4. Special Function 2 V: 8-GHz band High-speed differential transmission

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Surfacemounting Highfrequency elay 8Hz Band Miniature DPDT High requency elay for Highspeed Differential Transmission Signal Switching Highfrequency characteristics (insertion loss db or less at 8

1 Surfacemounting Highfrequency elay 8Hz Band Miniature DPDT High requency elay for Highspeed Differential Transmission Signal Switching Highfrequency characteristics (insertion loss db or less at 8 Hz) Miniaturized to mm (L W H). ated power consumption of mw with high sensitivity ohs Compliant Model Number Legend. Number of poles/ Contact orm : pole/ DPDT (c). Terminal Shape : OutsideL surface mounting terminals Note. We have a lineup of (U)(P)(S,T) products for Hz/Hz band highfrequency signal applications. Ordering Information. Special unction : Highfrequency compatible. Special unction : 8Hz band Highspeed differential transmission compatible type Application Examples Semiconductor test equipment Test&measurement equipment Communication equipment Standard type specifications Contact type: Bifurcated crossbar Ag (Surface Au alloy) elay unction Enclosure rating Contact form Model ated coil voltage Minimum packing unit Singleside stable ully sealed DPDT (c),.,, DC pcs/tube Note. When ordering, add the rated coil voltage to the model number. Example: DC ated coil voltage However, the notation of the coil voltage on the product case as well as on the packing will be marked DC. atings Contacts Item Load esistive load ated load AC,. A DC, A DC, ma 8 Hz, W * ated carry current A Max. switching voltage AC or DC Max. switching current A * This value is for a.sw of. max. at the load. Highfrequency Characteristics * Item requency 8Hz Differential Insertion loss db max. transmission Isolation db min. characteristics eturn loss (.SW) db min. (.7 max.) Insertion loss db max. Singleended characteristics (reference value) Isolation eturn loss (.SW) Between contacts of the same polarity Between contacts of different polarity db min. db min. Maximum carry power W * Maximum switching power W * db min. (.7 max.) Note. The impedance of the measurement system is Ω. (Differential impedance is Ω.) Note. The above values are initial values. *. Contact your OMON representative if the elay will be used in an application that requires high repeatability in highfrequency characteristics. *. These values are for a.sw of. max. at the load.

2 Surfacemounting Highfrequency elay Coil: Single ated voltage Item Note. The rated current and coil resistance are measured at a coil temperature of C with a tolerance of ±%. Note. The operating characteristics are measured at a coil temperature of C. Note. The maximum voltage is the highest voltage that can be imposed on the elay coil instantaneously. Characteristics ated current (ma) Coil resistance (Ω) DC. 9. DC. 9 DC. 7 DC 9., Must operate voltage () Must release voltage () % of rated voltage Maximum voltage () Power consumption (mw) 8% max. % min. % Approx. Contact resistance * mω max. Operating time * ms max. (approx.. ms) elease time * ms max. (approx..7 ms) Insulation resistance * MΩ min. (at DC) Between coil and contacts AC, / Hz for min Between contacts of Dielectric different polarity AC, / Hz for min strength Between contacts of the same polarity AC, / Hz for min Between ground and coil/contacts AC, / Hz for min ibration Destruction to to Hz,. mm single amplitude ( mm double amplitude) resistance Malfunction to to Hz,. mm single amplitude (. mm double amplitude) Shock Destruction, m/s resistance Malfunction 7 m/s Mechanical,, operations min. (at a switching frequency of, operations/hour) Durability,, operations min. ( DC, ma, at a switching frequency of,8 operations/hour) Electrical, operations min. (Other rated load, at a switching frequency of,8 operations/hour) Ambient operating temperature C to 7 C (with no icing or condensation) Ambient operating humidity % to 8% Weight Approx.. g Note. The above values are initial values. *. The contact resistance was measured with ma at DC with a voltage drop method. *. alues in parentheses are actual values. *. The insulation resistance was measured with a DC megohmmeter applied to the same parts as those used for checking the dielectric strength.

3 Engineering Data Surfacemounting Highfrequency elay Highfrequency characteristics (differential transmission characteristics) Insertion loss Isolation eturn loss,.sw Insertion loss (db) Sample: requency (Hz) Isolation (db) Sample: requency (Hz) Highfrequency characteristics (singleended characteristics) Insertion loss Isolation eturn loss,.sw Insertion loss (db) Isolation (db) Sample: Sample: requency (Hz) requency (Hz) requency (Hz) Note. The highfrequency characteristics depend on the mounting board. Be sure to check operation including durability in actual equipment before use. Note. Ambient temperature condition: C. Note. The impedance of the measurement system is Ω. (Differential impedance is Ω.) Note. S parameter (Touchstone format) data used for circuit simulation is available. Please inquire. eturn loss (db) eturn loss (db) eturn loss Sample:..SW requency (Hz) eturn loss... Sample:..SW....SW.SW

4 Surfacemounting Highfrequency elay Highfrequency characteristics (Signal Integrity, differential transmission) at 8. bps at bps at. bps Contact Contact Contact oltage (m) oltage (m) oltage (m) Eye Height Eye Width Jitter PP 7 m. ps. ps 8 8 Eye Height Eye Width Jitter PP 77 m 9. ps. ps 8 Eye Height Eye Width Jitter PP 7 m 7. ps.8 ps Contact Contact Contact oltage (m) oltage (m) oltage (m) Eye Height Eye Width Jitter PP m. ps 7. ps 8 8 Eye Height Eye Width Jitter PP 7 m 9. ps. ps 8 Eye Height Eye Width Jitter PP 7 m 7. ps. ps Conditions PBS signal Input differential voltage m ise time 9% Note. Ambient temperature condition: C. Note. The impedance of the measurement system is Ω. (Differential impedance is Ω.) Note. This data includes loss due to the test board. Propagation delay time Item Propagation delay time (ps) (typical value) Contact 7. Contact. Note. Ambient temperature condition: C. Note. The impedance of the measurement system is Ω. (Differential impedance is Ω.) Conditions elay input waveform oltage ise time 9% 9% % Time % elay output waveform oltage % Propagation delay time Time

Dimensions Surfacemounting Highfrequency elay (Unit: mm).7±. 7.9±. Mounting Dimensions (Top iew) Tolerance: ±. mm Terminal Arrangement/ Internal Connections TOP IEW.7..8.8. 7. 8.89..±. 7. (.7) (.8) 8.

5 Dimensions Surfacemounting Highfrequency elay (Unit: mm).7±. 7.9±. Mounting Dimensions (Top iew) Tolerance: ±. mm Terminal Arrangement/ Internal Connections TOP IEW ±. 7. (.7) (.8) 8.±.. (.8)..7 (9.) Orientation mark Note. Check carefully the coil polarity of the elay. Note. Each value has a tolerance of ±. mm..7 Note. The coplanarity of the terminals is. mm max. Note. The dimensions of the printed circuit board work drawing are a recommended example that take soldering into consideration. requency characteristics vary depending on the band dimensions, so check the effect on highfrequency characteristics using a test board before use. Package specifications Tube Packing in tube packing are arranged so that the orientation mark of each elay in on the left side. Be sure not to make mistakes in elay orientation when mounting the elay to the PCB. Stopper (gray) Orientation of elays Stopper (green) Tube length: mm (stopper not included) No. of elays per tube: pcs

6 ecommended Soldering Method ecommended Conditions for IS Method (Surfacemounting Terminals) () IS Method (Mounting Solder: Lead) Temperature ( C) ~ 8~ Soldering Surfacemounting Highfrequency elay The thickness of cream solder to be applied should be between and μm and the land pattern should be based on OMON s recommended PCB pattern. To maintain the correct soldering joint shown in the following diagram, we recommend applying solder with the soldering conditions shown on the left. Correct Soldering elay Terminal Incorrect Soldering Preheating Heel fillet is formed Land PCB Solder Insufficient amount of solder Excessive amount of solder 9~ ~ Time (s) (The temperature profile indicates the temperature on the circuit board surface.) () IS Method (Mounting Solder: Leadfree) Check the soldering in the actual mounting conditions before use. Temperature ( C) max. Case top panel (peak): C max. Soldering 8 Preheating elay terminal section max. max. Time (s) (The temperature profile indicates the temperature on the PCB.)

Safety Precautions Surfacemounting Highfrequency elay or general precautions on PCB elays, refer to the precautions provided in eneral Information of the elay Product Data Book.

7 Safety Precautions Surfacemounting Highfrequency elay or general precautions on PCB elays, refer to the precautions provided in eneral Information of the elay Product Data Book. Correct Use elay Handling Use the elay as soon as possible after opening the moistureproof package. (As a guideline, use the elay within one week at C or less and % H or less.) If the elay is left for a long time after opening the moistureproof package, the appearance may suffer and seal failure may occur after the solder mounting process. To store the elay after opening the moistureproof package, place it into the original package and seal the package with adhesive tape. When washing the product after soldering the elay to a PCB, use a waterbased solvent or alcoholbased solvent and keep the solvent temperature to less than C. Do not put the elay in a cold cleaning bath immediately after soldering. Coating Do not use silicone coating to coat the elay when it is mounted to the PCB. Do not wash the PCB after the elay is mounted using detergent containing silicone. Otherwise, the detergent may remain on the surface of the elay. epeatability Contact your OMON representative if the elay will be used in an application that requires high repeatability in highfrequency characteristics and contact resistance. Environmental Conditions for Usage, Storage, and Transport Avoid direct sunlight when using, storing, or transporting the elay and maintain normal temperature, humidity, and pressure conditions. Longterm, Continuous ON Contacts Using the elay in a circuit where the elay will be ON continuously for long periods (rather than switching) can lead to unstable contacts because the heat generated by the coil itself will affect the insulation and can cause a film to develop on the contact surfaces. We recommend using a latching relay (magneticholding relay) in this kind of circuit. If a singleside stable model must be used in this kind of circuit, we recommend adding failsafe circuits in case the contact fails or the coil burns out. Claw Securing orce During Automatic Mounting During automatic insertion of elays, be sure to set the securing force of each claw to the following so that the elay s characteristics will be maintained. A C B Direction A:.9 N max. Direction B:.9 N max. Direction C:.9 N max. Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. Consult your OMON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. Note: Do not use this document to operate the Unit. OMON Corporation Electronic and Mechanical Components Company Contact: Cat. No. 9E 97(7)(O) 7

8 Mouser Electronics Authorized Distributor Click to iew Pricing, Inventory, Delivery & Lifecycle Information: Omron: DC DC. DC

G6K(U)-2F(P)-RF(-S, -T)

G6K(U)-2F(P)-RF(-S, -T) Surfacemounting, 1HzBand/ 3HzBand, Miniature, DD, Highfrequency elay Superior highfrequency characteristics at 1 Hz, such as an isolation of db min. between contacts of the same polarity or 3 db min. between