IS31AP4913 3D AND BASS ENHANCE STEREO HEADPHONE DRIVER EVALUATION BOARD GUIDE

Transcription

1 ISAP D AND BASS ENHAE STEREO HEADPHONE DESCRIPTION The ISAP evaluation board is a fully assembled and tested PCB. The ISAP is a high quality stereo headphone driver with D and bass enhance designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The features D and bass can be externally adjusted via a simple RC network. FEATURES Supply voltage range from.v to.v Low output noise (µv) High SNR (db) -db PSRR No output DC-blocking capacitors Pulse Count Control serial interface Available in QFN-(mm mm) package QUICK START RECOMMENDED EQUIPMENT.V, A power supply Audio source (i.e. MP player, Notebook PC, etc.) Headphone (Ω) ABSOLUTE MAXIMUM RATINGS.V power supply Caution: Do not exceed the conditions listed above; otherwise the board will be damaged. PROCEDURE Follow the steps listed below to verify ISAP evaluation board operation. Caution: Do not turn on the power supply until all connections are completed. ) Connect headphone (Ω) to the connector (HP Jack). ) Connect the ground terminal of the power supply to the and the positive terminal to the. Or connect DC power to connector (DC IN). ) Connect the audio sources to the terminal (right channel) and terminal (left channel); or connect audio sources to the connector (AUDIO IN). ) Turn on the power supply, and pay attention to the supply current. If the current exceeds ma, please check for circuit fault. ) Turn on the audio sources. Figure : Photo of ISAP Evaluation Board ORDERING INFORMATION Part No. Temperature Range Package ISAP-QFLS-EB - C to + C (Industrial) QFN-, Lead-free Table : Ordering Information For pricing, delivery, and ordering information, please contacts ISSI s analog marketing team at analog@issi.com or () -. Integrated Silicon Solution, Inc. Rev. A, //

2 ISAP D AND BASS ENHAE STEREO HEADPHONE PERFORMAE DESCRIPTION The ISAP evaluation board has six buttons to switch between the different modes. The operating mode is indicated by an LED illuminated above the appropriate buttons. The (~) modes are perform by ISAP. ) (Default mode) normal: basic operating mode ) D mode: enable D enhance function. ) Bass mode: enable bass enhance function. ) D&Bass: enable D and bass enhance function. ) : use the output DC-blocking capacitors headphone amplifier (HWD) drive headphone ) DIR: use the input audio source direct drive headphone. Note: The ISAP headphone driver provides solely audio function capability on the evaluation board. SOFTWARE SUPPORT Please refer to the integrated program. Note: Please refer to the datasheet to get more information about ISAP. C uf U SD LDO VOUT BP C nf CON DC IN V C uf TP TP C uf R k EN_DIR D SS Q NPN_ S CON CON RELAY COM COM COFF COFF R k C.uF C.uF C.uF DATA CLK EN U VIN VIN UP/DN CLOCK SDB VOUT VOUT BYPASS R R R R C.uF C uf C uf EN_DIR LED EN CLK DATA EN key key LED LED key key key RST LED LED V R k D D D D D D U LED LED LED LED LED LED P./CMP/KBI P./CINB/KBI P./CINA/KBI P./CINB/KBI P./CINA/KBI P./CMPREF/KBI P./CMP/KBI P./T/KBI P./TXD P./RXD P./T/SCL P./INT/SDA P./XTAL P./INT P./RST P.XTAL/CLKOUT P./OCB P./OCC/AD LPC K V R k key DIR K R k key VSS K R k key V LED key K D&Bass C.uF R k key Bass CON AUDIO IN K R k key D TP ICP TP K R k key V EN DATA RST NORMAL C.uF TP TP C.uF R k R k C uf R k C nf R k C.uF EN C nf R k R k U BASSR CTRL BASSL ISAP R K C.pF R k INFR INFL R k C.pF R k VSS VREF P S R k DR DL CN CP C.uF R.k C nf C.uF C.uF TP TP CON HP Jack TP Figure : ISAP Application Schematic Integrated Silicon Solution, Inc. Rev. A, //

3 ISAP D AND BASS ENHAE STEREO HEADPHONE BILL OF MATERIALS Name Symbol Description Qty Supplier Part No. Audio Amplifier U D,Bass Stereo Headphone Driver ISSI ISAP Audio Amplifier U Headphone Amplifier HWD HWD LDO U LDO PAM PAM MCU U Microcontroller NXP LPC Relay S Relay, V Panasonic TQ-V Transistor Q Transistor, NPN, Avic MMBTLT Diode D~D Diode, LED Blue, SMD Everlight -/BHC-ZLMRY/T Resistor R,R RES,Ω,/W,±%,SMD Yageo RLJR-RL Resistor R,R RES,k,/W,±%,SMD Yageo RCJR-KL Resistor R,R RES,k,/W,±%,SMD Yageo RCJR-KL Resistor R,R RES,k,/W,±%,SMD Yageo RCFR-KL Resistor R,R,R,R RES,k,/W,±%,SMD Yageo RCFR-KL Resistor R,R RES,k,/W,±%,SMD Yageo RCJR-KL Resistor R,R RES,k,/W,±%,SMD Yageo RCFR-KL Resistor R RES,.k,/W,±%,SMD Yageo RCJR-KL Resistor R~R RES,k,/W,±%,SMD Yageo RCJR-KL Capacitor C,C,C CAP,.µF,V,±%,SMD Yageo CCKKXRBB Capacitor C CAP,µF,V,±%,SMD Yageo CCKKXRBB Capacitor C,C CAP,µF,V,±%,SMD Yageo Capacitor C,C,C CAP,.µF,V,±%,SMD Yageo CCKKXRBB Capacitor C,C,C CAP,µF,V,±%,SMD Yageo CCKKXRBB Capacitor C CAP,nF,V,±%,SMD Yageo CCKKXRBB Capacitor C,C CAP,.pF,V,±%,SMD Yageo CCKKXRBBP Capacitor C,C CAP,nF,V,±%,SMD Yageo CCKKXRBB Capacitor C,C,C CAP,.µF,V,±%,SMD Yageo CCKKXRBB Capacitor C,C CAP,.µF,V,±%,SMD Yageo CCKKXRBB Capacitor C CAP,nF,V,±%,SMD Yageo CCKKXRBB Connector DC IN.mm DC connector Connector AUDIO IN.mm mini connector Connector HP Jack.mm mini connector Bill of Materials, refer to Figure above. Integrated Silicon Solution, Inc. Rev. A, //

4 ISAP D AND BASS ENHAE STEREO HEADPHONE Figure : Board Component Placement Guide - Top Layer Figure : Board PCB Layout - Top Layer Integrated Silicon Solution, Inc. Rev. A, //

5 ISAP D AND BASS ENHAE STEREO HEADPHONE Figure : Board Component Placement Guide - Bottom Layer Figure : Board PCB Layout - Bottom Layer Copyright Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. Rev. A, //