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1 +W OUTPUT POWER R L = = 10% V CC = 22V ST-BY AND MUTE FUNCTIONS LOW TURN-ON TURN-OFF POP NOISE LINEAR CONTROL DC COUPLED WITH POWER OP. AMP. NO BOUCHEROT CELL NO ST_BY RC INPUT NETWORK SINGLE SUPPLY RANGING UP TO 3V SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION INTERNALLY FIXED GAIN SOFT CLIPPING VARIABLE OUTPUT AFTER CONTROL CIRCUIT CLIPWATT 1 PACKAGE DESCRIPTION The TDA7496SA is a stereo +W class AB power BLOCK DIAGRAM INR INL W+W AMPLIFIER WITH DC CONTROL 470nF S_GND 470nF 1 8 SVR 7 11 VAROUT_R OP AMP MUTE/STBY PROTECTIONS OP AMP PRODUCT PREVIEW Clipwatt 1 ORDERING NUMBER: TDA7496SA amplifier assembled i 1 package, specially designed for high quality sound TV applications. Features of the TDA7496SA include linear volume control Stand-by and Mute functions. The TDA7496SA is pin to pin compatible with TDA7496, TDA7496S, TDA7496SA, TDA749, TDA749SA, TDA7494S, TDA7494SA. 60K MULTIPOWER BI0II TECHNOLOGY OUTR STBY MUTE OUTL 1000µF 1000µF 10K 1µF S1 ST-BY S2 MUTE +V S_GND +V 470µF 3 4 VAROUT_L +V 100nF 300K D96AU440D September 2003 This is preliminary information on a new product now in development. Details are subject to change without notice. 1/13

2 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit DC Supply Voltage 3 V V IN Maximum Input Voltage 8 Vpp P tot Total Power Dissipation (T amb = 70 C) 16 W T amb Ambient Operating Temperature (1) 0 to 70 C T stg,t J Storage and Junction Temperature -40 to 10 C V 3 Volume Control DC Voltage 7 V PIN CONNECTION (top view) THERMAL DATA Symbol Parameter Value Unit R th j-case Thermal Resistance junction-case Typ. = 4.; Max. = C/W R th j-amb Thermal Resistance junction-ambient Max. 48 C/W ELECTRICAL CHARACTERISTCS (Refer to the test circuit R L = 8Ω, f = 1KHz, R g = 0Ω, = 22V, T amb = 2 C) Symbol Parameter Test Condition Min. Typ. Max. Unit V s Supply Voltage Range V I q Total Quiescent Current 2 0 ma DCV os Output DC Offset Referred to SVR Potential OUTR OUTL MUTE STBY S_GND SVR N.C. INL VAROUT_L VAROUT_R INR No Input Signal 200 mv V O Quiescent Output Voltage 11 V D03AU10 P O Output Power THD = 10%; R L = 8Ω; THD = 1%; R L = 8Ω; THD = 10%; R L = 4Ω; = 12V THD = 1%; R L = 4Ω; = 12V W W THD Total Harmonic Distortion G v = 30dB; P O = 1W; f = 1KHz 0.4 % 2/13

3 ELECTRICAL CHARACTERISTCS (continued) (Refer to the test circuit R L = 8Ω, f = 1KHz, R g = 0Ω, = 22V, T amb = 2 C) Symbol Parameter Test Condition Min. Typ. Max. Unit I peak Output Peak Current (internally limited) A V IN Input Signal 2.8 Vrms G V Closed Loop Gain V Ol Ctrl >4.V db G VLine Monitor Out Gain V Ol Ctrl >4.V; Zload >Ω db A Min V OL Attenuation at Minimum Volume V Ol Ctrl <0.V 80 db BW 0.6 MHz e N Total Output Noise f = 20Hz to 22KHz µv PLAY, max volume f = 20Hz to 22KHz PLAY, max attenuation µv f = 20Hz to 22KHz MUTE µv SR Slew Rate 8 V/µs R i Input Resistance KΩ R Var Out Variable Output Resistance Ω R L Var Out Variable Output Load 2 KΩ SVR Supply Voltage Rejection f = 1KHz; max volume C SVR = 470µF; V RIP = 1Vrms f = 1KHz; max attenuation C SVR = 470µF; V RIP = 1Vrms 3 39 db 6 db T M Thermal Muting 10 C T S Thermal Shut-down 160 C MUTE & INPUT SELECTION FUNCTIONS T-ON Stand-by ON Threshold 3. V T-OFF Stand-by OFF Threshold 1. V V MUTEON Mute ON threshold 3. V V MUTEOFF Mute OFF threshold 1. V A MUTE Mute Attenuation 0 6 db I qst-by Quiescent Stand-by ma I stbybias Stand-by bias current Stand by ON: T-BY = V; V mute = V 80 µa Play or Mute µa I mutebias Mute Bias Current Mute 1 µa Play µa 3/13

4 APPLICATION SUGGESTIONS The recommended values of the external components are those shown on the application circuit of figure 1. Different values can be used, the following table can help the designer. COMPONENT SUGGESTION VALUE Figure 1. Application Circui PURPOSE LARGER THAN SUGGESTION R1 300K Volume Control Circuit Larger volume regulation time SMALLER THAN SUGGESTION Smaller volume regulation time R2 10K Mute time constant Larger mute on/off time Smaller mute on/off time P1 0K Volume Control Circuit C1 1000µF Supply voltage bypass Danger of oscillation C2 470nF Input DC decoupling Lower low frequency cutoff Higher low frequency cutoff C3 470nF Input DC decoupling Lower low frequency cutoff Higher low frequency cutoff C4 470µF Ripple rejection Better SVR Worse SVR C 100nF Volume control time Larger volume regulation Smaller volume regulation constant time time C6 1000µF Output DC decoupling Lower low frequency cutoff Higher low frequency cutoff C7 1µF Mute time constant Larger mute on/off time Smaller mute on/off time C8 1000µF Output DC decoupling Lower low frequency cutoff Higher low frequency cutoff C9 100nF Supply voltage bypass Danger of oscillation + INR INL C1 1000µF C2 470nF S_GND C3 470nF SVR 7 VAROUT_R OP AMP MUTE/STBY PROTECTIONS OP AMP C9 0.1µF C7 1µF C8 1000µF C6 1000µF R2 10K OUTR OUTL S1 STBY S2 MUTE +V S_GND +V C4 470µF 3 4 C 100nF VAROUT_L R1 300K TP1 VOL P1 0K LOG +V D96AU493D 4/13

5 MUTE STAND-BY TRUTH TABLE MUTE St-BY OPERATING CONDITION H H STAND-BY L H STAND-BY H L MUTE L L PLAY Turn ON/OFF Sequences (for optimizing the POP performances) Figure 1. USING ONLY THE MUTE FUNCTION (V) ST-BY pin#9 (V) VSVR pin#7(v) 2.V MUTE pin#10 (V) INPUT (mv) VOUT (V) IQ (ma) OFF STBY MUTE PLAY MUTE STBY OFF D97AU684 USING ONLY THE MUTE FUNCTION To semplify the application, the stand-by pin can be connected directly to Ground. During the ON/OFF transitions is recommended to respect the following conditions: At the turn-on the transition mute to mute - play must be made when the SVR pin is higher than 2.V At the turn-off the TDA7496A must be brought to mute from the play condition when the SVR pin is higher than 2.V. /13

6 Figure 2. P.C.B. and Component layoutpcb and Component Layout Figure 3. 6/13

7 Figure 4. Quiescent Current vs. Supply Voltage Figure 7. Output DC Offset vs. Supply Voltage Iq (ma) Vi=0 D03AU Supply Voltage (V) Figure. Output Dc Offset vs. Supply Voltage Vodc D03AU149 (V) 16 1 Vi= Supply Voltage (V) Figure 6. Output Power vs. Supply Voltage Output Power (W) D03AU1497 Rl=8Ω 8 F=1KHz 7 THD=10% THD=1% Supply Voltage (V) Vodc-Vsvr D03AU1496/mod (mv) 280 Vi= Supply Voltage (V) Figure 8. Output Power vs Supply Voltage Output Power (W) Rl=4Ω F=1KHz THD=10% Supply Voltage (V) Figure 9. Distortion vs Output Power Distortion (%) Vs=22V Rl=8Ω F=1KHz F=1KHz THD=1% D03AU1498 D03AU Output Power (W) 7/13

8 Figure 10. Distortion vs Output Power Figure 13. Mute Attenuation vs Vpin 10 Distortion (%) D03AU100 Mute Attenuation (db) D03AU F=1KHz F=1KHz Vs=12V Rl=4Ω Output Power (W) Figure 11. Closed Loop Gain vs. Frequency Closed loop Gain (db) Frequency (KHz) Figure 12. St-By Attenuation vs Vpin 9 St-by Attenuation (db) Rl=8Ω Pout=1W D03AU101 Rl=8Ω Pout=0.W Cin=470nF Cout=1000µF Csvr=470µF D03AU Vpin # 9 (V) Rl=8Ω Pout=1W Vpin # 10 (V) PINS DESCRIPTION Figure 14. PIN SVR SVR Figure 1. PINS: INL,INR 6K 6K + - 1K INn SVR 20K 20K 100µA 6K 1K D97AU D97AU8A 00µA OUT L OUT R 8/13

9 Figure 17. PIN ST-BY Figure 20. PINS: VAROUT-L VAROUT-R 10µA STBY 200 VAROUT-L 6K D97AU94 D97AU90 Figure 18. PIN: MUTE MUTE K D97AU92 0µA Figure 19. PINS: OUT R, OUT L D97AU88 OUT Figure 21. PIN: VOL Figure 22. PINS: PW-GND, S-GND GND 10µA D97AU91 D97AU93 9/13

10 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at T j = 10 C, it is important the dimensioning of the Heat Sinker R Th ( C/W). The parameters that influence the dimensioning are: Maximum dissipated power for the device (P dmax ) Max thermal resistance Junction to case (R Th j-c ) Max. ambient temperature T amb max Quiescent current I q (ma) Example: V CC = 22V, R load = 8ohm, R Th j-c = C/W, T amb max = 0 C 2 V P dmax = (N channels) cc 2Π 2 + I q V cc R load P dmax = 2 ( 3.0 ) + 0. = 6. W 10 T (Heat Sinker) R amb max 10 0 Th c-a = R P Th j-c = = 10 C/W d max 6. In figure 23 is shown the Power derating curve for the device. Figure 23. Power derating curve Pd (W) (c) (b) (a) Tamb ( C) a) Infinite Heatsink b) 7 C/ W c) 10 C/ W 10/13

11 Clipwatt Assembling Suggestions The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 24. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7-10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 1 Kg/mm2 between it and the plastic body case. As example, if a 1Kg force is applied by the clip on the package, the clip must have a contact area of 1mm2 at least. Figure 24. Example of right placement of the clip 11/13

12 mm inch DIM. MIN. TYP. MAX. MIN. TYP. MAX. A OUTLINE AND MECHANICAL DATA B C D Weight: 1.92gr E F G G H H H L L L L M M Clipwatt /13

13 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2003 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States 13/13