Product Brief. T6 Series Red-B. Product Data Sheet. Applicable for automotive exterior light STR0G16AB. RoHS. Description. Features and Benefits

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1 Applicable for automotive exterior light T6 Series Red-B STR0G16AB RoHS AEC-Q101 Product Brief Description This White Colored surface-mount LED comes in standard package dimension. Package Size: 3.3x4.0x1.9mm It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. Features and Benefits White PLCC6 Red Color ESD max 2kV MSL 2 Level Viewing angle 120 AEC-Q101 Qualified RoHS compliant The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Key Applications Automotive Exterior Lighting Stop tail Lamp, CHMSL 1

2 Table of Contents Index Product Brief 1 Table of Contents 2 Performance Characteristics 3 Characteristics Graph 5 Color Bin Structure 11 Reliability Test 12 Mechanical Dimensions 13 Material Structure 14 Recommended Solder Pad 15 Reflow Soldering Characteristics 16 Emitter Tape & Reel Packaging 17 Product Nomenclature 19 Handling of Silicone Resin for LEDs 20 Precaution For Use 21 Company Information 24 2

3 Performance Characteristics Table 1. Electro Optical Characteristics, I F = 140mA, T j = 25ºC, RH30% Parameter Symbol Value Min. Typ. Max. Unit Forward Voltage [1] V F V Luminous Intensity [2] [1] I V 4,500 6, mcd Luminous Flux Φ V lm Peak Wavelength W p 624 nm Dominant Wavelength [1] W d nm Viewing Angle [3] 2θ 1/2 120 deg. Optical Efficiency η op lm/w Spectral Bandwidth 50% 17 nm Thermal resistance [4] Rth JA 110 / W Rth JS 60 / W Temperature coefficient of V F -10 T 100 Temperature coefficient of W d -10 T 100 TC v mv/ TC x 0.08 nm/ Luminous Intensity Phi V / IV Ω lm/cd Notes : (1) Tolerance : VF :±0.1V, IV :±7%, W d :±0.5nm (2) The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. (3) Θ 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity (4) Thermal resistance = Rth JA : Junction/ambient, Rth JS : Junction/solder point 3

4 Performance Characteristics Table 2. Absolute Maximum Ratings Parameter Symbol Value Unit Power Dissipation (T a =25 ) P d 550 mw Forward Current (T a =25 ) I F 200 ma Peak Forward Current (t 1 μsec,d 1/10,T a =25 ) I FM 1000 ma Operating Temperature T opr -40 ~ +110 Storage Temperature T stg -40 ~ +110 Junction Temperature T j 125 Soldering Temperature T sld Reflow Soldering : 260 for 10sec. Hand Soldering : 315 for 4sec. ESD (HBM) (R=1.5kΩ, C= 100pF) Max 2 kv Notes : LED s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. All measurements were made under the standardized environment of Seoul Semiconductor. 4

5 Relative Emission Intensity Characteristics Graph Product Data Sheet Fig 1. Color Spectrum, I F = 140mA, T j = 25ºC, RH30% Wavelength [nm] Fig 2. Viewing Angle Distribution, I F = 140mA

6 Forward Current [ma] Characteristics Graph Product Data Sheet Fig 3. Forward Voltage vs. Forward Current, T j = 25ºC Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Intensity, T j = 25ºC IV I V = I V / I V (140mA) Forward Current [ma] 6

7 Characteristics Graph Product Data Sheet Fig 5. Forward Current vs. W d Shift, T j = 25ºC W d W d = W d - W d (140mA) Forward Current [ma] 7

8 Characteristics Graph Product Data Sheet Fig 6. Relative Light Output vs. Junction Temperature, I F = 140mA IV I V = I V / I V (25 ) Junction Temperature [ ] Fig 7. Junction Temperature vs. Forward Voltage shift, I F = 140mA V F V F = V F - V F (25 ) Junction Temperature [ ] 8

9 Characteristics Graph Product Data Sheet Fig 8. Dominant wavelength shift vs. Junction Temperature, I F = 140mA W d W d = W d - W d (25 ) Junction Temperature [ ] 9

10 Maximum Forward Current I F [ma] Characteristics Graph Product Data Sheet Fig 9. Maximum Forward Current vs. Temperature T A T S Ta T A temp : Ambient T S temp : Solder point Temperature A [ ] 10

11 Color Bin Structure Table 3. Bin Code description, I F = 140mA Part Number Luminous Intensity (mcd) Dominant Wavelength (nm) Forward Voltage (V) Bin Code Min. Max. Bin Code Min. Max. Bin Code Min. Max k z m a STR0G16AB n b c d Available ranks *Notes : (1) All measurements were made under the standardized environment of Seoul Semiconductor In order to ensure availability, single color rank will not be orderable. 11

12 Reliability Test Test Item Standard Test Method Test Condition Duration / Cycle Number Of Test External Visual JESD22 B-101 Visual inspection - 77 D.P.A AEC-Q Random Sample H3TRB,HAST,TC - 5 Vibration JESD22 B-103 ESD JESD22 A-114 Physical Dimension JESD22 B-100 Mechanical Shock JESD22 B inch displacement, 20 to 100 Hz, 50 g 100 Hz to 2kHz, Human-body mode, R=1.5 kω, C = 100pF Verify physical dimensions against device mechanical drawing 1500 g's for 0.5 ms, 5 blows, 3 orientations 4 times 30 3 times Negative/ Positive 30 3 times 30 3 times 30 Parametric Verification JESD22 A , hrs 77 Temperature cycling JESD22 A-104 Power Temperature Cycle JESD22 A-105 Tc= C, 30 min. dwell, 5 min transfer, 1000 cycles Ta=-40 ~85, If =125mA, 20 min dwell / 20 min transition (1 hour cycle), 2 min ON / 2 min OFF 1000hrs hrs 77 High Humidity High Temp. Operating Life High Temperature Operating Life Low Temperature Operating Life Low Temperature Storage Life High Temperature Storage Life JESD22 A /85% 125mA 1000hrs 77 JESD22 A-108C Ta= 100 C, If =75mA 1000hrs 77 JESD22 A-108C Ta= -40 C, If = 200mA 1000hrs 77 JESD22 A-119 Ta=-40 C, non-operating 1000hrs 77 JESD22 A-103B Ta=100 C, non-operating 1000hrs 77 Thermal Shock JESD22 A C ~ 100 C, 20 min. dwell, <10 second transfer, 1000 cycles 1000hrs 77 Criteria for Judging the Damage Item Symbol Condition MIN Criteria for Judgment MAX Forward Voltage V F I F =140mA - Initial 1.2 Luminous Intensity I V I F =140mA Initial

13 Mechanical Dimensions Top View Bottom View A NC A A C A Package Mark Side View Circuit ESD Protection Device Package Mark (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.05mm 13

14 Material Structure Parts No. Name Description Materials 1 LEAD FRAME Metal Copper Alloy (Gold Plated) 2 Chip Source Blue LED GaN on Sapphire 3 Wire Metal Gold Wire 4 Encapsulation Silicone +Phosphor 5 Body PPA Heat-resistant Polymer 6 ESD Protection Device Si - 14

15 Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only. (4) Undefined tolerance is ±0.1mm. 15

16 Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) Time maintained above: - Temperature (TL) - Time (tl) 100 C 150 C seconds 183 C seconds 150 C 200 C seconds 217 C seconds Peak Temperature (Tp) Time within 5 C of actual Peak Temperature (tp) seconds seconds Ramp-down Rate 6 C/second max. 6 C/second max. Time 25 C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. 16

17 Emitter Tape & Reel Packaging Package Mark ±1.0 13± ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : Max 900pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape Adhesion strength to be N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape. (4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.

18 Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box 18

19 Product Nomenclature Table 4. Part Numbering System : X 1 X 2 X 3 X 4 X 5 X 6 X 7 X 8 X 9 Part Number Code Description Part Number Value X 1 Company S SSC X 2 Package Type T TOP LED X 3 X 4 Color R0 Red X 5 Package series G T6 Series X 6 Number of Chip 1 1 Chip X 7 Number of Pin 6 6 Pin X 8 X 9 Product Revision AB - Table 5. Lot Numbering System :Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Lot Number Code Description Lot Number Value Y 1 Y 2 Y 3 Y 4 Y 5 Y 6 Y 7 Y 8 Y 9 Y 10 Y 11 Y 12 Y 13 Y 14 Y 15 Y 16 Y 17 Year Month Day Top View LED series Mass order Internal Number 19

20 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 20

21 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5 to 30 and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 30 Humidity : less than RH60% b. If the package has been opened more than 1 year (MSL_2) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5 (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. We recommend to store the products in sealed container with a nitrogen atmosphere 21

22 Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) 22

23 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device 23

24 Company Information Published by Seoul Semiconductor 2013 All Rights Reserved. Company Information Seoul Semiconductor ( manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as npola, "Acrich", the world s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. 24