LOW PROFILE 2 FORM C RELAY mm inch. M.B.B.type. Initial breakdown voltage 1 A 30 V DC 30 W, 62.5 V A 30 W.
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1 TESTING LOW PROFILE 2 FORM RELY TQ-RELYS FETURES High sensitivity: 2 Form : 4 power consumption (single side stable type) 4 Form : 28 power consumption (single side stable type) Surge voltage withstand: V F Part 68 Sealed construction allows automatic washing also available M... contact types available SPEIFITIS ontact Standard (..M) type M...type rrangement 2 Form 4 Form 2 Form D Initial contact resistance max. (y voltage drop 6 ) mω ontact material Rating power Expected life (min. operations) switching capacity (resistive load) switching power (resistive load) Gold-clad silver 3. 2 V 3 V D 3 W 62. V 3 W switching voltage 2 V switching current switching capacity µ m Single side stable coil latching 4 (3 to 2 ) 2 (24 ) 3 (48 ) (3 to 2 ) (24 ) 28 (3 to 24 ) 4 (48 ) coil latching 2 (3 to 2 ) 3 (24 ) 4 Mechanical (at 8 cpm) 8 7 Electrical (at 2 cpm) ( 3 resistive) 3 resistive. 2 V resistive 2 Note: This value can change due to the switching frequency environmental conditions and desired reliability level therefore it is recommended to check this with the actual load. Remarks * Specifications will vary with foreign standards certification ratings. * Measurement at same location as "Initial breakdown voltage" section. * 2 y resistive method nominal voltage applied to the coil; contact carrying current:. * 3 voltage applied to the coil excluding contact bounce time. * 4 voltage applied to the coil excluding contact bounce time without diode. * Half-wave pulse of sine wave: ms; detection time: µs. * 6 Half-wave pulse of sine wave: 6 ms. * 7 Detection time: µs. haracteristics Initial insulation resistance* Initial breakdown voltage etween open contacts etween contact and coil etween contact sets F surge voltage between open contacts Operate time [Set time]* 3 (at 2 ) Release time [Reset time]* 4 (at 2 ) Standard M...type (..M) type MΩ (at ) 7 Vrms for min. (Detection current: m) 3 Vrms for min. (Detection current: m) Vrms for min. (Detection current: m) Vrms for min. (Detection current: m) V 3 ms (pprox. 2 ms) [ 3 ms (pprox. 2 ms)] 3 ms (pprox. ms) [ 3 ms (pprox. 2 ms)] M... time* 8 µs. Temperature rise* 2 (at 2 ) Shock resistance Vibration resistance onditions for operation transport and storage* 9 (Not freezing and condensing at low temperature) Unit weight * 8 M... time: Measuring condition Functional* Destructive* 6 Functional* 7 Destructive mbient temperature Humidity 49 m/s 2 {G} 98 m/s 2 {G} 76.4 m/s 2 {8G} to Hz at double amplitude of 3 mm 294 m/s 2 {3G} to Hz at double amplitude of mm 4 to +7 4 F to +8 F to 8% R.H. 4 to + 4 F to +22 F 2 Form : pprox.. g.3 oz 4 Form : pprox. 3 g.6 oz. µs Ω * 9 Refer to 4. onditions for operation transport and storage mentioned in autions for use (Page 78). 33
2 ORDERING INFORMTI EX. TQ 2 H L2 2M 3V ontact arrangement 2: 2 Form 4: 4 Form Terninal shape Operating function M function voltage (D) Nil: board H: Nil: Single side stable L: coil latching L2: 2 coil latching Nil: Standard (..M.) type 2M: 2M... type *48 V coil type: Single side stable only Notes:. gpd stationary contact types available for high resistance against contact sticking. When ordering please add suffix 3 like TQ2-2V M... contact types are available only for TQ2 type * V TYPES ND OIL DT (at 2 68 F). Standard (..M.) type 2 Form type. Single side stable board 2. latching 3. 2 latching Pick-up (max.) Drop-out (min.) current m (±%) resistance Ω (±%) power TQ2-3 V TQ2H-3 V TQ2-4. V TQ2H-4. V TQ2- V TQ2H- V TQ2-6 V TQ2H-6 V TQ2-9 V TQ2H-9 V TQ2-2 V TQ2H-2 V TQ2-24 V TQ2H-24 V TQ2-48 V TQ2H-48 V board Set (max.) Reset (min.) current m (±%) resistance Ω (±%) power TQ2-L-3 V TQ2H-L-3 V TQ2-L-4. V TQ2H-L-4. V TQ2-L- V TQ2H-L- V TQ2-L-6 V TQ2H-L-6 V TQ2-L-9 V TQ2H-L-9 V TQ2-L-2 V TQ2H-L-2 V TQ2-L-24 V TQ2H-L-24 V board Set (max.) Reset (min.) current m (±%) resistance Ω (±%) power TQ2-L2-3 V TQ2H-L2-3 V TQ2-L2-4. V TQ2H-L2-4. V TQ2-L2- V TQ2H-L2- V TQ2-L2-6 V TQ2H-L2-6 V TQ2-L2-9 V TQ2H-L2-9 V TQ2-L2-2 V TQ2H-L2-2 V TQ2-L2-24 V TQ2H-L2-24 V Notes:. Specified value of the pick-up drop-out set and reset voltage is with the condition of square wave coil pulse. 2. Standard packing: Tube: pcs.; ase: pcs. 3. In case of V transistor drive circuit it is recommend to use 4. V type relay. 4. gpd stationary contact types available for high resistance against contact sticking. When ordering please add suffix " 3" like TQ2-2V-3. 34
3 4 Form type. Single side stable board 2. latching 3. 2 latching Pick-up (max.) Drop-out (min.) current m (±%) resistance Ω (±%) power Notes:. Specified value of the pick-up drop-out voltage is with the condition of square wave coil pulse. 2. Standard packing: Tube: pcs.; ase: pcs. 3. In case of V transistor drive circuit it is recommend to use 4. V type relay. 4. coil latching and 2 coil latching types are also available by request. Please consult us for details.. gpd stationary contact types available for high resistance against contact sticking. When ordering please add suffix " 3" like TQ2-2V-3. TQ TQ4-3 V TQ4H-3 V TQ4-4. V TQ4H-4. V TQ4- V TQ4H- V TQ4-6 V TQ4H-6 V TQ4-9 V TQ4H-9 V TQ4-2 V TQ4H-2 V TQ4-24 V TQ4H-24 V TQ4-48 V TQ4H-48 V board Set (max.) Reset (min.) current m (±%) resistance Ω (±%) power TQ4-L-3 V TQ4H-L-3 V TQ4-L-4. V TQ4H-L-4. V TQ4-L- V TQ4H-L- V TQ4-L-6 V TQ4H-L-6 V TQ4-L-9 V TQ4H-L-9 V TQ4-L-2 V TQ4H-L-2 V TQ4-L-24 V TQ4H-L-24 V board Set (max.) Reset (min.) current m (±%) resistance Ω (±%) power TQ4-L2-3 V TQ4H-L2-3 V TQ4-L2-4. V TQ4H-L2-4. V TQ4-L2- V TQ4H-L2- V TQ4-L2-6 V TQ4H-L2-6 V TQ4-L2-9 V TQ4H-L2-9 V TQ4-L2-2 V TQ4H-L2-2 V TQ4-L2-24 V TQ4H-L2-24 V M... type Single side stable board Pick-up (max.) Drop-out (min.) current m (±%) resistance Ω (±%) power TQ2-2M-3 V TQ2H-2M-3 V TQ2-2M-4. V TQ2H-2M-4. V TQ2-2M- V TQ2H-2M- V TQ2-2M-6 V TQ2H-2M-6 V TQ2-2M-9 V TQ2H-2M-9 V TQ2-2M-2 V TQ2H-2M-2 V TQ2-2M-24 V TQ2H-2M-24 V Notes:. Specified value of the pick-up drop-out set and reset voltage is with the condition of square wave coil pulse. 2. Standard packing: Tube: pcs.; ase: pcs. 3. In case of V transistor drive circuit it is recommend to use 4. V type relay. 4. gpd stationary contact types available for high resistance against contact sticking. When ordering please add suffix " 3" like TQ2-2V-3. 3
4 DIMENSIS ) 2 Form 2 Form D board P board pattern (opper-side view) dia dia Tolerance: ±. ± Single side stable (Deenergized condition) Schematic (ottom view) -coil latching (Reset condition) coil latching (Reset condition) General tolerance: ±.3 ±.2 *Orientation stripe typical-located on top of relay 2) 4 Form board General tolerance: ±.3 ±.2 Single side stable (Deenergized condition) P board pattern (opper-side view) dia dia Schematic (ottom view) -coil latching (Reset condition) Tolerance: ±. ±.4 2-coil latching (Reset condition) *Orientation stripe typical-located on top of relay REFERENE DT. Maximum switching capacity 2. Life curve 3. Mechanical life Tested sample: TQ2-2V pcs. Switching current D load (cosϕ=) load (cosϕ=) 3 2 Switching V No. of operations 4 3 resistive load 2 V resistive load.. Switching current Ratio against the rated %V No. of operations 4 36
5 4.-() Electrical life (D load) Tested sample: TQ2-2V 6 pcs. ondition: 3 resistive load 2 cpm hange of pick-up and drop-out voltage hange of contact resistance 4.-(2) Electrical life ( load) Tested sample: TQ2-2V 6 pcs. ondition:. 2 V resistive load 2 cpm hange of pick-up and drop-out voltage Ratio against the rated %V ontact resistance mω Ratio against the rated %V No. of operations 4 2 No. of operations 4 No. of operations 4 hange of contact resistance.-() temperature rise (2) Tested sample: TQ2-2V Measured portion: Inside the coil mbient temperature: 3 86 F.-(2) temperature rise (4) Tested sample: TQ4-2V Measured portion: Inside the coil mbient temperature: 3 86 F ontact resistance mω Temperature rise coil voltage 3 to 2 type 24 type Temperature rise No. of operations applied %V applied %V 6.-() Operate/release time characteristics Tested sample: TQ2-2V pcs. 6.-(2) Operate/release time characteristics Tested sample: TQ4-2V pcs. 7. Distribution of pick-up and drop-out voltages Tested sample: TQ2-2V pcs Operate/release time ms Release time Operate time applied %V Operate/release time ms Operate time Release time applied %V Quantity Ratio against the rated %V 8. Distribution of set and reset voltage Tested sample: TQ2-L2-2V 3 pcs. 9. mbient temperature characteristics Tested sample: TQ2-2V pcs.. Distribution of contact resistance Tested sample: TQ2-2V 3 pcs. (3 4 contacts) Quantity 3 2 yyy yy y Set voltage Reset voltage Ratio against the rated %V yyy yy y yy y yyy 4 2 Variation ratio% 4 Drop-out voltage x 2 x mbient temperature 2 4 Quantity ontact resistance mω 37
6 .-() High-frequency characteristics Isolation characteristics.-(2) High-frequency characteristics Insertion loss characteristics.-(3) High-frequency characteristics V.S.W.R Isolation d Insertion loss d V.S.W.R FrequencyMHz FrequencyMHz.. FrequencyGHz 2.-() Malfunctional shock (single side stable) Tested sample: TQ2-2V 6 pcs. 2.-(2) Malfunctional shock (latching) Tested sample: TQ2-L-2V 6 pcs. 3.-() Influence of adjacent mounting Z Z X X Y Y Y 98m/s 2 X 98m/s 2 Deenergized condition Energized condition 96m/s 2 98m/s 2 392m/s 2 98m/s 2 Z 88m/s 2 X 784m/s 2 98m/s 2 Y Z 98m/s 2 Z Z X X Y Y Y 98m/s 2 X 98m/s 2 Reset state Set state 96m/s 2 98m/s 2 392m/s 2 98m/s 2 Z 88m/s 2 X 784m/s 2 98m/s 2 Y Z 98m/s 2 Rate of change % Rate of change % Inter-relay distance 3.-(2) Influence of adjacent mounting 3.-(3) Influence of adjacent mounting 4.-() ontact reliability ( m resistive load) Tested sample: TQ2-2V ondition: Detection level Ω Rate of change % Rate of change % Inter-relay distance Rate of change % Rate of change % Inter-relay distance F(t) % m=2. µ= % reliability limit = (Weibull probability paper). No. of operations 6 4.-(2) ontact reliability ( µ resistive load) Tested sample: TQ2-2V ondition: Detection level Ω 38 F(t) % m=.4 µ= % reliability limit = 9. 6 (Weibull probability paper). No. of operatins 7. ctual load test (3 m 48 wire spring relay load) ircuit 48 V D Ω Ω 2Hz Wire spring relay ircuit diagram hange of pick-up and drop-out voltage Ratio against the rated %V No. of operations 4
7 hange of contact resistance resistive load test hange of pick-up and drop-out voltage hange of contact resistance ontact resistance mω Ratio against the rated %V ontact resistance mω No. of operations 4 2 No. of operations 4 2 No. of operations 4 7.-() Distribution of M... time Sample: TQ2-2M-V 8 pcs. Terminal Nos : Terminal Nos : 6 4 x:.6 µs 3σn-: 63.8 µs : 23 µs :243 µs x:7.6 µs 3σn-: 27. µs : 7 µs :87 µs µs min µs min. 3 µs max µs max. 7.-(2) Distribution of M... time Sample: TQ2-2M-V 8 pcs. Terminal Nos : Terminal Nos : 6 x:.6 µs 3σn-: 67.3 µs :3 µs :24 µs 6 x:8.7 µs 3σn-: 6.7 µs : 29 µs :298 µs µs min µs max. 2 3 µs min µs max. For autions for Use see Relay Technical Information 9//2 ll Rights Reserved opyright Matsushita Electric Works 39 Ltd.
8 T-Series Relays T series autions for Use. power Pure D current should be applied to the coil. The wave form should be rectangular. lf it includes ripple the ripple factor should be less than %. However check it with the actual circuit since the characteristics may be slightly different. The nominal voltage should be applied to the coil for more than ms to set/reset the latching type relay. 2. connection When connecting coils refer to the wiring diagram to prevent mis-operation or malfunction. 3. External magnetic field Since T-Series relays are highly sensitive polarized relays their characteristics will be affected by a strong external magnetic field. void using the relay under that conditions. 4. onditions for operation transport and storage ) mbient temperature humidity and atmospheric pressure during usage transport and storage of the relay: TX(-SMD)/TX-D(-SMD)/TQ-SMD () Temperature: 4 to +8 4 to +8 F. The temperature range is 4 to +7 4 to +8 F for the packaged relay. TX-S(-SMD) () Temperature: 4 to +7 4 to +8 F. for the package/non-package relay. TQ/TF/TN/TK () Temperature: 4 to +7 4 to +8 F The temperature range is 4 to +6 4 to +4 F for the packaged relay. (2) Humidity: to 8% R.H. (void freezing and condensation.) The humidity range varies with the temperature. Use within the range indicated in the graph below. (3) tmospheric pressure: 86 to 6 kpa Temperature and humidity range for usagetransport and storage: TX(-SMD) / TX-D(-SMD) / TQ-SMD 8 Tolerance range Humidity %R.H. (void freezing when (void used at temperatures condensation when lower than 32 F) used at temperatures higher than 32 F) Temperature F TQ / TF / TN / TK / TX-S (-SMD) 8 Tolerance range Humidity %R.H. (void freezing when (void used at temperatures condensation when lower than 32 F) used at temperatures higher than 32 F) Temperature F ) ondensation ondensation forms when there is a sudden change in temperature under high temperature high humidity conditions. ondensation will cause deterioration of the relay insulation. 3) Freezing ondensation or other moisture may freeze on the relay when the temperature is lower than 32 F. This causes problems such as sticking of movable parts or operational time lags. 4) Low temperature low humidity environments The plastic becomes brittle if the relay is exposed to a low temperature low humidity environment for long periods of time.. M... contact relays small time may be generated by the contact bounce during contact switching. heck the actual circuit carefully. If the relay is dropped accidentally check the appearance and characteristics including M... time before use. 6. Packing style ) Tube orientation for both standard through hole type (including selfclinching type) and surface-mount type. The relay is packed in a tube with the relay orientation mark on the left side as shown in the figure below. Take note of the relay orientation when mounting relays on the printed circuit board. Standard through hole type (including self-clinching type) ex) TX Relays Stopper (gray) Orientation (indicates PIN No.)stripe Stopper (green) Surface-mount type ex) TX-SMD Relays Orientation (indicates PIN No.)stripe Stopper (gray) (2) Tape and reel packing (surface-mount type) () Tape dimensions. TX/TX-D/TX-S-SMD Relays (i) S type (Z type) TX/TX-D/TX-S -SMD relays (ii) SL type (Z type) (iii) SS type +.. dia dia TQ-SMD Relays (i) S type dia dia D TX/TX-D/TX-S -SMD relays (Z type) TX/TX-D/TX-S -SMD relays +.. dia dia Stopper (green) ±.3 ±.2 ± ± ±.3.94 ±.2 ± ± dia..87 dia ±.3.94 ±.2 ±.2.8 ± ± ±.4 type)..7 ±. dia. +.4 ± ±..9 dia. ±..6 ±.4.79 ±.4 ±...43±.4 4.6±..7 ±.4 +. ± dia. ±.3 6. ±. 2.3 ± ± dia ±.2 TQ-SMD relays ±.4 ±.4 (ii) SL SS type 4. (Z ±..7 ±.4 +. (Z type)..7 ±. dia. +.4 ±.4.4 ±..9 dia. 2.± ±.4.79 ±.4 ±...43± ±..7 ±.4 ± ±.3 6. ±. 2.3 ± ±.8 dia dia ±.4.94 ±.2 TQ-SMD relays ±.4 (. ±. ± )* Note) *SS type 78
9 (2) Dimensions of plastic reel (i) TX/TX-D/TX-S-SMD Relays (ii) TQ-SMD Relays 7. utomatic insertion To maintain the internal function of the relay the chucking pressure should not exceed the values below. ) TX(-SMD)/TX-D(-SMD)/TQ/TF hucking pressure in the direction : 4.9 N { g}or less hucking pressure in the direction : hucking pressure in the direction : TX(-SMD)/TX-D(-SMD)/TX-S(-SMD) TQ 2. ±..79 ±.2 2. ±..79 ±.2 Through hole type TF Please chuck the portion. void chucking the center of the relay. 2) TQ-SMD hucking pressure in the direction : hucking pressure in the direction : Mountimg pressure in the direction : Please chuck the ±.6 ±.24 dia. dia. ±. 3 dia. ±.2.2 dia ±.8 ± ±.2 ± portion. ± dia. ± dia. ±2 37 dia. ± dia. ± ±.8 ± dia. ± dia. ±2 33 dia. ± dia ±.2 ±.8 Surface-mount type void chucking the center of the relay. 3) TN hucking pressure in the direction : hucking pressure in the direction : hucking pressure in the direction : 4.9 N { g}or less Please chuck the portion. void chucking the center of the relay. 4) TK hucking pressure* in the direction : hucking pressure* in the direction : 29.4 N {3 kg}or less hucking pressure* in the direction : Please chuck the portion. void chucking the center of the relay. *Value of chucking pressure is shown by the value of weight pressed on the portion(4 mm dia.) 8. Soldering ) Preheat according to the following conditions. Temperature 22 F or less Time Within approx. minute When soldering standard P board s or self-clinching s soldering should be done at F within sec. 2) When soldering surface-mount s the following conditions are recommended. () IR (Infrared reflow) soldering method (2) Vapor phase soldering method (4) Direction Direction Direction () (6) T3 T2 T T = to 6 3 F to 329 F T2 = 8 to 2 36 F to 392 F T3 = F or less T3 T2 T T =9 to 94 F to 22 F T2 =8 to 2 36 F to 392 F T3 =2 49 F or less t t t2 t = 2 sec. or less t2 = 3 sec. or less t2 t = 9 sec. to 2 sec. t2 = 6 sec. or less T-Series Relays (3) Soldering iron method Tip temperature: 28 to 3 36 F to 72 Wattage: 3 to 6 W Soldering time: within sec. (4) Other soldering methods heck mounting conditions before using other soldering methods (hot-air hot plate pulse heater etc.). Remarks The temperature profile indicates the temperature of the soldered on the surface of the P board. The ambient temperature may increase excessively. heck the temperature under mounting conditions. The conditions for the infrared reflow soldering apply when preheating using the VPS method. 9. leaning In automatic cleaning cleaning with the boiling method is recommended. void ultrasonic cleaning which subject the relay to high frequency vibrations. It may cause the contacts to stick. lt is recommended that a fluorinated hydrocarbon or other alcoholic solvents be used.. Others ) If in error the relay has been dropped the appearance and characteristics should be checked before use without fail. 2) The cycle lifetime is defined under the standard test condition specified in the JIS* standard (temperature to 3 9 to 9 F humidity 2 to 8%). heck this with the real device as it is affected by coil driving circuit load type activation frequency activation phaseambient conditions and other factors. 3) For secure operations the voltage applied to the coil should be nominal voltage. In addition please note that pick-up and drop-out voltage will vary according to the ambient temperature and operation conditions. 4) Latching relays are shipped from the factory in the reset state. shock to the relay during shipping or installation may cause it to change to the set state. Therefore it is recommended that the relay be used in a circuit which initializes the relay to the required state (set or reset) whenever the power is turned on. ) heck the ambient conditions when storing or transporting the relays and devices containing the relays. Freezing or condensation may occur in the relay causing functional damage. void subjecting the relays to heavy loads or strong vibration and shocks. *Japanese Industrial Standards 9//2 ll Rights Reserved opyright Matsushita Electric Works 79 Ltd.
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