EU-Russia Meeting on R&D Collaboration Moscow, 25 September 2007

Transcription

1 EU-Russia Meeting on R&D Collaboration Moscow, 25 September 2007 The FP7 ICT Theme Components & Systems Dr Erastos Filos European Commission Information Society and Media Directorate-General EF_Comp+Syst_FP7ICT_25Sep07-1

2 Presentation outline The 7 th Framework Programme for Research ICT collaborative research in FP7 The ICT Work Programme Outlook EF_Comp+Syst_FP7ICT_25Sep07-2

3 Framework Programme 7 ( ): Higher R&D investment Budget in bn /yr (5 % of total civil RTD expenditure) FP1 FP2 FP3 FP4 FP5 FP6 FP % EF_Comp+Syst_FP7ICT_25Sep07-3

4 FP7 Specific Programmes Cooperation Collaborative R&D, pre-defined themes, JTIs Ideas Frontier research, competition, individual grants People Human potential, mobility Capacities Infrastructure, SMEs, science and society Joint Research Centre (non-nuclear) + EURATOM EURATOM Programme NEW 3 % 32.3 bn 7.5 bn 4.7 bn 4.3 bn 1.8 bn 2.8 bn 1.3 bn 15 % 9 % 8 % 65 % Total 54.6 bn EF_Comp+Syst_FP7ICT_25Sep07-4

5 FP7 Cooperation : Themes Budget [mn ] 1. Health 6, Food, Agriculture & Biotechnology 1, Information & Communication Technologies 9, Nanosciences, Nanotechnologies, Materials & new Production Technologies 3, Energy 2, Environment (including Climate Change) 1, Transport (including Aeronautics) 4, Socio-Economic Sciences & the Humanities Space 1, Security 1,320 Joint Joint Technology Technology Initiatives Initiatives 32,315 including EF_Comp+Syst_FP7ICT_25Sep07-5 ERA-Nets ERA-Nets International International Co-operation Co-operation

6 ICT Work Programme i2010 Flagship Initiatives Technology Platforms End-to-end Systems, Socio-economic Goals 4. Digital Content & Knowledge 5. ICT for Health 6. Intelligent Car & Sustainable Growth 7. ICT for Independent Living & Inclusion Technology Roadblocks 1. Network & Service Infrastructures 2. Cognitive Systems, Interaction, Robotics 3. Components, Systems, Engineering Call 1: -> 08 May 07 1,194 mn Call 2: May-Sep mn Call 3: Dec 07- Mar mn Future and Emerging Technologies EF_Comp+Syst_FP7ICT_25Sep07-6

7 Challenge 3: Components, Systems, Engineering To To enable enableeurope s Europe sindustry industryto to stay stayat atthe the forefront forefrontof of electronics electronicsdevelopments & applications applications through throughchip chip making, making, integration integration & embedded embeddedsystems systemscapabilities EF_Comp+Syst_FP7ICT_25Sep R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international cooperation under the Intelligent Manufacturing Systems initiative cordis.europa.eu/ims

8 Challenge 3: Targets Today 45 nanometer node 300 mm wafers Conventional CMOS processes homogeneous /monolithic integration Photonics applications emerging Design gap for embedded software Unable to analyse aggregate behaviours, predict & control systems 5 10 years Below the 32 nanometer node 450 mm wafers CMOS & alternative technologies heterogeneous integration (SoC, SiP) Organic electronics Wide use of advanced photonics Higher productivity in the design of embedded systems/software Higher control capacity of large-scale real-time embedded systems EF_Comp+Syst_FP7ICT_25Sep07-8

9 Challenge 3 activities: Components, Systems, Engineering Call 1 ICT ICT ICT ICT Next-generation nanoelectronics components & electronics integration Organic & large-area electronics & display systems Embedded systems design Computing systems Call 2 ICT ICT ICT Photonic components & subsystems Micro/nanosystems Networked embedded & control systems EF_Comp+Syst_FP7ICT_25Sep07-9

10 The ENIAC Roadmap More than Moore: Diversification More Moore: Miniaturisation Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Analog/RF Passives HV Power Information processing Digital signals SoC Sensors Actuators Interacting with people & the environment Non-digital signals SiP Combining SoC and SiP: Higher Value Systems Biochips Beyond CMOS EF_Comp+Syst_FP7ICT_25Sep07-10

11 Next-Generation Nanoelectronics Components & Electronics Integration Smaller, higher performance, lower cost: More Moore Beyond CMOS Integration & diversification: SoC: Systems-on-Chip SiP: Systems-in-Package Technology materials, processes, metrology, interconnects, modelling, packaging, architectures 86 mn Design increased complexity, changed performance, heterogeneity in SiP & SoC, productivity & Design for Manufacturing Manufacturing Cost-efficient, flexible production for silicon < 45 nm; for SoC & SiP; 450 mm wafer size; small batch/fast cycle time; equipment assessment EF_Comp+Syst_FP7ICT_25Sep07-11

12 Photonic Components & Subsystems Components & Subsystems 90 mn Core - Lasers & solid-state sources - Image sensors - New sensors Application specific - Broadband core networks - Broadband access & LAN - Medical diagnosis & prevention - Sensors for environment, safety & security applications Underlying technologies Integration Manufacturing Design methodology & tools Complementary measures Assessment of prototypes Networking, integration & structuring Support measures EF_Comp+Syst_FP7ICT_25Sep07-12 Access: Expertise centres & foundries Education: Young people & graduates Consensus building: R&D strategies, int cooperation

13 Photonic Components & Subsystems: Activities & expected impact Application-specific Photonic Components & Subsystems IP, STREP, NoE Complementary Measures EF_Comp+Syst_FP7ICT_25Sep07-13 IP, STREP Underlying Technologies Core Photonic Components & Subsystems CA, SSA Support Measures Secure leading position of of European industry in in high high value photonic products New New photonic based applications Continued European leadership in in photonics R&D, securing needed human resources & knowledge

14 Micro/Nanosystems Next generation smart systems Sensor- & actuator-based systems Nano-Bio-ICTechnologies convergence Biosensors, lab-on-a-chip, biomems, autonomous implants Smart fabrics and interactive textiles Integration of intelligence in textile materials From smart systems to viable products Microsystems manufacturing technologies Innovative memory systems Emerging technologies for high density mass storage capacity Support actions Technology access, education and training, coordination & dissemination at EU level Call 2: 83 mn CP, NoE, CSA EF_Comp+Syst_FP7ICT_25Sep07-14

15 Challenge 6: ICT for mobility, environmental sustainability & energy efficiency Growing demand for transport services More congestion, higher energy consumption, pollutant emissions Accidents causing fatalities and injuries Over 40,000 fatalities on EU roads every year Natural & industrial disasters have doubled in one decade Killing 500,000 people & causing 700 bn of damage Increasing demand for natural resources 1-2% per year for energy & growing water consumption EF_Comp+Syst_FP7ICT_25Sep07-15

16 Challenge 6: Targets Today Safety of vehicles & their energy efficiency have improved, but the zero-accident scenario is still a distant goal current vehicle active safety (driver warning, hazard detection, etc.) is still limited to stand-alone systems Risk management systems provide isolated solutions no co-ordinated ICT-triggered alert of civil protection Infrastructures are not sufficiently energy efficient & transparent transport, buildings, production plants 5 10 years Intelligent Vehicle Systems secure & reliable vehicle-to-vehicle & vehicle-to-infrastructure communication optimised traffic management at large scale & mobility services Fully integrated management systems to warn & react to environmental & other risks Intelligent monitoring of energy production, distribution, trading & use EF_Comp+Syst_FP7ICT_25Sep07-16

17 Objectives addressing Challenge 6 Call Call 1 ICT for the intelligent vehicles & mobility services ( 57 mn) Accident prevention, Mobility services for people & goods Budget: 159 mn Call Call 2 ICT for cooperative systems ( 48 mn) Vehicle-to-vehicle, vehicle-to-infrastructure, field operational tests ICT for environmental management & energy efficiency ( 54 mn) Collaborative systems for environmental management, ICT for energy efficiency & energy neutral environments EF_Comp+Syst_FP7ICT_25Sep07-17

18 Challenge 1 Budget [mn ] Call 1: -> 08 May 07 1,194 mn + FET Open Overview of Calls: ICT Call 1 The network of the future 200 Challenge 4 Budget [mn ] Service & software architectures, infrastructures & engineering 120 Digital libraries & technology-enhanced learning 52 Intelligent content & semantics 51 ICT in support of the networked enterprise 30 Challenge 5 Secure, dependable & trusted infrastructures 90 Personal health systems for monitoring & point-of-care diagnostics 72 Networked media Challenge 2 85 Advanced ICT for risk assessment & patient safety Challenge 6 30 Cognitive systems, interaction, robotics Challenge 3 96 ICT for intelligent vehicles & mobility services Challenge 7 57 Next generation nanoelectronics components & electronics integr. 86 ICT & ageing 30 Organic & large-area electronics & display systems 63 FET Pro-active (nano-scale ICT devices & systems; pervasive adaptation; bio-ict convergence) 60 Embedded systems design 40 Horizontal support actions 7 Computing EF_Comp+Syst_FP7ICT_25Sep07 systems FET-Open 65

19 Overview of Calls: ICT Calls Challenge 1 New paradigms & experimental facilities Challenge 3 Budget [mn ] 40 Call 2: May-Sep mn Photonic components & subsystems Micro/nanosystems Challenge 2 Budget [mn ] Networked embedded & control systems 47 Cognitive systems, interaction, robotics Challenge 4 97 Challenge 5 Digital libraries & technology-enhanced learning 50 Virtual physiological human 72 Intelligent content & semantics 50 Challenge 6 ICT for cooperative systems 48 FET Pro-active (Science of complex systems for socially intelligent ICT; embodied intelligence; ICT forever yours) 60 ICT for environmental management & energy efficiency Challenge 7 Accessible & inclusive ICT Horizontal support actions Call 3: Dec 07- Mar mn 8 EF_Comp+Syst_FP7ICT_25Sep07-19

20 European Technology Platforms A A spiral spiral model model of of innovation innovation capitalising capitalising on on the the multiple multiple reciprocal reciprocal relationships relationships between between public public & private private stakeholders stakeholders at at various various knowledge knowledge stages stages RESEARCH RESEARCH BUSINESS BUSINESS POLICY POLICY 30+ European Technology Platforms launched so far: Addressing major technological challenges in specific domains Aiming to leverage public & private investment for R&D & innovation Involving key R&D stakeholders eg industry, the research community & public authorities Bundling fragmented R&D efforts towards agreed goals Vision 2020 document & Strategic Research Agenda EF_Comp+Syst_FP7ICT_25Sep07-20 cordis.europa.eu/technology-platforms cordis.europa.eu/technology-platforms

21 Nanoelectronics Technology Platform eniac.eu Addressing the the needs of of silicon-based technologies & beyond shrinking shrinking of of CMOS CMOS logic logic & memory memory devices devices development development of of value-added value-added functions functions for for systemon-chion-chip or or system-in-package system-in-package solutions system- solutions Beyond CMOS More Moore Design Automation More than Moore Equipment, Materials & Manufacturing Heterogeneous Integration EF_Comp+Syst_FP7ICT_25Sep07-21

22 Technology Platform on Smart Systems Integration A multi-disciplinary endeavour: Combining optics, mechanics, electronics, fluidics, thermodynamics, chemistry, biology Converging scientific disciplines: Looking at the overlapping areas between nano-, bio-, information & cognitive sciences Multi-material integration: Semiconductors, polymers (plastics), ceramics, glass, Multi-technology integration: Monolithic, hybrid, multichip, large-area, miniaturisation techniques Multi-functional integration: Combining sensing, processing, actuating Technology Platform smart-systems-integration.org EF_Comp+Syst_FP7ICT_25Sep07-22

23 Photonics Technology Platform To pave the way for Europe s scientific, technological & economic leadership in photonics & make Europe the number one knowledge-based economic area in the world Information & Communication Industrial Production/ Manufacturing & Quality Life Science & Health Lighting & Displays Security, Metrology & Sensors Design & Manufacturing of Components & Sensors Photonics Research, Education & Training Secretariat Photonics21 EF_Comp+Syst_FP7ICT_25Sep

24 Technology Platform ARTEMIS: Advanced research & technology in embedded intelligence & systems To develop & drive a joint European strategy in embedded systems R&D, educational and structural issues addressed To align fragmented R&D efforts along a common strategic agenda at European level To benchmark & link with relevant initiatives outside Europe 8 of the 25 topranked European companies are members they spend annually 25 bn in R&D PARADES EF_Comp+Syst_FP7ICT_25Sep07-24

25 The policy objective 2000: More than 41,000 Europeans lost their lives on the roads To halve the number of deaths by EF_Comp+Syst_FP7ICT_25Sep07-25

26 The technology: Intelligent vehicles ICT enhances the support available to drivers & other road users. It provides for: Greater transport efficiency - Making better use of the capacity of the available infrastructure - Managing varying demands Increased safety & comfort - Improving the quality & reliability of information used by advanced driver assistance systems - Allowing the implementation of advanced safety applications EF_Comp+Syst_FP7ICT_25Sep07-26

27 For more information European research on the web: Information Society and Media: Calls: Contact: EF_Comp+Syst_FP7ICT_25Sep07-27