RoHS. Specification CUD8AF1A. Drawn Approval Approval. QP(P) (Rev.0)

Transcription

1 Specification RoHS CUD8AF1A SOC Customer Drawn Approval Approval 1

2 [ Contents ] 1. Description 2. Outline dimensions 3. Characteristics of CUD8AF1A 4. Characteristic diagrams 5. Binning & Labeling 6. Reel packing 7. Recommended solder pad 8. Reflow Soldering profile 9. Precaution for use 10. Revision history 2

3 Description CUD8AF1A CUD8AF1A is a deep ultraviolet light emitting diode with peak emission wavelengths from 270nm to 285nm. The LED is sealed in full aluminum packages with a choice of UV-transparent optical window. It incorporates state of the art SMD design and low thermal resistance. CUD8AF1A is designed for air and water sterilization and tools including chemical and biological analysis in that spectral range. CUD8AF1A Features Deep ultraviolet LED Low thermal resistance SMT solderable Lead Free product RoHS compliant Applications Disinfection Fluorescent spectroscopy Chemical and Biological analysis 3 Rev 00

4 Outline dimensions < Package Outline> TOP (Tolerance :±0.2, Unit : mm ) BOTTOM.. a b. b a Cathode Mark Electrical Isolation.. a b. SIDE < Circuit Diagram> Cathode 1 Anode 2 4

5 Characteristics of CUD8AF1A 1. CUD8AF1A (275nm) 1-1 Electro-Optical characteristics at 20mA (Ta=25, RH=30%) Parameter Symbol Value Unit Peak wavelength [1] λ p 275 nm Radiant Flux [2] Φ e [3] 1.6 mw Forward Voltage [4] V F 6.75 V Spectrum Half Width Δλ 10 nm View Angle 2Θ 1/2 135 deg. Thermal resistance Rθ J-s 30 ºC/W 1-2 Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current I F 30 ma Power Dissipation P D 200 mw Operating Temperature T opr -30 ~ +60 ºC Storage Temperature T stg -40 ~ +100 ºC Notes : 1. Peak Wavelength Measurement tolerance : ±3nm 2. Radiant Flux Measurement tolerance : ± 10% 3. Φ e is the Total Radiant Flux as measured with an integrated sphere. 4. Forward Voltage Measurement tolerance : ±3% 5

6 Characteristic Diagrams 1. Spectral Power Distribution Relative optical intensity [a.u.] (I F =20mA, T a =25, RH=30%) Wavelength [nm] 2. Forward current vs. Forward Voltage 60 (T a =25 ) 50 Forward current [ma] Forward Voltage [V] 6

7 3. Relative Radiant Flux vs. Forward Current Relative Radiant Flux [%] (T a =25 ) Forward Current [ma] 4. Peak Wavelength vs. Forward current 310 (T a =25 ) 300 Peak Wavelength [nm] Forward Current [ma] 7

8 5. Relative Radiant Flux vs. Ambient Temperature Relative Radiant Flux [%] (I F =20mA) Ambient Temperature [ ] 6. Peak Wavelength vs. Ambient Temperature 290 (I F =20mA) 285 Peak Wavelength [nm] Ambient Temperature [ ] 8

9 7. Forward Voltage vs. Ambient Temperature 6.8 (I F =20mA) Forward Voltage [V] Ambient Temperature [ ] 8. Radiant Pattern Relative optical intensity [a.u.] Vewing angle [deg.] 0 (I F =20mA)

10 Binning & Labeling 1. Binning Structure Y1Y2Y3Y4Y Peak Wavelength, T a =25 Y1Y2 Peak Wavelength I F =20mA MIN MAX C C Radiant Flux, T a =25 Y3Y4 Radiant Flux I F =20mA MIN MAX A A A A A A Forward Voltage, T a =25 Y5 Forward Voltage I F =20mA MIN MAX a b Notes : 1. Peak Wavelength Measurement tolerance : ±3nm 2. Radiant Flux Measurement tolerance : ± 10% 3. Forward Voltage Measurement tolerance : ±3% 10

11 Binning & Labeling 2. Label 3. SOC Part Number : X1X2X3X4X5X6X7X8 X 1 X2 X 3 X 4 X 5 X 6 X 7 X 8 Company Product Line Wavelength PKG Series Lens Type Chip 수 Ver SOC C UV U Deep 275 D8 AAP63 A Flat F 1 1 ver0 A 11

12 Reel Packaging CATHODE MARK ± ± ± 0.2 EIAJ-RRM 16 B ± 1 12

13 Recommended solder pad a b b a (Unit : mm ) Recommended PCB solder pad Recommended Stencil Pattern Notes : [1] Scale : none [2] This drawing without tolerances is for reference only 13

14 Reflow Soldering Profile Lead-free Solder 1~5 oc / sec. o 260 C Max. 10 sec. Max. 1~5 oc / sec. Pre-heating 150~200 o C 60sec. Max. Above 220 o C 120sec. Max. * Caution 1. Reflow soldering should not be done more than one time. 2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 3. When soldering, do not put stress on the LEDs during heating. 4. After soldering, do not warp the circuit board. 5. Recommend to use a convection type reflow machine with 7 ~ 8 zones. 6. Do not exceed seconds at maximum 280ºC 14

15 Precaution for use Storage To avoid moisture penetration, we recommend storing UV LEDs in a dry box with a desiccant. The recommended storage temperature range is 5 to 30 and a maximum humidity of 50%. Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Soldering should be done immediately after opening the package (within 24Hrs). b. Required conditions after opening the package - Sealing - Temperature : 5 ~ 40 Humidity : less than 30% c. If the package has been opened more than 4 weeks or the color of the desiccant changes, components should be dried for 10-12hr at 60±5 Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering. Components should not be mounted on warped (non coplanar) portion of PCB. Radioactive exposure is not considered for the products listed here in. This device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, IPA (Isopropyl Alcohol) should be used. When the LEDs are in operation the maximum current should be decided after measuring the package temperature. LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. The appearance and specifications of the product may be modified for improvement without notice. The slug is isolated from anode electrically. therefore, we recommend that you don t isolate the heat sink. Attaching LEDs, do not use adhesives that outgas organic vapor. 15

16 Handling of a UV-transparent optical window LEDs The UV LED is encapsulated with a UV-transparent optical window for the highest flux efficiency. Notes for handling: a. Avoid touching UV-transparent optical window parts especially with sharp tools such as Pincettes (Tweezers) b. Avoid leaving fingerprints on UV-transparent optical window parts. c. UV-transparent optical window will attract dust so use covered containers for storage. d. When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle. 16

17 Revision history No Change Date Change Issue Version Initial specification Rev 00 17