1Gb C-die DDR3 SDRAM Specification

Transcription

1 1Gb Cdie DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. * Samsung Electronics reserves the right to change products or specification without notice. Page 1 of 63 Rev. 1.0 June 2007

2 Revision History Revision Month Year History 0.0 January 2007 Revision 0.0 release 0.1 June 2007 Deleted 800Mbps 555 speed Timing Parameters by Speed Grade (13.0) Input/Output Capacitance (11.0) 1.0 June 2007 Revision 1.0 specification release. Page 2 of 63 Rev. 1.0 June 2007

3 Table Contents 1.0 Ordering Information Key Features Package pinout/mechanical Dimension & Addressing x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) FBGA Package Dimension (x4) FBGA Package Dimension (x8) FBGA Package Dimension (x16) Input/Output Functional Description DDR3 SDRAM Addressing Absolute Maximum Ratings Absolute Maximum DC Ratings DRAM Component Operating Temperature Range AC & DC Operating Conditions Recommended DC operating Conditions (SSTL_1.5) AC & DC Input Measurement Levels AC and DC Logic input levels for singleended signals Differential swing requirement for differntial signals Singleended requirements for differential signals AC and DC logic input levels for Differential Signals Differential Input Cross Point Voltage Slew rate definition for Single Ended Input Signals Input Slew Rate for Input Setup Time (tis) and Data Setup Time (tds) Input Slew Rate for Input Hold Time (tih) and Data Hold Time (tdh) Slew rate definition for Differential Input Signals AC and DC Output Measurement Levels Single Ended AC and DC Output Levels Differential AC and DC Output Levels Single Ended Output Slew Rate Differential Output Slew Rate Reference Load for AC Timing and Output Slew Rate Overshoot/Undershoot Specification Address and Control Overshoot and Undershoot specifications Clock, Data, Strobe and Mask Overshoot and Undershoot specifications ohm Output Driver DC Electrical Characteristics Output Drive Temperature and Voltage sensitivity OnDie Termination (ODT) Levels and IV Characteristics ODT DC electrical characteristics ODT Temperature and Voltage sensitivity ODT Timing Definitions Test Load for ODT Timings ODT Timing Definition Idd Specification Parameters and Test Conditions IDD Measurement Conditions IDD Specifications Input/Output Capacitance Electrical Characteristics and AC timing for DDR3800 to DDR Clock specification Clock Jitter Specification Refresh Parameters by Device Density Standard Speed Bins Timing Parameters by Speed Grade Page 3 of 63 Rev. 1.0 June 2007

4 1.0 Ordering Information [ Table 1 ] Samsung DDR3 ordering information table Organization DDR3800 (666) DDR31066 (777/888) DDR31333 (888/999) Package 256Mx4 K4B1G0446CZCF7 K4B1G0446CCF8/G8 K4B1G0446CZCG9/H9 94 FBGA 128Mx8 K4B1G0846CZCF7 K4B1G0846CCF8/G8 K4B1G0846CZCG9/H9 94 FBGA 64Mx16 K4B1G1646CZCF7 K4B1G1646CCF8/G8 K4B1G1646CZCG9/H9 112 FBGA Note : 1. Speed bin is in order of CLtRCDtRP. 2. x4/x8/x16 Package including 16 support balls 2.0 Key Features [ Table 2 ] 1Gb DDR3 Cdie Speed bins Speed DDR3800 DDR31066 DDR Unit tck(min) ns CAS Latency tck trcd(min) ns trp(min) ns tras(min) ns trc(min) ns JEDEC standard 1.5V ± 0.075V Power Supply VDDQ = 1.5V ± 0.075V 400 MHz f CK for 800Mb/sec/pin, 533MHz f CK for 1066Mb/sec/pin, 667MHz f CK for 1333Mb/sec/pin 8 Banks Posted CAS Programmable CAS Latency: 5, 6, 7, 8, 9, 10, (11 for high density only) Programmable Additive Latency: 0, CL2 or CL1 clock Programmable CAS Write Latency (CWL) = 5 (DDR3800), 6 (DDR31066), 7 (DDR31333) 8bit prefetch Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tccd = 4 which does not allow seamless read or write [either On the fly using A12 or MRS] Bidirectional Differential DataStrobe Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) On Die Termination using ODT pin Average Refresh Period 7.8us at lower than T CASE 85 C, 3.9us at 85 C < T CASE < 95 C Asynchronous Reset Package : 94 balls FBGA x4/x8 (with 16 support balls) 112 balls FBGA x16 (with 16 support balls) All of Leadfree products are compliant for RoHS The Cdie is organized as a 32Mbit x 4/16Mbit x 8/ 8Mbit x 16 I/Os x 8banks device. This synchronous device achieves high speed doubledatarate transfer rates of up to 1333Mb/sec/pin (DDR3 1333) for general applications. The chip is designed to comply with the following key DDR3 SDRAM features such as posted CAS, Programmable CWL, Internal (Self) Calibration, On Die Termination using ODT pin and Asynchronous Reset. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the crosspoint of differential clocks (CK rising and CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and DQS) in a source synchronous fashion. The address bus is used to convey row, column, and bank address information in a RAS/CAS multiplexing style. The DDR3 device operates with a single 1.5V ± 0.075V power supply and 1.5V ± 0.075V VDDQ. The 1Gb DDR3 device is available in 94ball FBGAs(x4/x8) and 112ball FBGA(x16) Note : 1. The functionality described and the timing specifications included in this data sheet are for the DLL Enabled mode of operation Mbps CL7 doesn t have backward compatibility with 800Mbps CL5 Note : This data sheet is an abstract of full DDR3 specification and does not cover the common features which are described in DDR3 SDRAM Device Operation & Timing Diagram. Page 4 of 63 Rev. 1.0 June 2007

5 3.0 Package pinout/mechanical Dimension & Addressing 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) A NC NC NC NC NC NC B C D NC VSS VDD NC NC VSS VDD NC D E VSS VSSQ DQ0 DM VSSQ VDDQ E F VDDQ DQ2 DQS DQ1 DQ3 VSSQ F G VSSQ NC DQS VDD VSS VSSQ G H VREFDQ VDDQ NC NC NC VDDQ H J NC VSS RAS CK VSS NC J K ODT VDD CAS CK VDD CKE K L NC CS WE A10/AP ZQ NC L M VSS BA0 BA2 A15 VREFCA VSS M N VDD A3 A0 A12/BC BA1 VDD N P VSS A5 A2 A1 A4 VSS P R VDD A7 A9 A11 A6 VDD R T NC VSS RESET A13 NC A8 VSS NC T U V W NC NC NC NC NC NC Note1: A1,A2,A4,A8,A10,A11,D1,D11,T1,T11,W1,W2,W4,W8,W10 and W11 balls indicate mechanical support balls with no internal connection Ball Locations (x4) A B C Populated ball Ball not populated D E F G Top view (See the balls through the Package) H J K L M N P R T U V W Page 5 of 63 Rev. 1.0 June 2007

6 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) A NC NC NC NC NC NC B C D NC VSS VDD NC NU/TDQS VSS VDD NC D E VSS VSSQ DQ0 DM/TDQS VSSQ VDDQ E F VDDQ DQ2 DQS DQ1 DQ3 VSSQ F G VSSQ DQ6 DQS VDD VSS VSSQ G H VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ H J NC VSS RAS CK VSS NC J K ODT VDD CAS CK VDD CKE K L NC CS WE A10/AP ZQ NC L M VSS BA0 BA2 NC VREFCA VSS M N VDD A3 A0 A12/BC BA1 VDD N P VSS A5 A2 A1 A4 VSS P R VDD A7 A9 A11 A6 VDD R T NC VSS RESET A13 NC A8 VSS NC T U V W NC NC NC NC NC NC Note1: A1,A2,A4,A8,A10,A11,D1,D11,T1,T11,W1,W2,W4,W8,W10 and W11 balls indicate mechanical support balls with no internal connection Ball Locations (x8) A B C Populated ball Ball not populated D E F G Top view (See the balls through the Package) H J K L M N P R T U V W Page 6 of 63 Rev. 1.0 June 2007

7 3.3 x16 Package Pinout (Top view) : 112ball FBGA Package(96balls + 16 balls of support balls) A NC NC NC NC NC NC B C D NC VDDQ DQU5 DQU7 DQU4 VDDQ VSS NC D E VSSQ VDD VSS DQSU DQU6 VSSQ E F VDDQ DQU3 DQU1 DQSU DQU2 VDDQ F G VSSQ VDDQ DMU DQU0 VSSQ VDD G H VSS VSSQ DQL0 DML VSSQ VDDQ H J VDDQ DQL2 DQSL DQL1 DQL3 VSSQ J K VSSQ DQL6 DQSL VDD VSS VSSQ K L VREFDQ VDDQ DQL4 DQL7 DQL5 VDDQ L M NC VSS RAS CK VSS NC M N ODT VDD CAS CK VDD CKE N P NC CS WE A10/AP ZQ NC P R VSS BA0 BA2 A15 VREFCA VSS R T VDD A3 A0 A12/BC BA1 VDD T U VSS A5 A2 A1 A4 VSS U V VDD A7 A9 A11 A6 VDD V W NC VSS RESET A13 NC A8 VSS NC W Y AA AB NC NC NC NC NC NC Note1: A1,A2,A4,A8,A10,A11,D1,D11,W1,W11,AB1,AB2,AB4,AB8,AB10 and AB11 balls indicate mechanical support balls with no internal connection Ball Locations (x16) Populated ball Ball not populated Top view (See the balls through the Package) A B C D E F G H J K L M N P R T U V W Y AA AB Page 7 of 63 Rev. 1.0 June 2007

8 3.4 FBGA Package Dimension (x4) ± x 10 = 8.00 A #A1 INDEX MARK B (Datum A) (Datum B) A B C D E F G H J K L M N P R T U V W x 18 = Solder ball 0.2 M A B MOLDING AREA #A ± ± ± MAX ± 0.10 BOTTOM VIEW 0.35 ± 0.05 TOP VIEW 1.10 ± 0.10 Page 8 of 63 Rev. 1.0 June 2007

9 3.5 FBGA Package Dimension (x8) ± x 10 = A #A1 INDEX MARK B (Datum A) (Datum B) A B C D E F G H J K L M N P R T U V W Solder ball 0.2 M A B BOTTOM VIEW MOLDING AREA #A ± ± ± MAX 0.80 x 18 = ± ± 0.05 TOP VIEW 1.10 ± 0.10 Page 9 of 63 Rev. 1.0 June 2007

10 3.6 FBGA Package Dimension (x16) (Datum A) A B C D E F G (Datum B) H J K L M N P R T U V W Y AA AB ± x 10 = A #A1 INDEX MARK B x 21 = ± 0.10 MOLDING AREA Solder ball 0.2 M A B BOTTOM VIEW #A ± MAX ± ± ± 0.05 TOP VIEW 1.10 ± 0.10 Page 10 of 63 Rev. 1.0 June 2007

11 4.0 Input/Output Functional Description [ Table 3 ] Input/Output function description Symbol Type Function CK, CK CKE CS Input Input Input Clock: CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge PowerDown and Self Refresh operation (all banks idle), or Active PowerDown (Row Active in any bank). CKE is asynchronous for self refresh exit. After VREFCA has become stable during the power on and initialization sequence, it must be maintained during all operations (including Self Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK, ODT and CKE are disabled during powerdown. Input buffers, excluding CKE, are disabled during Self Refresh. Chip Select: All commands are masked when CS is registered HIGH. CS provides for external Rank selection on systems with multiple Ranks. CS is considered part of the command code. ODT Input On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS, NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 configurations. The ODT pin will be ignored if the Mode Register (MR1) is programmed to disable ODT. RAS, CAS, WE Input Command Inputs: RAS, CAS and WE (along with CS) define the command being entered. DM (DMU), (DML) Input Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by Mode Register A11 setting in MR1. BA0 BA2 Input Bank Address Inputs: BA0 BA2 define to which bank an Active, Read, Write or Precharge command is being applied. Bank address also determines if the mode register or extended mode register is to be accessed during a MRS cycle. A0 A12 Input Address Inputs: Provided the row address for Active commands and the column address for Read/Write commands to select one location out of the memory array in the respective bank. (A10/AP and A12/BC have additional functions, see below) The address inputs also provide the opcode during Mode Register Set commands. A10 / AP Input Autoprecharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH:Autoprecharge; LOW: No Autoprecharge) A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). if only one bank is to be precharged, the bank is selected by bank addresses. A12 / BC Input Burst Chop:A12 is sampled during Read and Write commands to determine if burst chop(onthefly) will be performed. (HIGH : no burst chop, LOW : burst chopped). See command truth table for details RESET Input Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when RESET is HIGH. RESET must be HIGH during normal operation. RESET is a CMOS rail to rail signal with DC high and low at 80% and 20% of VDD, i.e. 1.20V for DC high and 0.30V for DC low. DQ Input/Output Data Input/ Output: Bidirectional data bus. DQS, (DQS) Input/Output Data Strobe: output with read data, input with write data. Edgealigned with read data, centered in write data. TDQS, (TDQS) Output Termination Data Strobe: TDQS/TDQS is applicable for X8 DRAMs only. When enabled via Mode Register A11=1 in MR1, DRAM will enable the same termination resistance function on TDQS/TDQS that is applied to DQS/DQS. When disabled via mode register A11=0 in MR1, DM/TDQS will provide the data mask function and TDQS is not used. NC No Connect: No internal electrical connection is present. V DDQ Supply DQ Power Supply: 1.5V +/ 0.075V V SSQ Supply DQ Ground V DD Supply Power Supply: 1.5V +/ 0.075V V SS Supply Ground V REFDQ Supply Reference voltage for DQ V REFCA Supply Reference voltage for CA ZQ Supply Reference Pin for ZQ calibration Note : Input only pins (BA0BA2, A0A12, RAS, CAS, WE, CS, CKE, ODT and RESET) do not supply termination. Page 11 of 63 Rev. 1.0 June 2007

12 5.0 DDR3 SDRAM Addressing 512Mb Configuration 128Mb x4 64Mb x 8 32Mb x16 # of Bank Bank Address BA0 BA2 BA0 BA2 BA0 BA2 Auto precharge A10/AP A10/AP A10/AP Row Address A0 A12 A0 A12 A0 A11 Column Address A0 A9,A11 A0 A9 A0 A9 BC switch on the fly A12/BC A12/BC A12/BC Page size *1 1 KB 1 KB 2 KB * Reference Information : The following tables are address mapping information for other densitites 1Gb Configuration 256Mb x4 128Mb x 8 64Mb x16 # of Bank Bank Address BA0 BA2 BA0 BA2 BA0 BA2 Auto precharge A10/AP A10/AP A10/AP Row Address A0 A13 A0 A13 A0 A12 Column Address A0 A9,A11 A0 A9 A0 A9 BC switch on the fly A12/BC A12/BC A12/BC Page size *1 1 KB 1 KB 2 KB 2Gb Configuration 512Mb x4 256Mb x 8 128Mb x16 # of Bank Bank Address BA0 BA2 BA0 BA2 BA0 BA2 Auto precharge A10/AP A10/AP A10/AP Row Address A0 A14 A0 A14 A0 A13 Column Address A0 A9,A11 A0 A9 A0 A9 BC switch on the fly A12/BC A12/BC A12/BC Page size 1 KB 1 KB 2 KB 4Gb Configuration 1Gb x4 512Mb x 8 256Mb x16 # of Bank Bank Address BA0 BA2 BA0 BA2 BA0 BA2 Auto precharge A10/AP A10/AP A10/AP Row Address A0 A15 A0 A15 A0 A14 Column Address A0 A9,A11 A0 A9 A0 A9 BC switch on the fly A12/BC A12/BC A12/BC Page size 1 KB 1 KB 2 KB Page 12 of 63 Rev. 1.0 June 2007

13 8Gb Configuration 2Gb x4 1Gb x 8 512Mb x16 # of Bank Bank Address BA0 BA2 BA0 BA2 BA0 BA2 Auto precharge A10/AP A10/AP A10/AP Row Address A0 A15 A0 A15 A0 A15 Column Address A0 A9,A11,A13 A0 A9,A11 A0 A9 BC switch on the fly A12/BC A12/BC A12/BC Page size 2 KB 2 KB 2 KB Note 1 : Page size is the number of bytes of data delivered from the array to the internal sense amplifiers Page size is per bank, calculated as follows: page size = 2 COLBITS * ORG ³ 8 where, COLBITS = the number of column address bits, ORG = the number of I/O (DQ) bits when an ACTIVE command is registered. Page 13 of 63 Rev. 1.0 June 2007

14 6.0 Absolute Maximum Ratings 6.1 Absolute Maximum DC Ratings Symbol Parameter Rating Units Notes VDD Voltage on VDD pin relative to Vss 0.4 V ~ V V 1,3 VDDQ Voltage on VDDQ pin relative to Vss 0.4 V ~ V V 1,3 V IN, V OUT Voltage on any pin relative to Vss 0.4 V ~ V V 1 T STG Storage Temperature 55 to +100 C [ Table 4 ] Absolute Maximum DC Ratings Note : 1. Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD512 standard. 3. VDD and VDDQ must be within 300mV of each other at all times;and VREF must be not greater than 0.6xVDDQ, When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV. 6.2 DRAM Component Operating Temperature Range Symbol Parameter rating Unit Notes Normal Operating Temperature Range 0 to 85 C 1,2 T OPER Extended Temperature Range (Optional) 85 to 95 C 1,3 [ Table 5 ] Temperature Range Note : 1. Operating Temperature T OPER is the case surface temperature on the center/top side of the DRAM. For measurement conditions, please refer to the JEDEC document JESD The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be maintained between 085 C under all operating conditions 3. Some applications require operation of the Extended Temperature Range between 85 C and 95 C case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply: a) Refresh commands must be doubled in frequency, therefore reducing the Refresh interval trefi to 3.9us. It is also possible to specify a component with 1X refresh (trefi to 7.8us) in the Extended Temperature Range. Please refer to supplier data sheet and/or the DIMM SPD for option availability. b) If SelfRefresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual SelfRefresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto SelfRefresh mode (MR2 A6 = 1b and MR2 A7 = 0b). Please refer to the supplier data sheet and/or the DIMM SPD for Auto SelfRefresh option availability, Extended Temperature Range support and trefi requirements in the Extended Temperature Range. 7.0 AC & DC Operating Conditions 7.1 Recommended DC operating Conditions (SSTL_1.5) Rating Symbol Parameter Min. Typ. Max. Units Notes VDD Supply Voltage V 1,2 VDDQ Supply Voltage for Output V 1,2 [ Table 6 ] Recommended DC Operating Conditions Note : 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together. Page 14 of 63 Rev. 1.0 June 2007

15 8.0 AC & DC Input Measurement Levels 8.1 AC and DC Logic input levels for singleended signals DDR3800/1066/1333 Symbol Parameter Min. Max. Unit Notes V IH (DC) dc input logic high VREF VDD mv 1 V IL (DC) dc input logic low VSS VREF 100 mv 1 V IH (AC) ac input logic high VREF mv 1,2 V IL (AC) ac input logic low VREF 175 mv 1,2 VREFDQ(DC) I/O Reference Voltage(DQ) 0.49*VDDQ 0.51*VDDQ V 3,4 VREFCA(DC) I/O Reference Voltage(CMD/ADD) 0.49*VDDQ 0.51*VDDQ V 3,4 [ Table 7 ] Single Ended AC and DC input levels Note : 1. For DQ and DM, V REF = V REFDQ. For input only pins except RESET, or V REF = V REFCA 2. See 9.6 "Overshoot and Undershoot specifications" on page The ac peak noise on V REF may not allow V REF to deviate from V REF(DC) by more than ± 1% VDD (for reference : approx. ± 15mV) 4. For reference : approx. VDD/2 ± 15mV The dctolerance limits and acnoise limits for the reference voltages VREFCA and VREFDQ are illustrate in Figure 1. It shows a valid reference voltage VREF(t) as a function of time. (VREF stands for VREFCA and VREFDQ likewise). VREF(DC) is the linear average of VREF(t) over a very long period of time (e.g. 1 sec). This average has to meet the min/max requiremts in above table. Furthermore VREF(t) may temporarily deviate from VREF(DC) by no more than ± 1% VDD. voltage VDD V Ref acnoise V Ref (DC) V Ref (DC) V Ref (DC)max VDD/2 V Ref (DC)min VSS Figure 1. Illustration of VREF(DC) tolerance and VREF acnoise limits time The voltage levels for setup and hold time measurements VIH(AC), VIH(DC), VIL(AC) and VIL(DC) are dependent on VRef. "VRef" shall be understood as VRef(DC), as defined in Figure 1. This clarifies, that dcvariations of VRef affect the absolute voltage a signal has to reach to achieve a valid high or low level and therefore the time to which setup and hold is measured. System timing and voltage budgets need to account for VRef(DC) deviations from the optimum position within the dataeye of the input signals. This also clarifies that the DRAM setup/hold specification and derating values need to include time and voltage associated with VRef acnoise. Timing and voltage effects due to acnoise on VRef up to the specified limit (+/1% of VDD) are included in DRAM timings and their associated deratings. Page 15 of 63 Rev. 1.0 June 2007

16 8.2 Differential swing requirement for differntial signals Figure 2 : Definition of differntial acswing and "time above ac level tdvac tdvac VIHdiff(ac) min VIHdiff min VIHdiff(dc) min 0.0 CK CK DQS DQS VIHdiff(ac) max VIHdiff max VIHdiff(dc) max differential voltage time time half cycle tdvac [ Table 8 ] Differential swing requirement for clock (CK CK) and strobe (DQS DQS) Symbol Parameter DDR3800 & 1066 & 1033 & 1600 min max unit Note VIHdiff differential input high +0.2 note 3 V 1 VILdiff differential input low note V 1 VIHdiff(ac) differential input high ac 2 x (VIH(ac)Vref) note 3 V 2 VIHdiff(ac) differential input low ac note 3 2 x (Vref VIL(ac)) V 2 Notes: 1. used to define a differential signal slewrate. 2. for CK CK use VIH/VIL(ac) of ADD/CMD and VREFCA; for DQS DQS, DQSL DQSL, DQSU DQSU use VIH/VIL(ac) of DQs and VREFDQ; if a reduced achigh or aclow level is used for a signal group, then the reduced level applies also here. 3. these values are not defined, however they singleended signals CK, CK, DQS, DQS, DQSL, DQSL, DQSU, DQSU need to be within the respective limits (VIH(dc) max, VIL(dc)min) for singleended signals as well as the limitations for overshoot and undershoot. [ Table 9 ] Allowed time before ringback (tdvac) for CLK CLK and DQS DQS. Slew Rate [V/ns] tdvac VIH/Ldiff(ac) = 350mV tdvac VIH/Ldiff(ac) = 300mV min max min max > < Page 16 of 63 Rev. 1.0 June 2007

17 8.2.1 Singleended requirements for differential signals Each individual component of a differential signal (CK, DQS, DQSL, DQSU, CK, DQS, DQSL, or DQSU) has also to comply with certain requirements for singleended signals. CK and CK have to approximately reach VSEHmin / VSELmax (approximately equal to the aclevels ( VIH(ac) / VIL(ac) ) for ADD/CMD signals) in every halfcycle. DQS, DQSL, DQSU, DQS, DQSL have to reach VSEHmin / VSELmax (approximately the aclevels ( VIH(ac) / VIL(ac) ) for DQ signals) in every halfcycle preceeding and following a valid transition. Note that the applicable aclevels for ADD/CMD and DQ s might be different per speedbin etc. E.g. if VIH150(ac)/VIL150(ac) is used for ADD/CMD signals, then these aclevels apply also for the singleended signals CK and CK VDD or VDDQ VSEH min VSEH VDD/2 or VDDQ/2 VSEL max CK or DQS VSS or VSSQ VSEL time Figure 3: Singleended requirement for differential signals. Note that while ADD/CMD and DQ signal requirements are with respect to Vref, the singleended components of differential signals have a requirement with respect to VDD/2; this is nominally the same. The transition of singleended signals through the aclevels is used to measure setup time. For singleended components of differential signals the requirement to reach VSELmax, VSEHmin has no bearing on timing, but adds a restriction on the common mode charateristics of these signals. Page 17 of 63 Rev. 1.0 June 2007

18 8.3 AC and DC logic input levels for Differential Signals [ Table 10 ] Differential DC and AC input levels Symbol Parameter DDR3800/1066/1333 Min Max VIHdiff Differential input logic high VILdiff Differential input logic low 200 Unit Notes mv 1 Note : 1. Refer to "Overshoot and Undershoot specifications" on page Differential Input Cross Point Voltage To guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, each cross point voltage of differential input signals (CK, CK and DQS, DQS) must meet the requirements in below table. The differential input cross point voltage VIX is measured from the actual cross point of true and complement signal to the midlevel between of VDD and VSS. VDD CK, DQS V IX VDD/2 V IX V IX CK, DQS VSS Figure 4. Vix Definition [ Table 11 ] Cross point voltage for differential input signals (CK, DQS) DDR3800/1066/1333/1600 Symbol Parameter Unit Min Max VIX Differential input Cross point voltage relative to VDD/ mv Notes Page 18 of 63 Rev. 1.0 June 2007

19 8.5 Slew rate definition for Single Ended Input Signals Input Slew Rate for Input Setup Time (tis) and Data Setup Time (tds) Setup (tis and tds) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VRef and the first crossing of VIH(AC)min. Setup (tis and tds) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VRef and the first crossing of VIL(AC)max Input Slew Rate for Input Hold Time (tih) and Data Hold Time (tdh) Hold nominal slew rate for a rising signal is defined as the slew rate between the last crossing of VIL(DC)max and the first crossing of VRef. Hold (tih & tdh) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of VIH(DC)min and the first crossing of VRef Description Measured From To Input slew rate for rising edge Vref Vih(AC)min Input slew rate for falling edge Vref Vil(AC)max Input slew rate for rising edge Vil(DC)max Vref Input slew rate for falling edge Vih(DC)min Vref [ Table 12 ] Single Ended Input Slew Rate definition Defined by Vih(AC)minVref Delta TRS VrefVil(AC)max Delta TFS VrefVil(DC)max Delta TFH Vih(DC)minVref Delta TRH Applicable for Setup (tis,tds) Hold (tih,tdh) Notes: This nominal slew rate applies for linear signal waveforms. V DDQ V DDQ V IH(ac) min V IH(ac) min V IH(dc) min V IH(dc) min V SWING(MAX) V REF V SWING(MAX) V REF V IL(dc) max V IL(dc) max V IL(ac) max V IL(ac) max V SSQ V SSQ delta TFS delta TRS delta TFH delta TRH < Figure : Input slew rate for setup> < Figure : Input slew rate for Hold> Figure 5. Input Nominal Slew Rate definition for Singel ended Signals 8.6 Slew rate definition for Differential Input Signals Description Differential input slew rate for rising edge (CK CK and DQSDQS) Differential input slew rate for falling edge (CK CK and DQSDQS) Measured From To VILdiffmax VIHdiffmin VIHdiffmin VILdiffmax Defined by VIHdiffmin VILdiffmax Delta TRdiff VIHdiffmin VILdiffmax Delta TFdiff [ Table 13 ] Differential input slew rate definition Note : The differential signal (i.e. CK CK and DQS DQS) must be linear between these thresholds VDDQ VIHdiffmin V SWING(MAX) V REF VILdiffmax VSSQ delta TFdiff delta TRdiff Figure 6. Differential Input Slew Rate definition for DQS, DQS and CK, CK Page 19 of 63 Rev. 1.0 June 2007

20 9.0 AC and DC Output Measurement Levels 9.1 Single Ended AC and DC Output Levels [ Table 14 ] Single Ended AC and DC output levels Symbol Parameter DDR3800/1066/1333/1600 Units Notes V OH(DC) DC output high measurement level (for IV curve linearity) 0.8 x VDDQ V V OM(DC) DC output mid measurement level (for IV curve linearity) 0.5 x VDDQ V V OL(DC) DC output low measurement level (for IV curve linearity) 0.2 x VDDQ V V OH(AC) AC output high measurement level (for output SR) VTT x VDDQ V 1 V OL(AC) AC output low measurement level (for output SR) VTT 0.1 x VDDQ V 1 Note : 1. The swing of +/0.1xVDDQ is based on approximately 50% of the static single ended output high or low swing with a driver impedance of 34ohms and an effective test load of 25ohms to VTT=VDDQ/ Differential AC and DC Output Levels Symbol Parameter DDR3800/1066/1333/1600 Units Notes V OHdiff(AC) AC differential output high measurement level (for output SR) +0.2 x VDDQ V 1 V OLdiff(DC) AC differential output low measurement level (for output SR) 0.2 x VDDQ V 1 [ Table 15 ] Differential AC and DC output levels Note : 1. The swing of +/0.2xVDDQ is based on approximately 50% of the static singel ended output high or low swing with a driver impedance of 34ohms and an effective test load of 25ohms to VTT=VDDQ/2 at each of the differential outputs Page 20 of 63 Rev. 1.0 June 2007

21 9.3.Single Ended Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL(AC) and VOH(AC) for single ended signals as shown in Table 16 and figure 7. [ Table 16 ] Single Ended Output slew rate definition Measured Description From To Single ended output slew rate for rising edge VOL(AC) VOH(AC) Single ended output slew rate for falling edge VOH(AC) VOL(AC) Defined by VOH(AC)VOL(AC) Delta TRse VOH(AC)VOL(AC) Delta TFse DDR3800 DDR31066 DDR31333 DDR31600 Parameter Symbol Units Min Max Min Max Min Max Min Max Single ended output slew rate SRQse TBD 5 V/ns [ Table 17 ] Single Ended Output slew rate Note : Output slew rate is verified by design and characterization, and may not be subject to production test. For Ron=RZQ/7 setting V DDQ V OH(AC) V REF V OL(AC) V SSQ delta TFS delta TRS Figure 7. Single Ended Output Slew Rate definition 9.4 Differential Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOLdiff(AC) and VOHdiff(AC) for differential signals as shown intable 18 and figure 8. [ Table 18 ] Differential Output slew rate definition Measured Description From To Differential output slew rate for rising edge VOLdiff(AC) VOHdiff(AC) Differential output slew rate for falling edge VOHdiff(AC) VOLdiff(AC) Defined by VOHdiff(AC)VOLdiff(AC) Delta TRdiff VOHdiff(AC)VOLdiff(AC) Delta TFdiff DDR3800 DDR31066 DDR31333 DDR31600 Parameter Symbol Units Min Max Min Max Min Max Min Max Single ended output slew rate SRQse TBD 10 V/ns [ Table 19 ] Differential Output slew rate Note : Output slew rate is verified by design and characterization, and may not be subject to production test. For Ron=RZQ/7 setting V DDQ V OHdiff(AC) V REF V OLdiff(AC) V SSQ delta TFdiff delta TRdiff Figure 8. Differential Output Slew Rate definition Page 21 of 63 Rev. 1.0 June 2007

22 9.5 Reference Load for AC Timing and Output Slew Rate Figure 9 represents the effective reference load of 25 ohms used in defining the relevant AC timing parameters of the device as well as output slew rate measurements. It is not intended as a precise representation of any particular system environment of a depiction of the actual load presented by a production tester. System designers should use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers correlate to their production test conditions, generally one or more coaxial transmission lines terminated at the tester electronics. VDDQ CK/CK DUT DQ DQS DQS 25Ω V TT = V DDQ /2 Reference Point Figure 9. Reference Load for AC Timing and Output Slew Rate Page 22 of 63 Rev. 1.0 June 2007

23 9.6 Overshoot/Undershoot Specification Address and Control Overshoot and Undershoot specifications AC Overshoot/Undershoot Specification for Address and Control Pins (A0A12, BA0BA2, CS, RAS, CAS, WE, CKE, ODT) Specification Parameter DDR3800 DDR31066 DDR31333 DDR31600 Maximum peak amplitude allowed for overshoot area (See Figure 8) 0.4V 0.4V 0.4V 0.4V Maximum peak amplitude allowed for undershoot area (See Figure 8) 0.4V 0.4V 0.4V 0.4V Maximum overshoot area above VDD (See Figure 8) 0.67Vns 0.5Vns 0.4Vns 0.33Vns Maximum undershoot area below VSS (See Figure 8) 0.67Vns 0.5Vns 0.4Vns 0.33Vns [ Table 20 ] AC overshoot/undershoot specification for Address and Control pins Maximum Amplitude Overshoot Area Volts (V) VDD VSS Maximum Amplitude Time (ns) Undershoot Area Figure 10. Address and Control Overshoot and Undershoot definition Clock, Data, Strobe and Mask Overshoot and Undershoot specifications AC Overshoot/Undershoot Specification for Clock, Data, Strobe, and Mask Pins (DQ, DQS, DQS, DM, CK, CK) Specification Parameter DDR3800 DDR31066 DDR31333 DDR31600 Maximum peak amplitude allowed for overshoot area (See Figure 9) 0.4V 0.4V 0.4V 0.4V Maximum peak amplitude allowed for undershoot area (See Figure 9) 0.4V 0.4V 0.4V 0.4V Maximum overshoot area above VDDQ (See Figure 9) 0.25Vns 0.19Vns 0.15Vns 0.13Vns Maximum undershoot area below VSSQ (See Figure 9) 0.25Vns 0.19Vns 0.15Vns 0.13Vns [ Table 21 ] AC overshoot/undershoot specification for Clock, Data, Strobe and Mask Maximum Amplitude Overshoot Area Volts (V) VDDQ VSSQ Maximum Amplitude Time (ns) Undershoot Area Figure 11. Clock, Data, Strobe and Mask Overshoot and Undershoot definition Page 23 of 63 Rev. 1.0 June 2007

24 ohm Output Driver DC Electrical Characteristics A functional representation of the output buffer is shown below. Output driver impedance RON is defined by the value of external reference resistor RZQ as follows: RON 34 = RZQ/7 (Nominal 34ohms +/ 10% with nominal RZQ=240ohm) The individual Pullup and Pulldown resistors (RONpu and RONpd) are defined as follows VDDQVout RONpu = under the condition that RONpd is turned off l Iout l RONpd = Vout l Iout l under the condition that RONpu is turned off Output Driver : Definition of Voltages and Currents Output Driver VDDQ Ipu To other circuity RON Pu RON Pd Iout DQ Ipd Vout VSSQ Figure 12. Output Driver : Definition of Voltages and Currents [ Table 22 ] Output Driver DC Electrical Characteristics, assuming RZQ=240 ohms ; entire operating temperature range; after proper ZQ calibration RONnom Resistor Vout Min Nom Max Units Notes VOLdc = 0.2 x VDDQ RZQ/7 1,2,3 34Ohms RON34pd RON34pu Mismatch between Pullup and Pulldown, MMpupd VOMdc = 0.5 x VDDQ RZQ/7 1,2,3 VOHdc = 0.8 x VDDQ RZQ/7 1,2,3 VOLdc = 0.2 x VDDQ RZQ/7 1,2,3 VOMdc = 0.5 x VDDQ RZQ/7 1,2,3 VOHdc = 0.8 x VDDQ RZQ/7 1,2,3 VOMdc = 0.5 x VDDQ % 1,2,4 Note : 1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibration, see following section on voltage and temperature sensitivity 2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS 3. Pulldown and pullup output driver impedance are recommended to be calibrated at 0.5 X VDDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g. calibration at 0.2 X VDDQ and 0.8 X VDDQ 4. Measurement definition for mismatch between pullup and pulldown, MMpupd: Measure RONpu and RONpd. both at 0.5 X VDDQ: RONpu RONpd MMpupd = x 100 RONnom Page 24 of 63 Rev. 1.0 June 2007

25 9.7.1 Output Drive Temperature and Voltage sensitivity If temperature and/or voltage change after calibration, the tolerance limits widen according to table below T = T T(@calibration); V = VDDQ VDDQ (@calibration); VDD = VDDQ *dr ON dt and dr ON dv are not subject to production test but are verified by design and characterization [ Table 23 ] Output Driver Sensitivity Definition Min Max Units RONPU@V OHDC 0.6 dr ON dth * T dr ON dvh * V dr ON dth * T + dr ON dvh * V RZQ/7 RON@V OMDC 0.9 dr ON dtm * T dr ON dvm * V dr ON dtm * T + dr ON dvm * V RZQ/7 RONPD@ VOLDC 0.6 dr ON dtl * T dr ON dvl * V dr ON dtl * T + dr ON dvl * V RZQ/7 [ Table 24 ] Output Driver Voltage and Temperature Sensitivity Min Max Units dr ON dtm %/ C dr ON dvm %/mv dr ON dtl %/ C dr ON dvl 0 TBD %/mv dr ON dth %/ C dr ON dvh 0 TBD %/mv 9.8 OnDie Termination (ODT) Levels and IV Characteristics OnDie Termination effective resistance RTT is defined by bits A9, A6 and A2 of MR1 register. ODT is applied to the DQ,DQ, DQS/DQS and TDQS,TDQS (x8 devices only) pins. A functional representation of the ondie termination is shown below. The individual pullup and pulldown resistors (RTTpu and RTTpd) are defined as follows : RTTpu = RTTpd = VDDQVout l Iout l Vout l Iout l under the condition that RTTpd is turned off under the condition that RTTpu is turned off OnDie Termination : Definition of Voltages and Currents To other circuitry like RCV,... Output Driver Ipu RTT Pu RTT Pd Ipd VDDQ Iout=IpdIpu DQ Iout Vout VSSQ Figure 13. OnDie Termination : Definitionof Voltages and Currents Page 25 of 63 Rev. 1.0 June 2007

26 9.8.1 ODT DC electrical characteristics Table # provides and overview of the ODT DC electrical characteristics. They values for RTT 60pd120, RTT 60pu120, RTT 120pd240, RTT 120pu240, RTT 40pd80, RTT 40pu80, RTT 30pd60, RTT 30pu60, RTT 20pd40, RTT 20pu40 are not specification requirements, but can be used as design guide lines:. MR1 (A9,A6,A2) RTT RESISTOR Vout MIN NOM MAX UNIT NOTES RTT 120pd XVDDQ R ZQ 1,2,3,4 0.2XVDDQ R ZQ 1,2,3,4 0.8XVDDQ R ZQ 1,2,3,4 (0,1,0) 120 ohm RTT 120pu XVDDQ R ZQ 1,2,3,4 0.2XVDDQ R ZQ 1,2,3,4 0.8XVDDQ R ZQ 1,2,3,4 RTT 120 V IL(AC) TO V IH(AC) R ZQ /2 1,2,5 RTT 60pd XVDDQ R ZQ /2 1,2,3,4 0.2XVDDQ R ZQ/2 1,2,3,4 0.8XVDDQ R ZQ /2 1,2,3,4 (0,0,1) 60 ohm RTT 60pu XVDDQ R ZQ /2 1,2,3,4 0.2XVDDQ R ZQ/2 1,2,3,4 0.8XVDDQ R ZQ /2 1,2,3,4 RTT 60 V IL(AC) TO V IH(AC) R ZQ /4 1,2,5 RTT 40pd XVDDQ R ZQ /3 1,2,3,4 0.2XVDDQ R ZQ/3 1,2,3,4 0.8XVDDQ R ZQ /3 1,2,3,4 (0,1,1) 40 ohm RTT 40pu XVDDQ R ZQ /3 1,2,3,4 0.2XVDDQ R ZQ/3 1,2,3,4 0.8XVDDQ R ZQ /3 1,2,3,4 RTT 40 V IL(AC) TO V IH(AC) R ZQ /6 1,2,5 RTT 60pd XVDDQ R ZQ /4 1,2,3,4 0.2XVDDQ R ZQ/4 1,2,3,4 0.8XVDDQ R ZQ /4 1,2,3,4 (1,0,1) 30 ohm RTT 60pu XVDDQ R ZQ /4 1,2,3,4 0.2XVDDQ R ZQ /4 1,2,3,4 0.8XVDDQ R ZQ /4 1,2,3,4 RTT 60 V IL(AC) TO V IH(AC) R ZQ /8 1,2,5 RTT 60pd XVDDQ R ZQ /6 1,2,3,4 0.2XVDDQ R ZQ /6 1,2,3,4 0.8XVDDQ R ZQ /6 1,2,3,4 (1,0,0) 20 ohm RTT 60pu XVDDQ R ZQ /6 1,2,3,4 0.2XVDDQ R ZQ/6 1,2,3,4 0.8XVDDQ R ZQ /6 1,2,3,4 RTT 60 V IL(AC) TO V IH(AC) R ZQ /12 1,2,5 Deviation of VM w.r.t VDDQ/2, VM 5 5 % 1,2,5,6 [ Table 25 ] ODT DC Electrical characteristics, assuming RZQ=240 ohm +/ 1% entire operating temperature range; after proper ZQ calibration Page 26 of 63 Rev. 1.0 June 2007

27 Note : 1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibration, see following section on voltage and temperature sensitivity 2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS 3. Pulldown and pullup ODT resistors are recommended to be calibrated at 0.5XVDDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g. calibration at 0.2XVDDQ and 0.8XVDDQ. 4. Not a specification requirement, but a design guide line 5. Measurement definition for RTT: Apply VIH(ac) to pin under test and measure current I(VIH(ac)), then apply VIL(ac) to pin under test and measure current I(VIL(ac)) perspectively RTT = VIH(ac) VIL(ac) I(VIH(ac)) I(VIL(ac)) 6. Measurement definition for VM and VM : Measure voltage (VM) at test pin (midpoint) with no load VM = 2 x VM VDDQ 1 x ODT Temperature and Voltage sensitivity If temperature and/or voltage change after calibration, the tolerance limits widen according to table below T = T T(@calibration); V = VDDQ VDDQ (@calibration); VDD = VDDQ [ Table 26 ] ODT Sensitivity Definition Min Max Units RTT 0.9 dr TT dt * T dr TT dv * V dr TT dt * T + dr TT dv * V RZQ/2,4,6,8,12 [ Table 27 ] ODT Voltage and Temperature Sensitivity Min Max Units dr TT dt %/ C dr TT dv %/mv These parameters may not be subject to production test. They are verified by design and characterization. Page 27 of 63 Rev. 1.0 June 2007

28 9.9 ODT Timing Definitions Test Load for ODT Timings Different than for timing measurements, the reference load for ODT timings is defined in Figure 14. VDDQ CK,CK DUT DQ, DM DQS, DQS TDQS, TDQS VTT= RTT VSSQ =25 ohm VSSQ Timing Reference Points BD_REFLOAD_ODT Figure 14. ODT Timing Reference Load ODT Timing Definition Definitions for t AON, t AONPD, t AOF, t AOFPD and t ADC are provided in Table28 and subsequent figures. Measurement reference settings are provided in Table29. [ Table 28 ] ODT Timing Definitions Symbol Begin Point Definition End Point Definition Figute t AON Rising edge of CK CK defined by the end point of ODTLon Extrapolated point at VSSQ Figure 2 t AONPD Rising edge of CK CK with ODT being first registered high Extrapolated point at VSSQ Figure 3 t AOF Rising edge of CK CK defined by the end point of ODTLoff End point: Extrapolated point at VRTT_Nom Figure 4 t AOFPD Rising edge of CK CK with ODT being first registered low End point: Extrapolated point at VRTT_Nom Figure 5 t ADC Rising edge of CK CK defined by the end point of ODTLcnw, ODTLcwn4 of ODTLcwn8 End point: Extrapolated point at VRTT_Wr and VRTT_Nom respectively Figure 6 [ Table 29 ] Reference Settings for ODT Timing Measurements Measured Parameter RTT_Nom Setting RTT_Wr Setting V SW1 [V] V SW2 [V] Note R ZQ /4 NA t AON R ZQ /12 NA R ZQ /4 NA t AONPD R ZQ /12 NA R ZQ /4 NA t AOF R ZQ /12 NA R ZQ /4 NA t AOFPD R ZQ /12 NA t ADC R ZQ /12 R ZQ / Page 28 of 63 Rev. 1.0 June 2007

29 CK CK Begin point : Rising edge of CK CK defined by the end point of ODTLon t AON VTT DQ, DM DQS, DQS TDQS, TDQS VSSQ T SW1 T SW2 V SW1 V SW2 VSSQ End point Extrapolated point at VSSQ Figure 15. Definition of taon CK CK Begin point : Rising edge of CK CK with ODT being first registered high t AONPD VTT DQ, DM DQS, DQS TDQS, TDQS VSSQ T SW1 T SW2 V SW1 V SW2 VSSQ End point Extrapolated point at VSSQ Figure 16. Definition of taonpd CK CK Begin point : Rising edge of CK CK defined by the end point of ODTLoff t AOF VTT VRTT_Nom End point Extrapolated point at VRTT_Nom DQ, DM DQS, DQS TDQS, TDQS V SW2 V SW1 T SW2 T SW1 VSSQ TD_TAON_DEF Figure 17. Definition of taof Page 29 of 63 Rev. 1.0 June 2007

30 CK CK Begin point : Rising edge of CK CK with ODT being first registered low t AOFPD VTT VRTT_Nom End point Extrapolated point at VRTT_Nom DQ, DM DQS, DQS TDQS, TDQS V SW2 V SW1 T SW2 T SW1 VSSQ Figure 18. Definition of taofpd Begin point : Rising edge of CK CK defined by the end point of ODTLcnw Begin point : Rising edge of CK CK defined by the end point of ODTLcwn4 or ODTLcwn8 CK VTT CK t ADC t ADC VRTT_Nom DQ, DM DQS, DQS TDQS, TDQS End point Extrapolated point at VRTT_Nom End point Extrapolated point at VRTT_Nom T SW21 V SW2 T SW11 V SW1 T SW12 T SW22 VRTT_Nom VRTT_Wr End point Extrapolated point at VRTT_Wr VSSQ Figure 19. Definition of tadc Page 30 of 63 Rev. 1.0 June 2007

31 10.0 Idd Specification Parameters and Test Conditions 10.1 IDD Measurement Conditions Within the tables provided further down, an overview about the IDD measurement conditions is provided as follows: [ Table 30 ] Overview of Tables providing IDD Measurement Conditions and DRAM Behavior Table number Table 34 Table 35 Table 36 Table 37 Table 38 Table 39 Table 40 Measurement Conditions IDD0 and IDD1 IDD2N, IDD2Q, IDD2P(0), IDD2P(1) IDD3N and IDD3P IDD4R, IDD4W, IDD7 IDD7 for different speed grades and different trrd, tfaw conditions IDD5B IDD6, IDD6ET Within the tables about IDD measurement conditions, the following definitions are used: LOW is defined as V IN <= V ILAC (max.); HIGH is defined as V IN >= V IHAC (min.); STABLE is defined as inputs are stable at a HIGH or LOW level FLOATING is defined as inputs are V REF = V DDQ / 2 SWITCHING is defined as described in the following 2 tables. [ Table 31 ] Definition of SWITCHING for Address and Command Input Signals SWITCHING for Address (row, column) and Command Signals (CS, RAS, CAS, WE) is defined as: Address (Row, Column): Bank address: If not otherwise mentioned the inputs are stable at HIGH or LOW during 4 clocks and change then to the opposite value (e.g. Ax Ax Ax Ax Ax Ax Ax Ax Ax Ax Ax Ax... please see each IDDx definition for details If not otherwise mentioned the bank addresses should be switched like the row/ column addresses please see each IDDx definition for details Define D = {CS, RAS, CAS, WE } := {HIGH, LOW, LOW, LOW} Define D = {CS, RAS, CAS, WE } := {HIGH, HIGH,HIGH,HIGH} Command (CS, RAS, CAS, WE): Define Command Background Pattern = D D D D D D D D D D D D... If other commands are necessary (e.g. ACT for IDD0 or Read for IDD4R) the Background Pattern Command is substituted by the respective CS, RAS, CAS, WE levels of the necessary command. See each IDDx definition for details and figures 1,2,3 as examples. [ Table 32 ] Definition of SWITCHING for Data (DQ) SWITCHING for Data (DQ) is defined as Data (DQ) Data Masking (DM) Data DQ is changing between HIGH and LOW every other data transfer (once per clock) for DQ signals, which means that data DQ is stable during one clock; see each IDDx definition for exceptions from this rule and for further details. See figures 1,2,3 as examples. NO Switching; DM must be driven LOW all the time Page 31 of 63 Rev. 1.0 June 2007

32 Timing parameters are listed in the following table: [ Table 33 ] For IDD testing the following parameters are utilized. Parameter Bin DDR3800 DDR31066 DDR Unit t CKmin (IDD) ns CL(IDD) t RCDmin (IDD) ns t RCmin (IDD) ns t RASmin (IDD) ns t RPmin (IDD) ns t FAW (IDD) x4/x ns x ns x4/x ns t RRD (IDD) x ns t RFC (IDD) 1Gb The following conditions apply: 1. IDD specifications are tested after the device is properly initialized. 2. Input slew rate is specified by AC Parametric test conditions. 3. IDD parameters are specified with ODT and output buffer disabled (MR1 Bit A12). Page 32 of 63 Rev. 1.0 June 2007

33 [ Table 34 ] IDD Measurement Conditions for IDD0 and IDD1 Current IDD0 IDD1 Name Operating Current 0 > One Bank Activate > Precharge Operating Current 1 > One Bank Activate > Read > Precharge Measurement Condition Timing Diagram Example Figure 1 CKE HIGH HIGH External Clock on on t CK t CK min(idd) t CK min(idd) t RC t RC min(idd) t RC min(idd) t RAS t RAS min(idd) t RAS min(idd) t RCD n.a. t RCD min(idd) t RRD n.a. n.a. CL n.a. CL(IDD) AL n.a. 0 CS HIGH between. Activate and Precharge Commands HIGH between Activate, Read and Precharge SWITCHING as described in Table 2; only exceptions are Activate and Precharge commands; example of IDD0 pattern: SWITCHING as described in Table 2; only exceptions are Activate, Read and Precharge commands; example of IDD1 pattern: Command Inputs (CS, RAS, CAS, WE) A0 D D D D D D D D D D D P0 (DDR3800: tras = 37.5ns between (A)ctivate and (P)recharge to bank 0 ; Definition of D and D: see Table 2) A0 D D D D R0 D D D DD D D DD D P0 (DDR : trcd = 12.5ns between (A)ctivate and (R)ead to bank 0 ; Definition of D and D: see Table 2) Row, Column Addresses Definition of D and D: See table ##. Row addresses SWITCHING as described in Table 2; Address Input A10 must be LOW all the time! Definition of D and D: See table ##. Row addresses SWITCHING as described in Table 2; Address Input A10 must be LOW all the time! Bank Addresses bank address is fixed (bank 0) bank address is fixed (bank 0) Data I/O SWITCHING as described in Table 3 Read Data: output data switches every clock, which means that Read data is stable during one clock cycle. To achieve Iout = 0mA the output buffer should be switched off by MR1 Bit A12 set to "1". When there is no read data burst from DRAM the DQ I/O should be FLOATING. Output Buffer DQ,DQS / MR1 bit A12 off / 1 off / 1 Rtt_NOM, Rtt_WR disabled disabled Burst length n.a. 8 fixed / MR0 Bits [A1, A0] = {0,0} Active banks one ACTPRE loop one ACTRDPRE loop Idle banks all other all other Precharge Power Down Mode / Mode Register Bit 12 n.a. n.a. Page 33 of 63 Rev. 1.0 June 2007