MMP PIN Diode Data Sheet Rev A

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Kathryn Carson
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Rev A Features Low Series Resistance for Low Insertion Loss and High Isolation: R S < 1.2 Ω Low Junction Capacitance for Low Insertion Loss and High Isolation: C J < 0.

switching, low series resistance, low capacitance PIN diode packaged in a surface mount ceramic carrier package. This diode is also available as a chip or in several other package styles.

The low junction capacitance and series resistance of the MMP7062 19 1 combine to produce outstanding insertion loss, isolation and switching time.

1 Rev A Features Low Series Resistance for Low Insertion Loss and High Isolation: R S < 1.2 Ω Low Junction Capacitance for Low Insertion Loss and High Isolation: C J < 0.1 pf Low Thermal Resistance: < 45 ºC/W Available in Several Package Styles RoHS Compliant Applications Fast switching, moderate power switches Description The MMP PIN diode is a fast switching, low series resistance, low capacitance PIN diode packaged in a surface mount ceramic carrier package. This diode is also available as a chip or in several other package styles. It is manufactured using Aeroflex/Metelics proven diode fabrication process which optimizes diode characteristics for optimal electrical performance and excellent reliability. The low junction capacitance and series resistance of the MMP combine to produce outstanding insertion loss, isolation and switching time. The MMP PIN Diode is designed to be used in moderate peak and average power switch applications which require low switching time. It performs exceptionally well from VHF through microwave frequencies. The low thermal resistance (< 45 ºC/W typical) of the MMP enables the device to safely handle moderately high power signals in high frequency switching applications. This rugged device is capable of reliable operation in all military, commercial and industrial applications. The device is RoHS compliant. DS Rev.A, ECN Page: 1 of 6 FA Rev. A, ECN 9922

2 Environmental Capabilities The MMP PIN diode is capable of meeting the environmental requirements of MIL STD 750 and MIL STD 883. ESD and MSL Ratings As are all semiconductors, PIN Diodes are susceptible to damage from ESD events. Proper ESD prevention procedures should be followed. The ESD rating for this device is Class 1A (HBM). The MMP PIN diode is MSL1. MMP Electrical Specifications T A = 25 ºC (unless otherwise noted) Parameter Symbol Test Conditions Minimum Typical Maximum Value Value Value Units Breakdown Voltage V B I R = 10 μa 250 V Reverse Leakage Current I R V R = 100 V na Forward Voltage V F I F = 100 ma V Series Resistance (note 1) R S1 I F = 1 ma, f = 100 MHz 15 Ω R S10 I F = 10 ma, f = 100 MHz 6 Ω R S100 I F = 100 ma, f = 100 MHz 1.2 Ω Junction Capacitance (note 2) C J V R = 50 V, f = 1 MHz 0.1 pf Minority Carrier Lifetime T L 50% control to 90 % output voltage, I F = 10 ma, I R = 6 ma, f = 1 khz 1 µs I Layer Thickness W 70 µm CW Thermal Resistance θ JC I H = 2.5 A, I L = 10 ma ºC/W Package Capacitance C PKG CS pf Package Inductance L PKG CS nh Notes: 1. Series resistance (R S ) is measured on the HP 4291 Impedance Analyzer. 2. Total capacitance (C T ) is the sum of the diode junction capacitance (C J ) and the package capacitance (C PKG ). DS Rev.A, ECN Page: 2 of 6 FA Rev. A, ECN 9922

3 Absolute Maximum Ratings T A = + 25 ºC (Unless otherwise noted) Parameter Conditions Absolute Maximum Value Forward DC Current 150 ma Reverse DC Voltage 250 V Forward DC Voltage I F = 150 ma 1.3 V Operating Temperature 65 ºC to 125 ºC Storage Temperature 65 ºC to 150 ºC Junction Temperature 175 ºC Assembly Temperature t = 10 s 260 ºC Total Dissipated Power Infinite heat sink, T case = 25 ºC. Derate power linearly from ºC to ºC 750 mw MMP Typical Performance T A = + 25 ºC (Unless otherwise noted) Series Resistance (ohms) Forward Current (ma) Series Resistance vs. Forward Current, f = 100 MHz DS Rev.A, ECN Page: 3 of 6 FA Rev. A, ECN 9922

Assembly Instructions MMP7062 19 1 PIN Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape reel.

4 Assembly Instructions MMP PIN Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape reel. The devices are attached to the circuit using conventional solder re flow or wave soldering procedures with RoHS type or Sn60 / Pb40 type solders. The recommended time temperature profiles are shown below. Time Temperature Profile for Sn60/Pb40 or RoHS Type Solders Profile Feature SnPb Solder Assembly Pb Free Solder Assembly Average Ramp Up Rate (T L to T P ) 3 ºC/second maximum 3 ºC/second maximum Pre heat Temperature Min (T SMIN ) Temperature Max (T SMAX ) Time (min to max)(t S ) T SMAX to T L Ramp Up Rate Time Maintained Above Temperature (T L ) Time (t L ) 100 ºC 150 ºC seconds 150 ºC 200 ºC seconds 3 ºC/second maximum 183 ºC seconds 217 ºC seconds Peak temperature (T P ) / 5 ºC / 5 ºC Time Within 5 ºC of Actual Peak Temperature (t P ) seconds seconds Ramp Down Rate 6 ºC/second maximum 6 ºC/second maximum Time 25 ºC to Peak Temperature 6 minutes maximum 8 minutes maximum Solder Re Flow Time Temperature Profile DS Rev.A, ECN Page: 4 of 6 FA Rev. A, ECN 9922

5 Suggested PCB Pad Layout CS19 1 Case Style CS19 1 Outline DS Rev.A, ECN Page: 5 of 6 FA Rev. A, ECN 9922

6 Part Number Ordering Information Part Number Description Packaging MMP R PIN Diode Tape Reel Packaging (Quantity = 3,000) MMP W PIN Diode Waffle Pack (Quantity = 100) East Coast Operations Aeroflex / Metelics 54 Grenier Field Road Londonderry, NH [USA] Phone: (603) Toll Free: (888) 641 SEMI (7364) Fax: (603) Aeroflex / Metelics, Inc. reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of a product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Copyright 2008 Aeroflex / Metelics. All rights reserved. DS Rev.A, ECN Page: 6 of 6 FA Rev. A, ECN 9922

Surface Mount Limiter, GHz

Surface Mount Limiter, GHz Surface Mount Limiter, 2.9 3.3 GHz LM2933-Q-B-301 Datasheet Features Surface Mount Limiter in Compact Package: 8 mm L x 5 mm W x 2.5 mm H Incorporates PIN Limiter Diodes, DC Blocks, Schottky Diode & DC