Ted Glum Director. Defense Microelectronics Activity

Transcription

1 Defense Microelectronics Activity Ted Glum Director Defense Microelectronics Activity

2 Microelectronics Challenges for Defense Systems Key Enabling technology for traditional & irregular warfare Extended weapon system life cycles (20 40 years) Rapidly evolving, expanding missions Performance degradation Obsolescence Commercial requirements dictate the technology & market Very high volumes for short terms Lower environmental & quality thresholds Unsecure manufacturing / distribution

3 Regional Distribution of Commercial Fabs 15% % % 2% 24% 49% 12% Asia-Pacific/ROW Europe Japan North America 80% Source: World Fab Watch Feb 2009

4 Where Do Your Parts Come From? Counterfeit Parts Avionics OEM Trojan Horses Dist. Test Viruses/Worms Fab Ass y Design A Typical COTS Microcircuit Product Flow

5 Source of Fake Electronics in Avionics Supply Chain 7% Authorized Distributors 9% Unknown 9% Independent Distributors 35% Brokers 12% Internet Sources 28% Individual Sales Agents Only 56% of distributors & board assemblers test products before placing into inventory 67% of assemblers comingle parts from multiple suppliers in the same bin Courtesy of Manufacturing & Technology News as of November 2008

6 COTS Use Issues for DoD Systems Quality (commercial vs. mil) Physics of failure Plasma residue Mechanical weakness Hot carrier damage Gate oxide failure Interconnect current density faults Electromigration Lead-free impacts Reliability Tin whisker failures Solder cracks - configuration control Lack of availability (DMS) of traditional SnPb finished components Commercial industry is going lead-free Initial versus un-announced changes Design / Process / Packaging materials

7 Unpredictable Commercial Supply Phillips semiconductor plant (Caen, France) destroyed by fire Produced the SA5521 LVDT integrated circuit used in US subs All mask sets, data sheets, reticles, and wafers were destroyed Philips decided not to resume production Most parts located in the aftermarket were counterfeit Critical part for SSN Virginia Class submarine

8 Multiple Issues / Serial Resolutions System Program Manager s Issues Maintainability Repairability Adapt - Enhance Transition - Transform Obsolescence Reliability Serial Solutions Increased Total Life Cycle Costs $$$$

9 DoD s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS) Government / Semiconductor Industry partnership Innovative adaptable foundry Innovative business model Government-held process licenses No commercial conflicts first right of refusal by industry Prototype / low volume production by DMEA High volume production by industry Transfers industry-developed (commercial) IP & technology COTS as a solution, not a problem Saves processes, not parts Unique in the world Assures continued DoD supply as industry moves with market Prepare for an uncertain future

10 Critical part for SSN Virginia Class submarine Problem: Phillips semiconductor plant (Caen, France) destroyed by fire Produced the SA5521 LVDT integrated circuit used in US subs All mask sets, data sheets, reticles, and wafers were destroyed Philips decided not to resume production Most parts located in the aftermarket were counterfeit Critical part for SSN Virginia Class submarine Solution: Used to monitor positions of missile tube components NUWC, Keyport tasked DMEA to design a form-fit-function replacement IC DMEA redesigned a custom monolithic IC Emulates the original part Removed Crisis Mode from the Navy s Virginia Class Submarines

11 Microelectronics Densification Electronics densification is a manufacturing technique that results in high density chip packaging The compact nature of densification permits more complex, high performance systems to be created affordably Low profile packaged die, or bare die can be assembled into a flexible substrate to realize high complexity circuit assembly 23mm Cap 2-Die Stacked MRAM Interposer Microphone µprocessor Bottom view Top view 0.8mm typical for 2 layers Base for battery & electronics Miniature Audio Recorder with MRAM Storage Smart Munitions

12 DoD / Industry Partnership Evolved Sea Sparrow Missile (ESSM) Raytheon / ESSM End of Life-Cycle Problems Obsolete Devices Impacted future production of Missile Borne Computer (MBC) Subsystem DMEA s Spiral Development Process Eliminated R&M Issues DMEA Provided 3 Options Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS DMEA to redesign 6 boards and 2 ASIC s Microprocessor & Interface Logic redesign Technology Compression to replace other ICs & develop new FFF MBC Subsystem DMEA / Raytheon to Integrate & Test new MBC Cost Avoidance of $20,000,000

13 B-2 Defensive Management System Cost avoidance - $146M Major Accomplishments Band 1 RFFE LRU: All redesigns complete (6 SRUs) Band 2/3, 3 RFFE LRUs: Supportable (Multi-Year-Buy parts acquired) Base Receiver LRU: 6 of 8 redesigns complete Band 4 Receiver LRU: Multiple designs in work (various subassemblies completed 2009) Preprocessor LRU: 2 SRU redesigns complete Complete engineering packages (w/ reprocurement data) have been developed Spares now available for many redesigned SRUs Current Redesign Activities DTO & DLVA modules (Base Receiver) Processor, Pre-Processor (Band 4 Rcvr) PINS Tester upgrade (Test Lab) Planned New Activities Qual Phase Amplifier, Switch Divider ($8.7M) Funds received (to date) - $47.36M

14 The Trusted Foundry Initiative Implements Defense Trusted Integrated Circuits Strategy approved by Dep Sec Def Provides access to DoD for processes / devices Classified circuits Trusted designs / manufacturing Anti - tamper DoD / DMEA TF process licensing to DMEA assured, trusted supply DMEA is the TF accreditation authority Extended to distribution chain

15 >50 Accredited Services Total Accredited Services Available Broker Aggregation Design Test Packaging/Assembly Mask Mfg Mask Data Parsing Foundry Packaging/ Assembly Test Foundry Services Broker Design Aggregation Mask Data Parsing Mask Mfg 10 0 Oct-06 Nov-06 Dec-06 Jan-07 Feb-07 Mar-07 Apr-07 May-07 Jun-07 Jul-07 Aug-07 Sep-07 Oct-07 Nov-07 Dec-07 Jan-08 Feb-08 Mar-08 Apr-08 May-08 Jun-08 Jul-08 Aug-08 Sep-08 Oct-08 Nov-08 Dec-08 Jan-09 Feb-09 Mar-09 Apr-09 May-09 Jun-09 Jul-09 Aug-09

16 War Surge! Hellfire Missile Priceless... Longbow Hellfire Missile Problem Mission Critical Need War Surge Without Guidance System the Smart Missile Reverts to Dumb Bomb Solution ARMS Foundry manufactured parts DMEA retargeted the technology to make the guidance system operational Benefits War surge support ARMS Foundry continued source of supply

17 Enhanced Emergency Alert System Priceless... Don t Sail Without It! By order of Chief, Naval Operations (CNO) Ohio Class Nuclear Submarines Enhanced Emergency Alert System ~ SEEAS ~ Reports loss of strategic asset to National Command Authority Reports catastrophic event causing loss of a SSBN Class submarine by accident or act of war National Strategic Posture was in jeopardy Contractor no longer repaired High removal rate due to maintenance few spares Operational Enhancement Required: Increase Flexibility & Speed To Change Communication Message No bid by industry (difficult specs / low volume) DMEA Solution: Design custom ASIC Provides for service life extension to 2025 Build Production Units & Spares Provides for repair capability and source of supply for spares $3B asset DOCKED! $3B asset AT SEA!

18 DMEA uniquely supports and insures multiple DoD Operations, Programs & Investments Warfighter Operations & Support Counterfeit Parts / Low Quality Assured Supply Intel / Special Ops Quick Reaction SOTP Req. Very Low Vol. Secure supply SOTP Requirement Low Volume Secure supply Assured Supply Rad Hard Parts SOTP Req. Low Volume Secure supply Trusted Parts \ Cyber Secure supply Assured Supply SOTP Req. Low Volume Assured Supply Insured Investments DMEA s State-of-the-Practice Flexible Foundry: DoD s only lynchpin for micro support of major programs & operations

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20 DMEA Mission DoD Mission - Provide microelectronics technology solutions Leverage advanced microelectronics technologies Enhance / adapt capability and performance Improve system reliability and maintainability Address effects of rapid obsolescence Serve as joint resource for DoD / government / industry / foreign allies Established by Secretary of Defense

21 DoD s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS) Main focus Adaptive operations for conventional & irregular warfare Insert advanced technology into DoD weapon systems Prototype / low volume production of new designs Quick turn design / prototype / production War surge support Agile Responsive Trusted Parts Assured Supply Offset state-of-the-practice & state-of-the-art - Adm. Timothy Keating, USN, Commander USPACOM Accelerate delivery of technical capabilities to win the current fight

22 DMEA: A Complete Strategy for Defense Microelectronics Unique challenge Increased reliance on critical technology Technology transition / Adaptive operations Decreased market leverage No long term commercial support Increased unstable manufacturing Trusted supply for mil applications Decreased skilled resources available Unique solution License and transition OEM lines to DMEA s ARMS foundry Leverage DMEA / defense industry requirements / capabilities Full use of commercial development technology transition Practical long term solution strategy Investigate future DoD specific microelectronic issues & develop solutions Develop researched technology for quick application insertion Total Life Cycle Systems Management approach Agile Adaptive - Supportable