DATA SHEET. 74LV86 Quad 2-input EXCLUSIVE-OR gate. Philips Semiconductors INTEGRATED CIRCUITS. Product specification January 1996 IC24

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1 INTEGRATED CIRCUITS DATA SEET FINA DEICE SPECIFICATION COMMERCIA nr.: 746 Dev. no: C657B QUAD 2-INPUT EXCUSIE-OR GATE Rev. Date Issued by: T. Tieben + 2 Shs ogic Products Development NIJMEGEN PIIPS SEMICONDUCTORS The Netherlands 746 Quad 2-input EXCUSIE-OR gate Product specification January 996 IC24 Philips Semiconducts

2 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 FEATURES Wide operating voltage:. to 5.5 Optimized f ow oltage applications:. to 3.6 Accepts TT input levels between = 2.7 and = 3.6 Typical OP (output ground bounce) <. at = 3.3, T amb =25 C. Typical O (output O undershoot) >2at = 3.3, T amb =25 C. Output capability: standard I CC categy: SSI DESCRIPTION The 746 a low-voltage Si-gate CMOS device and is pin and function compatible with 74C/CT6. The 746 provides the 2-input EXCUSIE-OR function. FUNCTION TABE INPUTS OUTPUTS na nb ny QUICK REFERENCE DATA GND=;T amb =25 C; t r =t f 2.5 ns SYMBO PARAMETER CONDITIONS TYPICA UNIT t P /t P propagation delay na, nb to ny C =5pF = 3.3 ns C I input capacitance 3.5 pf C PD power dissipation notes and 2 capacitance per gate 3 pf Notes to the quick reference data. C PD is used to determine the dynamic power dissipation (P D in µw) P D =C PD x 2 xf i +Σ(C x 2 xf o ) where: f i = input frequency in Mz; C = output load capacity in pf; f o = output frequency in Mz; = supply voltage in ; Σ (C x 2 xf o ) = sum of the outputs. 2. The condition is I = GND to ORDERING AND PACKAGE INFORMATION TYPE NUMBER PACKAGES PINS PACKAGE MATERIA CODE 746N 4 DI plastic SOT27-746D 4 SO plastic SOT- 746DB 4 SSOP plastic SOT PW 4 TSSOP plastic SOT42- PINNING PIN NO. SYMBO NAME AND FUNCTION, 4, 9, 2 A to 4A data inputs 2, 5,, 3 B to 4B data inputs 3, 6,, Y to 4Y data outputs 7 GND ground ( ) 4 positive supply voltage = IG voltage level = OW voltage level January 996

3 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 A B Y 2A 2B 2Y B 4A 4Y 3B 3A A B 2A 2B 3A 3B Y 2Y 3Y 3 6 GND 7 3Y 2 3 4A 4B 4Y Fig. Pin configuration. Fig.2 ogic symbol = = = 3 6 A B Y 2 3 = Fig.3 IEC ogic symbol. Fig.4 ogic diagram (one gate). January 996 2

4 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 The -5 family These family specifications cover the common electrical ratings and characteristics of the entire 74/74U family, unless otherwise specified in the individual device datasheet. This low-voltage CMOS logic family is based on Philips well-known CMOS (C) range and uses the same well-proven fabrication process with only slight modifications. It operates from a typical supply voltage of 3.3 but can be used within the supply voltage range. to 5.5. With a 3.3 supply, the speed and perfmance is the same as CMOS with a 5 supply. RECOMMENDED OPERATING CONDITIONS FOR TE FAMIY SYMBO PARAMETER MIN. TYP. MAX. UNIT CONDITIONS DC supply voltage see note I input voltage O output voltage T amb operating ambient temperature range in free air C see DC and AC characteristics per device =. to = to 2.7 = 2.7 to 3.6 = 3.6 to 5.5 t r,t f input rise and fall times except f Schmitt-trigger inputs ns/ Notes:. The is guaranteed to function down to =. (input levels GND ); DC characteristics are guaranteed from =to = 5.5. ABSOUTE MAXIMUM RATINGS FOR TE -5 FAMIY imiting values in accdance with the Absolute Maximum Rating System (IEC 34). oltages are referenced to GND (ground = ). SYMBO PARAMETER DC supply voltage MIN. MAX. UNIT CONDITIONS ±I IK DC input diode current 2 ma I <.5 I > +.5 ±K DC output diode current 5 ma O <.5 O > +.5 DC output source sink current - standard outputs ± - bus driver outputs ±I GND, ±I CC DC GND current f types with - standard outputs - bus driver outputs T stg stage temperature range C P tot power dissipation per package - plastic DI - plastic mini-pack (SO) - plastic medium-shrink SO (SSOP and TSSOP) ma ma mw.5< O < +.5 f temperature range: 4 to +25 C above + 7 C derate linearly with 2 mw/k above + 7 C derate linearly with mw/k above + 6 C derate linearly with 5.5 mw/k Notes to the limiting values. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these any other conditions beyond those under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions f extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. January 996 3

5 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 DC CARACTERISTICS FOR TE -5 FAMIY Over recommended operating conditions oltages are referenced to GND (ground = ) T amb ( C) TEST CONDITIONS SYMBO PARAMETER 4 to +5 4 to +25 UNIT () I OTER MIN. TYP. MAX. MIN. MAX. I I O O O O O O IG level input voltage OW level input voltage IG level output voltage; all outputs IG level output voltage; STANDARD outputs IG level output voltage; BUS driver outputs OW level output voltage; all outputs OW level output voltage; STANDARD outputs OW level output voltage; BUS driver outputs to 3.6 to to 3.6 to I I = µa I I I I =6mA =2mA =ma =6mA I I = µa I I I I =6mA =2mA =ma =6mA I l input leakage current.. µa 5.5 GND Z I CC I CC 3-state output OFF-state current quiescent supply current; SSI flip-flops MSI SI additional quiescent supply current per input 5 µa Note: All typical values are measured at T amb =25 C. 4 6 µa 5.5 I I O = GND I O = GND 5 5 µa 2.7 to 3.6 I =.6 January 996 4

6 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 DC CARACTERISTICS FOR 746 F the DC characteristics see chapter "-5 family characteristics", section "Family specifications". Output capability: standard I CC categy: SSI AC CARACTERISTICS FOR 746 GND=;t r =t f 2.5 ns; C =5pF SYMBO PARAMETER t P /t P propagation delay na, nb to ny T amb ( C) 4 to +5 4 to +25 UNIT MIN. TYP. MAX. MIN. MAX. () ) 2) ns TEST CONDITIONS 2.7 Fig.5 to 3.6 to 5.5 WAEFORMS Notes: All typical values are measured at T amb =25 C. ) Typical values are measured at = ) Typical values are measured at = 5.. AC WAEFORMS I na, nb INPUT () M GND t P (2) O ny OUTPUT () M (2) O t P Notes: () M =.5at 2.7 and 3.6 M =.5 at < 2.7 and (2) O and O are the typical output voltage drop that occur with the output load. Fig. 5 Wavefms showing the input (na, nb) to output (ny) propagation delays and the output transition times. January 996 5

7 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 seating plane max 4.2 max min 2.2 max 2.54 (6x).53 max 54 M ().3 max max..3 MSA Dimensions in mm. Fig.6 4-lead dual-in-line; plastic (DI4/SOT27) A S. S pin index to o M (4x) detail A Fig.7 4-lead mini-pack; plastic (SO4/SOTA). MBC32 January 996 6

8 Philips Semiconducts Quad 2-input EXCUSIE-OR gate 746 SODERING Plastic dual in-line BY DIP OR WAE The maximum permissible temperature of the solder is 26 C; this temperature must not be in contact with the joint f me than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified stage maximum. If the printed-circuit board has been pre-heated, fced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SODERED JOINTS Apply the soldering iron below the seating plane ( not me than 2 mm above it). If its temperature is below 3 C, it must not be in contact f me than s; if between 3 and 4 C, f not me than 5 s. DEFINITIONS Data sheet status Objective specification Plastic mini-packs BY WAE During placement and befe soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer syringe dispensing. Maximum permissible solder temperature is 26 C, and maximum duration of package immersion in solder bath is s, if allowed to cool to less than 5 C within 6 s. Typical dwell time is 4 s at 25 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need f removal of crosive residues in most applications. BY SODER PASTE REFOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling pressure-syringe dispensing befe device placement. Several techniques exist f reflowing; f example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 5 and 3 s accding to method. Typical reflow temperatures range from 25 to 25 C. Preheating is necessary to dry the paste and evapate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SODERED JOINTS (BY AND-ED SODERING OR PUSE-EATED SODER TOO) Fix the component by first soldering two diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to s at up to 3 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s between 27 and 32 C. (Pulse-heated soldering is not recommended f SO packages. This data sheet contains target goal specifications f product development Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification imiting values This data sheet contains final product specifications imiting values given are in accdance with the Absolute Maximum Rating System (IEC 34). Stress above one me of the limiting values may cause permanent damage to the device. These are stress ratings only and operating of the device at these any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values f extended periods may affect device reliability. Application infmation Where application infmation is given, it is advisy and does not fm part of the specification. IFE SUPPORT APPICATIONS These products are not designed f use in life suppt appliances, devices, systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using selling these products f use in such applications do so at their own risk and agree to fully indemnify Philips f any damages resulting from such improper use sale. January 996 7