REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED. B Drawing updated to reflect current requirements. -sld Raymond Monnin

Transcription

1 REVISIONS LTR ESCRIPTION ATE (YR-MO-A) APPROVE A Added note to paragraph and table I regarding the 4 traistor design. Paragraph 1.3; changed the power dissipation for device types 05- from 2.9 W max to 3.3 W max. Table I; changed the ICC max limit for device types 05- from 520 ma to 600 ma. Table I; changed the ICCR1 max limit from 12 ma to 28 ma. Figure 1; changed dimeion A minimum from inches to inches. Redrew entire document. - sld Michael Jones B rawing updated to reflect current requirements. -sld Raymond Monnin C Table I; Changed the maximum limit for COE and CA tests from 32 pf to 30 pf. -sld Raymond Monnin Update drawing to latest requirements of MIL-PRF gc Charles F. Saffle REV REV REV STATUS REV OF S PMIC N/A STANAR MICROCIRCUIT RAWING THIS RAWING IS AVAILABLE FOR USE BY ALL EPARTMENTS AN AGENCIES OF THE EPARTMENT OF EFENSE PREPARE BY Gary Zahn CHECKE BY Michael C. Jones APPROVE BY Kendall A. Cottongim RAWING APPROVAL ATE LA LAN AN MARITIME MICROCIRCUIT, HYBRI, MEMORY, IGITAL, 512K x 32-BIT, STATIC RANOM ACCESS MEMORY, CMOS AMSC N/A A CAGE COE SCC FORM OF E ISTRIBUTION STATEMENT A. Approved for public release. istribution is unlimited.

2 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph and MIL-PRF A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: H N C Federal RHA evice evice Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \/ rawing number Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF specified RHA levels and are be marked with the appropriate RHA designator. A dash (-) indicates a non-rha device evice type(s). The device type(s) identify the circuit function as follows: evice type 1/ Generic number Circuit function Access time 01 WS512K32F-120G4Q SRAM, 512K x 32-bit WS512K32F-100G4Q SRAM, 512K x 32-bit WS512K32F-85G4Q SRAM, 512K x 32-bit WS512K32F-70G4Q SRAM, 512K x 32-bit WS512K32F-55G4Q SRAM, 512K x 32-bit WS512K32F-45G4Q SRAM, 512K x 32-bit WS512K32F-G4Q SRAM, 512K x 32-bit 08 WS512K32F-G4Q SRAM, 512K x 32-bit WS512K32F-20G4Q SRAM, 512K x 32-bit WS512K32M-45G4Q SRAM, 512K x 32-bit WS512K32M-G4Q SRAM, 512K x 32-bit 12 WS512K32M-G4Q SRAM, 512K x 32-bit evice class designator. This device class designator is a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and ). The product assurance levels are as follows: evice class K H evice performance documentation Highest reliability class available. This level is intended for use in space applicatio. Standard military quality class level. This level is intended for use in applicatio where non-space high reliability devices are required. 1/ ue to the nature of the 4 traistor design of the die in these device types, topologically pure testing is important, particularly for high reliability applicatio. The device manufacturer should be coulted concerning their testing methods and algorithms. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 2 SCC FORM 2234

3 G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Ipectio with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance ipectio (Group A, B, C and ). E esignates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to eure that the exception(s) taken will not adversely affect system performance. Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range Case outline(s). The case outlines are as designated in MIL-ST-18 and as follows: Outline letter escriptive designator Terminals Package style N See figure 1 68 Co-fired, single cavity, quad flat pack, low capacitance Lead finish. The lead finish is as specified in MIL-PRF Absolute maximum ratings. 1/ Supply voltage range (V CC) V dc to +7.0 V dc Signal voltage range (V G) V dc to +7.0 V dc Power dissipation (P ) : evice types 01 through W Maximum at 5 MHz evice types 10 through W Maximum at 5 MHz Storage temperature range C to +150 C Lead temperature (soldering, 10 seconds) C 1.4 Recommended operating conditio. Supply voltage range (V CC) V dc to +5.5 V dc Input low voltage range (V IL) V dc to +0.8 V dc Input high voltage range (V IH) V dc to V CC V dc Case operating temperature range (T C) C to +1 C 2. APPLICABLE OCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. EPARTMENT OF EFENSE SPECIFICATION MIL-PRF Hybrid Microcircuits, General Specification for. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 3 SCC FORM 2234

4 EPARTMENT OF EFENSE STANARS MIL-ST Test Method Standard Microcircuits. MIL-ST-18 - Interface Standard for Electronic Component Case Outlines. EPARTMENT OF EFENSE HANBOOKS MIL-HBK List of Standard Microcircuit rawings. MIL-HBK Standard Microcircuit rawings. (Copies of these documents are available online at or from the Standardization ocument Order esk, 700 Robbi Avenue, Building 4, Philadelphia, PA ) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulatio unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes, E, G, H, and K shall be in accordance with MIL-PRF Compliance with MIL-PRF shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and ipectio herein, however the performance requirements as defined in MIL-PRF shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 esign, cotruction, and physical dimeio. The design, cotruction, and physical dimeio shall be as specified in MIL-PRF and herein Case outline(s). The case outline(s) shall be in accordance with herein and figure Terminal connectio. The terminal connectio shall be as specified on figure Truth table(s). The truth table(s) shall be as specified on figure Logic diagram(s). The logic diagram(s) shall be as specified on figures 4 and Block diagram. The block diagram shall be as specified on figure Output load circuit. The output load circuit shall be as specified on figure Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 ata. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance ipection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (LA Land and Maritime-VA) upon request. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 4 SCC FORM 2234

5 TABLE I. Electrical performance characteristics. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit C parameters Input leakage current ILI VCC = 5.5 V dc, VIN = GN or VCC 1,2,3 All 10 µa Output leakage current ILO CS = VIH, OE = VIH, VOUT = GN or VCC 1,2,3 All 10 µa Operating supply current ICC CS = VIL, OE = VIH, f = 5 MHz, VCC = 5.5 V dc 1,2, ma Standby current ISB CS = VIH, OE = VIH, f = 5 MHz, VCC = 5.5 V dc 1,2, ma Input low level VIL 1,2,3 All 0.8 V Input high level VIH 1,2,3 All 2.2 V Output low voltage VOL VCC = 4.5 V, IOL = 2.1 ma 1,2, V VCC = 4.5 V, IOL = 8.0 ma 1,2, Output high voltage VOH VCC = 4.5 V, IOL = -1.0 ma 1,2, V VCC = 4.5 V, IOL = -4.0 ma 1,2, ynamic characteristics OE capacitance 4/ COE VIN = 0 V, f = 1.0 MHz, TA = + C 4 All 30 pf WE capacitance 4/ CWE VIN = 0 V, f = 1.0 MHz, TA = + C 4 All 32 pf CS 1-4 capacitance 4/ CCS VIN = 0 V, f = 1.0 MHz, TA = + C 4 All 15 pf ata I/O capacitance 4/ CI/O VIN = 0 V, f = 1.0 MHz, TA = + C 4 All 15 pf See footnotes at end of table. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 5 SCC FORM 2234

6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit ynamic characteristics - Continued Address input capacitance 4/ CA VIN = 0 V, f = 1.0 MHz, TA = + C 4 All 30 pf Functional testing Functional tests See 4.3.1c 7,8A,8B All ata retention characteristics ata retention supply voltage VR CS VR V 9,10,11 All V ata retention current ICCR1 VCC = 3 V 9,10, Read cycle AC timing characteristics ma Read cycle time trc See figure 4 9,10, , Address access time taa See figure 4 9,10, ,10 See footnotes at end of table STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 6 SCC FORM 2234

7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit Read cycle AC timing characterisitics - Continued Chip select access time tacs See figure 4 9,10, ,10 Output enable to output valid toe See figure 4 9,10, , Output hold from address change toh See figure 4 9,10, Write AC timing characteristics WE controlled Write cycle time twc See figure 5 9,10, ,10 See footnotes at end of table STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 7 SCC FORM 2234

8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit Write AC timing characteristics WE controlled - Continued Chip select to end of write tcw See figure 5 9,10, ,10 Address valid to end of write taw See figure 5 9,10, ,10 ata valid to end of write tw See figure 5 9,10,11 01,02 03,04,10 05, Write pulse width twp See figure 5 9,10,11 01,02 03, ,10 Address setup time tas See figure 5 9,10, See footnotes at end of table STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 8 SCC FORM 2234

9 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit Write AC timing characteristics WE controlled - Continued Address hold time tah See figure 5 9,10, ata hold time th See figure 5 9,10,11 All 0 Write AC timing characteristics CS controlled Write cycle time twc See figure 5 9,10, ,10 Chip select to end of write tcw See figure 5 9,10, ,10 Address valid to end of write taw See figure 5 9,10, ,10 See footnotes at end of table STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 9 SCC FORM 2234

10 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditio 1/ 2/ -55 C TC +1 C unless otherwise specified Group A subgroups evice types Min Limits Max Unit Write AC timing characteristics CS controlled - Continued ata valid to end of write tw See figure 5 9,10,11 01,02 03,04,10 05, Write pulse width twp See figure 5 9,10,11 01,02 03, ,10 Address setup time tas See figure 5 9,10, Address hold time tah See figure 5 9,10, ata hold time th See figure 5 9,10,11 All 0 1/ Unless otherwise specified, 4.5 V dc VCC 5.5 V dc and VSS = 0. 2/ Unless otherwise specified, the C test conditio are as follows: Input pulse levels: VIH = VCC V and VIL = 0.3 V. Unless otherwise specified, the AC test conditio are as follows: Input pulse levels: VIL = 0 V and VIH = 3.0 V. Input rise and fall times: 5 nanoseconds. Input and output timing reference levels: 1.5 V. ue to the nature of the 4 traistor design of the die used in these device types, topologically pure testing is important, particularly for high reliability applicatio. The device manufacturer should be coulted concerning their testing methods and alogorithms. 4/ Guaranteed by design, but not tested. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 10 SCC FORM 2234

11 Case outline N. FIGURE 1. Case outline(s). STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 11 SCC FORM 2234

12 Case outline N - Continued. Symbol Millimeters Inches Min Max Min Max A A A b C /E /E /E e e j k L S NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 12 SCC FORM 2234

13 evice types All evice types All evice types All evice types All Case outlines N Case outlines N Case outlines N Case outlines N Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GN 18 GN OE 52 GN 2 CS 1 19 I/O8 36 CS 4 53 I/O23 3 A5 20 I/O9 37 A17 54 I/O22 4 A4 21 I/O10 38 A18 55 I/O21 5 A3 22 I/O11 39 NC 56 I/O20 6 A2 23 I/O12 40 NC 57 I/O19 7 A1 24 I/O13 41 NC 58 I/O18 8 A0 I/O14 42 NC 59 I/O17 9 NC 26 I/O15 43 NC 60 I/O16 10 I/O0 27 VCC 44 I/O31 61 VCC 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 30 A13 47 I/O28 64 A8 14 I/O4 31 A14 48 I/O27 65 A7 15 I/O5 32 A15 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O 67 WE 17 I/O7 34 CS 2 51 I/O24 68 CS 3 FIGURE 2. Terminal connectio. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 13 SCC FORM 2234

14 CS OE WE I/O Power Mode V IH X X High Z Standby Standby V IL V IL V IH High Z Active Read V IL V IH V IH High Z Active Output disable V IL X V IL ata In Active Write NOTES: 1. V IH = High Logic Level 2. V IL = Low Logic Level 3. X = o not care (either high or low) 4. High Z = High Impedance State FIGURE 3. Truth table. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 14 SCC FORM 2234

15 FIGURE 4. Read cycle timing diagrams. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 15 SCC FORM 2234

16 FIGURE 5. Write cycle timing diagrams. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 16 SCC FORM 2234

17 FIGURE 6. Block diagram. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 17 SCC FORM 2234

18 Parameter Typ. Unit Input Pulse Level V Input Rise and Fall 5 Input and Output Reference Level 1.5 V Output Load Capacitance 50 pf NOTES: 1. V Z is programmable from +2 V to +7 V. 2. I OL and I OH are programmable from 0 to 16 ma. 3. Tester impedance is Z 0 = 75 ohms. 4. V Z is typically the midpoint of V OL and V OH. 5. I OL and I OH are adjusted to simulate a typical resistive load circuit. 6. ATE tester includes jig capacitance. FIGURE 7. Output load circuit. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 18 SCC FORM 2234

19 TABLE II. Electrical test requirements. MIL-PRF test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1,4,7,9 Final electrical parameters 1*,2,3,4,7,8A,8B,9,10,11 Group A test requirements 1,2,3,4,7,8A,8B,9,10,11 Group C end-point electrical parameters End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1,2,3,4,7,8A,8B,9,10,11 Not applicable * PA applies to subgroup Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to LA Land and Maritime-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and ipection. Sampling and ipection procedures shall be in accordance with MIL-PRF or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-ST-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either LA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-ST-883. (2) TA as specified in accordance with table I of method 1015 of MIL-ST-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic ipectio. Conformance ipection (CI) and periodic ipection (PI) shall be in accordance with MIL-PRF and as specified herein. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 19 SCC FORM 2234

20 4.3.1 Group A ipection (CI). Group A ipection shall be in accordance with MIL-PRF and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table on figure Group B ipection (PI). Group B ipection shall be in accordance with MIL-PRF Group C ipection (PI). Group C ipection shall be in accordance with MIL-PRF and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-ST-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either LA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-ST-883. (2) TA as specified in accordance with table I of method 1005 of MIL-ST-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-ST Group ipection (PI). Group ipection shall be in accordance with MIL-PRF Radiation Hardness Assurance (RHA) ipection. RHA ipection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applicatio (original equipment), design applicatio, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SM's. All proposed changes to existing SM's will be coordinated as specified in MIL-PRF Record of users. Military and industrial users should inform LA Land and Maritime when a system application requires configuration control and the applicable SM. LA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact LA Land and Maritime-VA, telephone (614) Comments. Comments on this drawing should be directed to LA Land and Maritime-VA, Columbus, Ohio , or telephone (614) Sources of supply. Sources of supply are listed in MIL-HBK-103 and QML The vendors listed in MIL-HBK-103 and QML have submitted a certificate of compliance (see 3.7 herein) to LA Land and Maritime-VA and have agreed to this drawing. STANAR MICROCIRCUIT RAWING LA LAN AN MARITIME 20 SCC FORM 2234

21 STANAR MICROCIRCUIT RAWING BULLETIN ATE: Approved sources of supply for SM are listed below for immediate acquisition information only and shall be added to MIL-HBK-103 and QML during the next revisio. MIL-HBK-103 and QML will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by LA Land and Maritime -VA. This information bulletin is superseded by the next dated revisio of MIL-HBK-103 and QML LA Land and Maritime maintai an online database of all current sources of supply at Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC WS512K32F-120G4Q HNC WS512K32F-100G4Q HNC WS512K32F-120G4Q, WS512K32F-120G4TQ WS512K32F-100G4Q, WS512K32F-100G4TQ WS512K32F-85G4Q, WS512K32F-85G4TQ WS512K32F-70G4Q, WS512K32F-70G4TQ WS512K32F-55G4Q, WS512K32F-55G4TQ WS512K32F-45G4Q, WS512K32F-45G4TQ WS512K32F-G4Q, WS512K32F-G4TQ WS512K32F-G4Q, WS512K32F-G4TQ WS512K32F-20G4Q, WS512K32F-20G4TQ WS512K32M-45G4Q, WS512K32M-45G4TQ WS512K32M-G4Q, WS512K32M-G4TQ WS512K32M-G4Q, WS512K32M-G4TQ WS512K32F-85G4Q HNC WS512K32F-70G4Q HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC HNC See footnotes at end of table WS512K32F-55G4Q AS8S512K32BQFP-55/883C WS512K32F-45G4Q AS8S512K32BQFP-45/883C WS512K32F-G4Q AS8S512K32BQFP-/883C WS512K32F-G4Q AS8S512K32BQFP-/883C WS512K32F-20G4Q AS8S512K32BQFP-20/883C WS512K32M-45G4Q AS8S512K32BQFP-45/883C WS512K32M-G4Q AS8S512K32BQFP-/883C WS512K32M-G4Q AS8S512K32BQFP-/883C 1 of 2

22 STANAR MICROCIRCUIT RAWING SOURCE APPROVAL BULLETIN - Continued. ATE: / The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. o not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Not available from an approved source of supply. Vendor CAGE number Vendor name and address Mercury Systems, Inc E. University rive Phoenix, AZ Micross Components 77 N. Orange Blossom Trail Orlando, FL The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2