Detail Specification for Crystal Controlled Oscillators Based on Type VCXO

Transcription

1 Issue 1 April 2010 Detail Specification for Crystal Controlled Oscillators Based on Issue 1 Deutsches Zentrum für Luft- und Raumfahrt e.v. German Aerospace Center

2 Copyright 2005 German Aerospace Center - DLR. All rights reserved. Copyright in this document is owned by German Aerospace Center - DLR. Any person is hereby authorized to view, copy, print, and distribute this document subject to the following conditions: The document may be used for informational purposes only. The document may only be used for non-commercial, non-profit purposes. Any copy of this document thereof must include this Copyright notice. This document is provided "as is", and copyright holders make no warranties, including, but not limited to, warranties of merchantability, fitness for a particular purpose, non.infringement; that the contents of the document are suitable for any purpose; nor that the implementation of such contents will not infringe any third party patents, copyrights, trademarks or other rights. Copyright holders will not be liable for any direct, indirect, special or consequential damages arising out of any use of the document or the performance or implementation of the contents thereof. For permission requests, questions, or further information, please contact Dr. Andreas Jain - DLR - Quality and Product Assurance, +49 (2203)

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4 Detail Specification for Quartz Crystal Controlled Oscillators Based on Based on DLR Generic Specification DLR RF-PS-STD-007 KVG Quartz Crystal Technology GmbH D Neckarbischofsheim * Waibstadter Strasse 2-4 Tel: +49 (0) 7263 / * Fax: +49 (0) 7263 / 6196 * info@kvg-gmbh.de Handelsregister: Amtsgericht Mannheim Nr * Geschäftsführer: Manfred Klimm, Gerd Krauskopf website:

5 Change Record Issue Details of Change A Page 5

6 Table of Content 1 GENERAL SCOPE THE DLR/ESCC COMPONENT NUMBER AND SPECIFIC DETAIL INFORMATION The DLR/ESCC Component Number Specific Oscillator Detail Information PERFORMANCE CHARACTERISTICS MAXIMUM RATINGS PARAMETER DERATING INFORMATION PHYSICAL DIMENSIONS AND TERMINAL IDENTIFICATION DIL-14 Oscillator Case Flat Pack Oscillator Case FUNCTIONAL DIAGRAM PIN Assignment and Description HANDLING AND PRECAUTIONS APPLICABLE DOCUMENTS ESCC / DLR SPECIFICATIONS MIL STANDARDS & SPECIFICATIONS ORDER OF PRECEDENCE TERMS, DEFINITIONS, ABBREVIATIONS, SYMBOLS AND UNITS REQUIREMENTS GENERAL DEVIATIONS FROM THE GENERIC SPECIFICATION Deviations from the Screening Tests (Chart F3) Deviations from Qualification, Periodic Testing (Chart F4) or Lot Verification Tests ( Deviations from the Final Production Tests (Chart II), Burn-in and Electrical Measurements MECHANICAL REQUIREMENTS Dimension Check Weight Terminal Strength Internal Construction MARKING General Pin Identification MATERIALS AND FINISHES Case ELECTRICAL MEASUREMENTS Electrical Measurements at Room Temperature Electrical Measurements at High and Low Temperatures Circuits for Electrical Measurements PARAMETER DRIFT VALUES INTERMEDIATE AND END-POINT ELECTRICAL MEASUREMENTS Conditions for Burn-In Page 6

7 4.8.2 Conditions for Frequency Aging Conditions for Life Test RADIATION TESTING Total Dose Irradiation Testing Heavy Ions/ Proton Test Electrical Measurements for Radiation Testing PROCUREMENT AND CONTROL OF ADD-ON ELEMENTS Add-on Elements List PAD Sheet Generation for Add-on Elements Page 7

8 1 GENERAL 1.1 SCOPE This specification details the ratings, physical and electrical characteristics, tests and inspection data for the oscillator type variants and/or the range of oscillators specified below. It supplements the requirements of, and shall be read in conjunction with, the DLR Generic Specification listed under applicable documents. 1.2 THE DLR/ESCC COMPONENT NUMBER AND SPECIFIC DETAIL INFORMATION The DLR/ESCC Component Number The DLR/ESCC component number shall be constituted as follows: Example xxxxxxxxxxxxxxxxx detail specification reference: specific oscillator identification number: SVCXO-XXXX (as required) Oscillator classification 01 (as applicable) total dose radiation level letter: R (as required) Specific Oscillator Detail Information The specific performance characteristics shall be agreed between the manufacturer and the orderer and shall be specified in the corresponding tables: Table 1(A) Format for Individual Tables 1(A) and Table 1(B) Format for Individual Tables 1(B) of the individual Specific Oscillator Detail Information (SODI). The content of the individual tables shall relate to the design parameters of individual crystal oscillator units optimised for the intended application. The agreed table shall be held under configuration control by the manufacturer who will allocate a specific oscillator identification number sequentially when a request for a crystal oscillator is received. The terminal material and finish shall be in accordance with the requirements of the ESCC Basic Specification no , type D-2-b. The total dose level letter shall be as defined in the ESCC Basic Specification no If an alternative radiation test level is specified in the Purchase Order the letter shall be changed accordingly. Page 8

9 1.3 PERFORMANCE CHARACTERISTICS TABLE 1(A) FORMAT FOR INDIVIDUAL TABLES 1(A) SPECIFIC OSCILLATOR IDENTIFICATION NUMBER:. Characteristic Symbol Min Max Unit Conditions 1 Nominal output frequency f 0 MHz 2 Overall accuracy Δf/f 0 1(A) ppm Note 1 3 Initial frequency tolerance Δf/f 0 1(A) ppm T A = +25 C; Note 5 4 Frequency stability vs. temperature Δf/f 1(A) ppm Within T OP 5 Operating temperature range T OP 1(A) C 6 Functional temperature range T FU 1(A) C 7 Frequency control range Δf 1(A) 1(A) ppm Note 2 8 Control voltage range V C 1(A) 1(A) V 9 Transfer function Δf/V C 1(A) Either pos. or neg. 10 Linearity 1(A) % IEC ; Output waveform SQUARE WAVE (LV)HCMOS 12 Output voltage LOW V OL 1(A) V V DC = 1(A) 13 Output voltage HIGH V OH 1(A) V V DC = 1(A) 14 Duty cycle t H /t L 1(A) 1(A) % 15 Rise time t r 1(A) ns 10% to 90% 16 Fall time t f 1(A) ns 90% to 10% 17 Output load Z L 1(A) 1(A) pf Note 7; Z Lnom = 1(A) 18 Frequency stability vs. load changes Δf/f 1(A) ppm Nominal load ±10% Note 2 19 Start-up time t s 1(A) ms 20 Supply voltage V DC 1(A) 1(A) V V DCnom = 1(A) 21 Frequency stability vs. supply voltage changes Δf/f 1(A) ppm V DC ±5% 22 Supply current I DC 1(A) ma with nominal load; Note 2 23 Long term stability (Aging) 30 days Δf/f 1(A) ppm T A = +70 C ; Note 4 24 Long term stability (Aging) 1st year Δf/f 1(A) ppm T A = +70 C ; Note 5 25 Long term stability (Aging) 18 years Δf/f 1(A) ppm T A = +70 C ; Note 5, Note 6 26 Case type 1(A) either DIL-14 or Flat Pack 27 Weight 1(A) g 28 Dimensions mm Note 8 Page 9

10 1. including initial tolerance, frequency stability vs. temperature, vs. supply voltage changes, vs. load changes and 18 years aging 2. see table 1(A): SPECIFIC OSCILLATOR DETAILED INFORMATION pre-aging as performed during screening tests 5. after burn-in 240 h at T max and after 30 days aging acc. to 8.23 Gen. Spec years operating; 3 years storage 7. rise and fall time and supply current as drawn in table 1(A) are referred to the nominal load capacity of 15 pf//1 kohm. For higher load capacities and depending on frequency rise and fall time and supply current may deviate (increase) from the figures of table 1(A) Page 10

11 1.4 MAXIMUM RATINGS The maximum ratings shall not be exceeded at any time during usage or storage. Functional performance for extended periods at the maximum ratings may adversely affect the reliability. Maximum ratings shall only be exceeded during testing to the extent specified in this specification and when stipulated in the test methods and procedures of the ESCC specifications. TABLE 1(B) FORMAT FOR INDIVIDUAL TABLES 1(B) No. Characteristics Symbols Maximum Units Remarks Ratings 1 Maximum Input Voltage V DC 1(B) V Note 1, Note 2 2 Load C L 50 pf 3 Functional Temperature Range T op 1(B) C See tables 1(A) 4 Storage Temperature Range T stg -55 / +125 C 5 Soldering Temperature Range T sol 1(B) C Note 3 Notes to table 1(B): 1. Table 1(B) of Specific Oscillator Detail Information (SODI) 2. Overshoot survivability in accordance with MIL-PRF-. Recommended Operating Condition: V DC = V DCnom 5% performance parameter specified and V DC = V DCnom 3. Duration 10 sec. Maximum. Page 11

12 1.5 PARAMETER DERATING INFORMATION 1.6 PHYSICAL DIMENSIONS AND TERMINAL IDENTIFICATION DIL-14 Oscillator Case PIN OUT 1 V C - Control Voltage 7 GND - Ground (Case) 8 RF OUT - Output Frequency 14 V CC - Supply Voltage Figure 1: Physical Dimensions 4-pin DIL-14 package Symbols Dimensions mm Min Max A B C D E F G Notes 1. For all dimensions a nominal value is expected to be in the middle of min-max range Flat Pack Oscillator Case Page 12

13 PIN OUT 1: V C - Control Voltage 10: GND - Ground (Case) 11: RF OUT - Output Frequency 13: V CC - Supply Voltage Figure 2: Physical Dimensions Flat Pack package Symbols Dimensions mm Min Max A B C D E F G H Notes 2. For all dimensions a nominal value is expected to be in the middle of min-max range. Page 13

14 1.7 FUNCTIONAL DIAGRAM 2 (13): V CC 1 (1): V C Oscillator HCMOS Output Buffer 8 (11): RF Output 7 (10): GND Figure 3: Functional Diagram PIN Assignment and Description 1. Pin No. Pin No. Description DIL-14 Flat Pack 2 13 Voltage Supply V CC 7 10 Ground (Case) 8 11 RF Output 1 1 Frequency Control Voltage V C 2 to 9, 12, 14 to 20 Not Connected 1.8 HANDLING AND PRECAUTIONS These devices contain elements which are susceptible to damage by electrostatic discharge. Therefore suitable precautions shall be employed during all phases of manufacture, testing, packaging, shipment and any handling. These components are categorised as Class 1 per ESCC Basic Specification no with a minimum critical path failure of xxx Volts. Page 14

15 2 APPLICABLE DOCUMENTS The following documents form part of, and shall be read in conjunction with, this specification. The relevant issues shall be those in effect on date of starting qualification or placing the purchase order. 2.1 ESCC / DLR SPECIFICATIONS - No Requirements for the Qualification of Standard Electronic Components for Space Application. - No Internal Visual Inspection. - No External Visual Inspection - No Preservation, Packaging and Dispatch of ESCC Electronic Components. - No Radiographic Inspection of Electronic Components - No Terms, Definitions, Abbreviations, Symbols and Units. - No Scanning Electron Microscope Inspection of Semiconductor Dice. - No General Requirements for the Marking of ESCC Components. - No Requirements and Guidelines for the Process Identification Document (PID) - No ESCC Non-conformance Control System. - No Total Dose Steady-State Irradiation Test Method. - No Lead Materials and Finishes for Components for Space Application. - No Requirements for the Capability Approval of Electronic Component Technologies for Space Application - No Resistance to Solvents of Marking, Materials and Finishes. - No ESCC Basic Specification, Single Event Effects Test Methods - No. 2433XX ESCC Basic Specification, Requirements for the Capability Approval of Standard Oscillators DLR-RF-PS-STD-007: Generic Specification for Crystal Controlled Oscillators - ECSS-Q-60 Space Product Assurance Standard for EEE parts - ECSS-Q-60A Electrical, Electronic and Electromechanical (EEE) Components - ECSS-Q Data for Selection of Space Materials and Processes 2.2 MIL STANDARDS & SPECIFICATIONS - MIL-PRF- General Specification for Crystal Controlled Oscillators - MIL-STD-883 Test Methods and Procedures for Microelectronics - MIL-STD-202 Test Methods for Electronic and Electrical Components Parts 2.3 ORDER OF PRECEDENCE For the purpose of interpretation and in case of conflict with regard to documentation, the following order of precedence shall apply: (a) This detail specification (b) Generic specification DLR-RF-PS-STD-007 (c) ESCC and ECSS specifications (d) Other referenced specification Page 15

16 3 TERMS, DEFINITIONS, ABBREVIATIONS, SYMBOLS AND UNITS For the purpose of this specification the terms, definitions, abbreviations, symbols and units specified in the ESCC specification no shall apply. In addition following definitions apply: f C f n V DC I DC V OL V OH V OUT t L t H t r t f t su R L C L Z L T amb T sol EM EVM FM FCSI NC centre frequency (actual) nominal frequency (specified) supply voltage supply current Output voltage LOW Output voltage HIGH Output voltage LOW time HIGH time rise time fall time start-up time Load resistance Load capacity Load impedance Ambient Temperature Soldering Temperature Engineering Model Engineering Verification Model Flight Model Final Customer Source Inspection not connected Page 16

17 4 REQUIREMENTS 4.1 GENERAL The complete requirements of the components specified herein are as stated in this specification and the applicable DLR Generic Specification. Permitted deviations from the Generic Specification, applicable to this specification only, are as listed below. Permitted deviations from the Generic Specification and this Detail Specification, formally agreed with the specific manufacturer on the basis that the alternative requirements are equivalent to the DLR requirement and do not affect the component s reliability, are listed in the appendices attached to this specification. 4.2 DEVIATIONS FROM THE GENERIC SPECIFICATION Deviations from the Screening Tests (Chart F3) Deviations from Qualification, Periodic Testing (Chart F4) or Lot Verification Tests ( Deviations from the Final Production Tests (Chart II), Burn-in and Electrical Measurements 4.3 MECHANICAL REQUIREMENTS Dimension Check The dimensions of the oscillator specified herein shall be checked. They shall conform to those shown in Figure 1 resp Weight The maximum weight of the oscillator specified herein shall be as defined in table1(c) Terminal Strength The requirements for terminal strength testing are specified in IEC test Ua1 test condition A. The test conditions shall be as follows: Test Condition: A Applied Force: 5 Newton Duration: 5 second Internal Construction The oscillator is built using a thickfilm ceramic (Al2O3) hybrid assembled with die and wire-bonded semiconductors and epoxy adhesived passive components. The crystal blank is directly attached to the Kovar holder mounted on the ceramic substrate. Page 17

18 4.4 MARKING General The marking shall be in accordance with the requirements of ESCC Basic Specification no and as follows. The information to be marked on the component shall be: (a) Terminal Identification (b) The DLR qualified components symbol (for DLR qualified components only) (c) Traceability Information (seriel number) (d) Traceability Information (e) Nominal Frequency Pin Identification Pin identification shall be in accordance to Figure 1 and MATERIALS AND FINISHES The components, materials and finishes shall be as specified. Where a definite material is not specified, a material which will enable the oscillators specified herein to meet the performance requirements of this specification shall be used. Acceptance or approval of any constituent material shall not guarantee acceptance of the finished product Case Metals used for leads and cases shall be corrosion resistive type or shall be plated to resist corrosion. The use of dissimilar materials shall be in accordance with ESA/PSS , Para The use of toxic materials shall be avoided where possible. Where the use is inevitable, the manufacturer shall clearly identify the material and the location in the unit by a label on the individual package Cap DIP package: The material shall be steal with plating of electrolytic NiAu with 1.8 µm < Ni < 5.7 µm and 1.3 µm < Au < 5.7 µm according to MIL-PRF , and Flat Pack: The material shall be KOVAR with plating of chemical NiAu with 3.5 µm < Ni < 7.5 µm and 1.0 µm < Au < 5.7 µm according to MIL-PRF , and Base DIP package: The material shall be steal with plating of electrolytic NiAu with 1.8 µm < Ni < 5.7 µm and 1.3 µm < Au < 5.7 µm according to MIL-PRF , and Flat Pack: The material shall be KOVAR with plating of chemical NiAu with 3.5 µm < Ni < 7.5 µm and 1.0 µm < Au < 5.7 µm according to MIL-PRF , and Leads The lead material shall be Type D 2 - b in accordance with the requirements of ESCC Basic Specification No Page 18

19 4.6 ELECTRICAL MEASUREMENTS Electrical measurements shall be performed at room, high and low temperatures Electrical Measurements at Room Temperature The measurements shall be performed at T amb =+22 ± 3 C; V DC = +5.0 V Limits Characteristics Symbol Test Method Test Conditions Min Max Units Initial Frequency Accuracy (f n - f c ) /f n MIL-PRF- Frequency Control Range Δf C /f n MIL-PRF- Frequency Stability versus Power Supply changes Frequency Stability versus Load Changes Δf/f n P Δf/f n L MIL-PRF- MIL-PRF- Power Supply Voltage V DC MIL-PRF- Power Supply Current I DC MIL-PRF- Output Signal V OUT MIL-PRF- Output Level HIGH V OH MIL-PRF- Output Level LOW V OL MIL-PRF- Duty cycle t H /t L MIL-PRF- Rise and Fall Time t R /t F MIL-PRF- Start-up Time t SU +25 C ppm V C = +0.5 V to +4.5 V 1(A) ppm V DC ± 5% ppm load 15 pf ± 5 pf ppm V HCMOS/ (ACMOS) acc. to 1(A) load: 15 pf // 1 kohm +4.5 V load: 15 pf // 1 kohm +0.5 V measured ref. to V CC / % 10% / 90% of output level Table 2: Electrical Measurements at Reference Temperature 1. life time is 18 years (15 years operation + 3 years storage) 2. Frequency ranges for different resonator modes: Fundamental mode: 10 MHz < f < 30 MHz 1(A) ma ns 20 ms Page 19

20 4.6.2 Electrical Measurements at High and Low Temperatures The measurements shall be performed over the temperature range T amb = -55 C (-5 +0 C) and T amb =+105 C (-0 +5 C) The characteristics, test methods, conditions and limits shall be the same as specified for the Room Temperature Measurements. Characteristics Symbol Test Method Test condition Frequency Stability versus Temperature Range - over T funct Δf/f n Tamb MIL-PRF- Power Supply Current I S MIL-PRF- Frequency Stability versus Power Supply changes Δf/ f n P MIL-PRF- Output Level HIGH V OH MIL-PRF- Output Level LOW V OL MIL-PRF- Duty cycle t H / t L MIL-PRF- Rise and Fall Time t R / t F MIL-PRF- Start-up Time t SU MIL-PRF Circuits for Electrical Measurements V DC = +5 V; T op = 55 C / +105 C V DC = +5 V; T op = 55 C / +105 C Limits Min Max table table 1(A) 1(A) table 1(A) Unit ppm ma V DC ± 5% -5 5 ppm load: 15 pf // 1 kohm 4.5 V load: 15 pf // 1 kohm 0.5 V measured ref. to V DC / % 10%/90% of output level 1(A) ns 20 ms Circuits for use in performing the electrical measurements as specified in Tables 2, 3 and 4 are shown in Figure 4. +V C +Vs O A V C Oscillator 1V S V OUT 975 Ohm O Oscilloscope RE = 50 Ohm O Counter GND 15 pf GND O V 50 Ohm Figure 4: Circuits for Electrical Measurements Page 20

21 4.7 PARAMETER DRIFT VALUES Unless otherwise specified, the measurements shall be performed at T amb =+22 ±3 C. The measurement after burn-in shall be performed at the same temperature T amb ±1 C as measured before burn-in to grant reproducibility. The test methods and test conditions shall be as per corresponding test defined in the Room Temperature Measurements. The drift values (Δ) shall not be exceeded for each characteristic specified. The corresponding absolute limit shall not be exceeded. Characteristics Symbol Test Method Frequency Accuracy Δf t / f n MIL-PRF- Power Supply Current I DC MIL-PRF- Test Conditions Limits Units Drift Absolute Value Δ Min Max ± ppm ±10% table 1(A) Table 4 (A): Parameter Drift Values for Burn-in 1. Measurement before and after burn-in acc. to Generic Specification DLR-RF-PS-STD-007, paragraph 8.20? ma Characteristics Symbol Test Method Test Conditions Frequency Accuracy Δf t / f n MIL-PRF- Power Supply Current I DC MIL-PRF- Limits Units Drift Absolute Value Δ Min Max ± ppm ±10% table 1(A) Table 4 (B): Parameter Drift Values for Frequency Ageing 1. Measurement before and after Frequency ageing acc. to Generic Specification DLR-RF-PS- STD-007, paragraph ma Characteristics Symbol Test Method Test Conditions Frequency Accuracy Δf t / f n MIL-PRF- Frequency Accuracy Δf t / f n MIL-PRF- Power Supply Current I DC MIL-PRF- acc. to table 5 (C) after 1000 h Table 4 (C): Parameter Drift Values for Operating Life Test Limits Units Drift Absolute Value Δ Min Max ± ppm after 2000 h ± ppm ±10% table 1(A) 1. Measurement before and after burn-in acc. to Generic Specification DLR-RF-PS-STD-007, paragraph ma Page 21

22 4.8 INTERMEDIATE AND END-POINT ELECTRICAL MEASUREMENTS Unless otherwise specified, the electrical measurements shall be performed at T amb =+22 ± 3 C. The characteristics, test methods, conditions and limits shall be the same as specified for the Room Temperature Measurements Conditions for Burn-In Characteristics Symbol Test Condition Unit Ambient Temperature T amb 105 (+0/-2) C Supply Voltage V DC 5.0 V Load C L 15 pf Load R L 1000 Time T 240 hrs Table 5 (A): Conditions for Burn-in Conditions for Frequency Aging Characteristics Symbol Test Condition Unit Ambient Temperature T amb 70 (+0/-2) C Supply Voltage V DC 5.0 V Load C L 15 pf Load R L 1000 Time T a 720 hrs Table 5 (B): Conditions for Frequency Aging Conditions for Life Test Characteristics Symbol Test Condition Unit Ambient Temperature T amb 105 (+0/-2) C Supply Voltage V DC 5.0 V Load C L 15 pf Load R L 1000 Time T 2000 hrs Table 5 (C): Conditions for Operating Life Test 1. Page 22

23 4.9 RADIATION TESTING Total Dose Irradiation Testing Bias Conditions and Total Dose Level for Total Dose Radiation Testing In the case the total dose level cannot be demonstrated by analysis, irradiation testing shall be performed as to the level needed for the specific application and indicated by the total dose level letter in the DLR component type number. The following bias conditions shall be applied during irradiation testing: Characteristics Symbol Test Condition Unit Supply Voltage V DC 5 V Output Load Z L 1 kohm // 15 pf Ambient Temperature T amb +22 ±3 C 1. Table 6: Conditions for Irradiation Testing Heavy Ions/ Proton Test If identified by the Buyer, the effect of heavy ions to the performance of the oscillator shall be analysed or tested. Detailed requirements shall be defined in a RVT (radiation verification test) plan Electrical Measurements for Radiation Testing Prior to and on completion of radiation testing the components shall have successfully meet the the Room Temperature Measurements specified herein. Characteristics Symbol Test Method Test Conditions Frequency Accuracy Δf t / f n MIL-PRF- Power Supply Current I DC MIL-PRF- Table 4 (D): Parameter Drift Values for Irradiation testing 1. Measurement before and after Irradiation Limits Units Drift Absolute Value Δ Min Max ± ppm ±10% table 1(A) ma Page 23

24 4.10 PROCUREMENT AND CONTROL OF ADD-ON ELEMENTS Add-on Elements List Unless otherwise identified in the relevant PAD sheet of the element, the following list references the procurement level and procurement specifications of add-on elements. The list may contain more elements as being used in the specific oscillator. Part Type Manufacturer Quality Level Integrated Circuit Chip 54HCU04 DIE Integrated Circuit Chip 54ACU00 DIE Ceramic capacitor 0805 Inductor MPCI Series Hybrid board Transistor 2N2369A DIE Tuning Varactor Chip MA4ST081 DIE Procurement Specifications Radiation Test Level Letter 1) STMicroelectronic B t.b.a. R STMicroelectronic B TESAT Detail Specification RA R Eurofarad B ESCC Detail Specification No. Note 1 AVX 3009/003 01B MICROSPIRE B ESCC Detail Specification No. Note /008 01B RHe B PS.KVG.XXXX.YYY Note 1 Microsystems STM/TESAT B TESAT Detail Specification R RA MACOM B TESAT Detail Specification n.a. for XOs RA Table 7: Add-on Elements List 1. not applicable for add-on elements insensitive to radiation PAD Sheet Generation for Add-on Elements For approval of add-on elements for a specific oscillator to be procured, PAD sheets in accordance with ECSS-Q-60 shall be generated for a specific type of oscillator specified herein and shall be submitted to the Buyer. Page 24