCRIPTION The new 63 ChipLED series have been designed in the smallest SMD package. This innovative 63 ChipLED technology opens the way to Smaller products of higher performance
OnBoard SMD GSM/UMTS antenna
Page 1 Rev 2.5 Not recommended for new designs. Replaced by PRO-OB-572. and implementation guideline OnBoard SMD GSM/UMTS antenna Patent: SE537042 + Pending Page 2 Rev 2.5 Table of contents 1. General...
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
TQM BC1/B2 BAW Duplexer
QM2 Not for New Design as an alternative. Applications CDMA / UMTS Handsets Data Cards Mobile Routers PCS Band Class 1 and Band 2 8 Pin 2.6 x 2.1 x 0.0 mm Product Features Functional Block Diagram Excellent
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 07 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and
High-speed switching diode
Rev. 06 29 October 2008 Product data sheet 1. Product profile 1.1 General description Single high-speed switching diode, fabricated in planar technology, and encapsulated in a small hermetically sealed
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BC635; BCP54; BCX V, 1 A NPN medium power transistors
45 V, A NPN medium power transistors Rev. 7 4 June 7 Product data sheet. Product profile. General description NPN medium power transistor series. Table. Product overview Type number [] Package PNP complement
BAV102; BAV103. Single general-purpose switching diodes
Rev. 4 6 August 2010 Product data sheet 1. Product profile 1.1 General description, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD)
High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology
High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology DESCRIPTION As part of the SurfLight TM portfolio, the is an infrared, 850 nm emitting diode based on surface emitter technology with
PNP/PNP double low V CEsat Breakthrough In Small Signal (BISS) transistor in a medium power Surface-Mounted Device (SMD) plastic package.
Rev. 01 3 April 2007 Product data sheet 1. Product profile 1.1 General description PNP/PNP double low V CEsat Breakthrough In Small Signal (BISS) transistor in a medium power Surface-Mounted Device (SMD)
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Two elements in series configuration in a small SMD plastic package Low diode capacitance Low diode forward resistance AEC-Q101 qualified
Rev. 2 25 October 2016 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. 1.2 Features and benefits Two elements
OnBoard SMD GSM/NB-IoT antenna
Page 1 Rev 1.4 Application note and implementation guideline for GSM/UMTS operations OnBoard SMD GSM/NB-IoT antenna Patent: SE537042 + Pending Page 2 Rev 1.4 Table of contents 1. General... 3 2. Intended
Infrared Emitting Diode, 950 nm, GaAs
94 8553 DESCRIPTION is an infrared, 95 nm emitting diode in technology, molded in a PLCC-2 package for surface mounting (SMD). FEATURES Package type: surface mount Package form: PLCC-2 Dimensions (L x
NPN low V CEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.
Rev. 2 7 November 29 Product data sheet. Product profile. General description NPN low V CEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic
Ultrabright 0402 ChipLED
Ultrabright 42 ChipLED DESCRIPTION The new 42 ChipLED series has been designed in the smallest SMD package. This innovative 42 ChipLED technology opens the way to Smaller products of higher performance
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
TQP DC 6 GHz Gain Block
Product Description The is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1.9 GHz, the amplifier typically provides 19 db gain, +31.7 dbm OIP3,
Planar PIN diode in a SOD523 ultra small plastic SMD package.
Rev. 10 12 May 2015 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small plastic SMD package. 1.2 Features and benefits High voltage, current controlled
65 V, 100 ma NPN/NPN general-purpose transistor. Type number Package PNP/PNP NPN/PNP complement complement
Rev. 01 24 August 2009 Product data sheet 1. Product profile 1.1 General description NPN/NPN general-purpose transistor pair in a very small Surface-Mounted Device (SMD) plastic package. Table 1. Product
High-speed switching in e.g. surface-mounted circuits
Rev. 3 22 July 2010 Product data sheet 1. Product profile 1.1 General description Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs
High Power Infrared Emitting Diode, RoHS Compliant, 94 nm, GaAlAs/GaAs TSML TSML13 TSML12 TSML14 16852 DESCRIPTION TSML is an infrared, 94 nm emitting diode in GaAlAs/GaAs with high radiant power molded
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BAT54W series. 1. Product profile. 2. Pinning information. Schottky barrier diodes. 1.1 General description. 1.2 Features and benefits
SOT2 Rev. 20 November 2012 Product data sheet 1. Product profile 1.1 General description Planar with an integrated guard ring for stress protection, encapsulated in a very small SOT2 (SC-70) Surface-Mounted
1 Form A Solid-State Relay
1 Form A Solid-State Relay i17966_6 DESCRIPTION The is an optically isolated 1 form A solid-state relay in a surface mount 4 pin SOP package. APPLICATIONS Security systems Instrumentation Industrial controls
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Single Schottky barrier diode
SOD23F Rev. 2 28 November 20 Product data sheet. Product profile. General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small and
S (surface mount) Issue date
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals 10 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive
SMPA LF: Low Distortion Attenuator Plastic Packaged PIN Diode
DATA SHEET SMPA1304-011LF: Low Distortion Attenuator Plastic Packaged PIN Diode Automotive Applications Infotainment Navigation Telematics Garage door openers Wireless control systems Features AEC-Q101
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
PMEG6010CEH; PMEG6010CEJ
Rev. 02 27 March 2007 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic