REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED. B Updated drawing to the latest requirements. -sld Raymond Monnin

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1 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor for device type 02XX. Change to reflect MIL-H processing. Editiorial changes throughout G.A. Lude B Updated drawing to the latest requirements. -sld Raymond Monnin C D E Added footnote 1 to table II, under group C end-point electricals. Updated drawing paragraphs. -sld Table I; added the Bipolar input (coding) test across -10V to +10 V range. Added 2/ to the Unipolar input (coding) 0 to +5V range and the Bipolar input (coding) -2.5 V to +2.5 V range tests. Changed the test condition for the Bipolar input (coding) from -5V to +5.5 V to -5 V to +5 V range. Renamed the "Bipolar offset error" test to "Bipolar zero error" and "Bipolar offset gain error" to "Bipolar zero drift ". -sld Table I; Removed the differential nonlinearity drift test. Added footnote 2 to the serial to parallel match test. Updated drawing paragraphs. - sld Charles. Saffle Charles. Saffle Charles. Saffle Update drawing to the latest requirements of MIL-PR gc Charles. Saffle THE ORIGINAL IRST O THIS DRAWING HAS BEEN REPLACED REV REV REV STATUS O S PMIC N/A MICROCIRCUIT DRAWING REV PREPARED BY Gary Zahn CHECKED BY Michael C. Jones THIS DRAWING IS AVAILABLE OR USE BY ALL DEPARTMENTS AND AGENCIES O THE DEPARTMENT O DEENSE APPROVED BY Gregory Lude DRAWING APPROVAL DATE MICROCIRCUIT, HYBRID, LINEAR, 12-BIT ANALOG TO DIGITAL CONVERTER AMSC N/A A CAGE CODE DSCC ORM O E DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

2 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PR PIN. The PIN is as shown in the following example: X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Conversion time 01 ADC-HX 12-bit A/D converter 20 µs 02 ADC-HZ, MNADC87 12-bit A/D converter 8 µs Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 32 Dual-in-line Lead finish. The lead finish is as specified in MIL-PR Absolute maximum ratings. 1/ Positive supply voltage range (VCC)... Negative supply voltage range (VEE)... Logic supply voltage range (VDD)... Analog input voltage... Buffer input voltage... Digital inputs... Junction temperature (TJ)... Storage temperature... Power dissipation (PD), TC = +25 C... Lead temperature (soldering, 10 seconds)... Thermal resistance: Junction-to-case (θjc)... Junction-to-ambient (θja) V to +18 V dc +0.3 V to -18 V dc -0.3 V to +7 V dc -25 V ±VS +5.5 V +175 C -65 C to +150 C 2 W +300 C 13 C/W 41 C/W 1.4 Recommended operating conditions. Positive supply voltage range (VCC)... Negative supply voltage range (VEE)... Logic supply voltage range (VDD)... Ambient operating temperature range (TA) to V dc to V dc +4.5 V to +5.5 V dc -55 C to +125 C 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2 DSCC ORM 2234

3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O DEENSE SPECIICATIONS MIL-PR Hybrid Microcircuits, General Specification for. DEPARTMENT O DEENSE S MIL-STD Test Method Standard Microcircuits. MIL-STD Interface Standard Electronic Component Case Outlines. DEPARTMENT O DEENSE HANDBOOKS MIL-HDBK List of Standard Microcircuit Drawings. MIL-HDBK Standard Microcircuit Drawings. (Copies of these documents are available online at or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA ) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PR Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PR and herein Case outline(s). The case outline(s) shall be in accordance with herein and figure Terminal connections. The terminal connections shall be as specified on figure unctional diagram and input connection table. The functional diagram and input connection table shall be as specified on figure Truth table(s). The truth table(s) shall be as specified on figure Timing diagram. The timing diagram shall be as specified on figure Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PR The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3 DSCC ORM 2234

4 3.6 Data. In addition to the general performance requirements of MIL-PR-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PR and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PR shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PR or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4 DSCC ORM 2234

5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55 C TA +125 C unless otherwise specified Group A subgroups Device types Min Limits Max Unit Resolution RES Digital and serial 1,2,3 All 12 BIT Unipolar coding UC Complementary binary, (see 4.3.1b) Bipolar coding BC Complementary offset binary, (see 4.3.1b) 7,8 All 7,8 All Unipolar input (coding) Unipolar input (coding) 0 to +10 V range, TA = +25 C, See figure 3 for input connections, (see 4.3.1b) 0 to +5 V range, TA = +25 C, See figure 3 for input connections, (see 4.3.1b) 2/ 7 All 7 All Bipolar input (coding) -2.5 V to +2.5 V range, TA = +25 C, See figure 3 for input connections, (see 4.3.1b) 2/ Bipolar input (coding) -5 V to +5 V range, TA = +25 C, See figure 3 for input connections, (see 4.3.1b) Bipolar input (coding) -10 V to +10 V range, TA = +25 C, See figure 3 for input connections, (see 4.3.1b) 7 All 7 All 7 All Buffer bias I BIAS TA = +25 C 2/ 1 All 250 na Buffer offset error BUOE 1,2,3 All 10 mv Nonlinearity NL End-point method 4 All 0.5 LSB 5,6 1 Differential nonlinearity DNL 4 All LSB 5, See footnotes at end of table. 5 DSCC ORM 2234

6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55 C TA +125 C unless otherwise specified Group A subgroups Device type Min Limits Max Unit Unipolar gain error UGE 0 to 10 V range 4 All 0.2 %SR 5,6 0.4 Unipolar gain error drift UGE / T 0 V to 10 V range, TA = -55 C, +125 C 8 All 20 ppmsr / C Bipolar gain error BGE -10 V to +10 V range 4 All 0.2 %SR 5,6 All 0.4 Bipolar gain error drift BGE / T TA = -55 C, +125 C, -10 V to +10 V range, see figure 3 for input connections 8 All 20 ppmsr / C Unipolar offset error UOE 0 to +10 V range, see figure 3 for input connections 4 All 0.1 %SR 5,6 0.2 Unipolar offset error drift UOE / T TA = -55 C, +125 C, 0 to +10 V range, see figure 3 for input connections 8 All 5 ppm/ C Bipolar zero error BZE -10 V to +10 V range, see figure 3 for input connections 1 All 0.2 %SR 2,3 0.4 Bipolar zero drift BZE / T TA = -55 C, +125 C, -10 V to +10 V range, see figure 3 for input connections 8 All 10 ppm/ C No missing codes NMC Abbreviated test 4,5,6 All pass BIT See footnotes at end of table. 6 DSCC ORM 2234

7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55 C TA +125 C unless otherwise specified Group A subgroups Device type Min Limits Max Unit Conversion time tc See figure 5 9,10, µs 02 8 Internal reference error VRE rom V, TA = +25 C 1 All mv Internal reference error drift VRE / T TA = -55 C, +125 C 8 All 20 ppm/ C Serial/parallel match 2/ MTCH Random codes, TA = +25 C 7 All pass Digital output voltage (high) VOH 2 TTL loads 1,2,3 All 2.4 V Digital output voltage (low) VOL 2 TTL loads 1,2,3 All 0.4 V Power supply rejection ratio (low) PSRR VS = ±5% 1,2,3 All %/%VS Positive supply current ICC VCC = V 1,2,3 All 35 ma Negative supply current IEE VEE = V 1,2,3 All -40 ma Logic supply current IDD VDD = +5.5 V 1,2,3 All 124 ma Power dissipation PD Nominal supply voltages 1,2,3 All 1.69 W 1/ Unless otherwise specified the following conditions apply: VCC = +15 V dc VEE = -15 V dc VDD = +5 V dc Logic "0" = +0.8 V dc Logic "1" = +2.0 V dc VSR = 20 V Bipolar operation 2/ Parameter shall be tested as part of device initial characterization and after design and process changes. Parameter shall be guaranteed to the limits specified in table I for all lots not specifically tested. 7 DSCC ORM 2234

8 Symbol Inches Millimeters Min Max Min Max A B C D TYP 1.02 TYP G.100 BASIC 2.54 BASIC H J K L N NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Leads in true position within inch (0.25 mm) R at NMC at seating plane. 3. Pin numbers shown for reference only. Pin 1 index is required. IGURE 1. Case outline. 8 DSCC ORM 2234

9 Device types All Device types All Case outline X Case outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 Bit 12 out (LSB) 17 Clock rate 2 Bit 11 out 18 Ref out 3 Bit 10 out 19 Clock out 4 Bit 9 out 20 E.O.C. (status) 5 Bit 8 out 21 Start convert 6 Bit 7 out 22 Compare input 7 Bit 6 out 23 Bipolar offset 8 Bit 5 out V range 9 Bit 4 out V range 10 Bit 3 out 26 Analog com 11 Bit 2 out 27 Gain ADJ 12 Bit 1 out (MSB) 28 VCC 13 Bit 1out (MSB) 29 Buffer output 14 Short cycle 30 Buffer input 15 Digital com 31 VEE 16 VDD 32 Serial output IGURE 2. Terminal connections. 9 DSCC ORM 2234

10 unctional diagram Input connection table Input voltage range Without buffer Input Pin With buffer Input pin Connect these pins together Connect these pins together 0 to +5 V to to to to to 24 0 to +10 V to to to 24 ±2.5 V to to to to to 24 ±5 V to to to 24 ±10 V to to to 25 IGURE 3. unctional diagram and input connection table. 10 DSCC ORM 2234

11 Unipolar coding table Input range Complementary binary coding 0 to +10 V 0 to +5 V MSB LSB V V V V V V V V V V V V V V V V Bipolar coding table Input voltage range Complementary offset binary Complementary two's complement ±10 V ±5 V ±2.5 V MSB LSB MSB LSB V V V V V V V V V V V V V V V V V V V V V V V V IGURE 4. Truth tables. 11 DSCC ORM 2234

12 OPERATING PERIODS Device type 01, T1 = 20µs, T2 = 1.56 µs Device type 02, T1 = 8µs, T2 = 0.56 µs OUTPUT: IGURE 5. Timing diagram. 12 DSCC ORM 2234

13 TABLE II. Electrical test requirements. MIL-PR test requirements Subgroups (in accordance with MIL-PR-38534, group A test table) Interim electrical parameters 1 inal electrical parameters 1*,2,3,4,5,6,7,8,9,10,11 Group A test requirements 1,2,3,4,5,6,7,8,9,10,11 Group C end-point electrical 1/ parameters End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1, 2, 3 Not applicable 1/ As a minimum, for all Group C testing performed after ( ) manufacturers shall perform subgroups 1, 2, and 3 from the Group A electrical test table (Table C-Xa of MIL-PR-38534). * PDA applies to subgroup Screening. Screening shall be in accordance with MIL-PR The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PR and as specified herein Group A inspection (CI). Group A inspection shall be in accordance with MIL-PR and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 7 and 8 shall include verification of the input-to-output coding (see figure 4 herein) Group B inspection (PI). Group B inspection shall be in accordance with MIL-PR DSCC ORM 2234

14 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PR and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD Group D inspection (PI). Group D inspection shall be in accordance with MIL-PR Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PR NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PR Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (SC 5962) should contact DLA Land and Maritime -VA, telephone (614) Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio , or telephone (614) Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML The vendors listed in MIL-HDBK-103 and QML have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to this drawing. 14 DSCC ORM 2234

15 BULLETIN DATE: Approved sources of supply for SMD are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML during the next revisions. MIL-HDBK-103 and QML will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML DLA Land and Maritime maintains an online database of all current sources of supply Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ XA XC XA XA XC XC XX / / 3/ ADC-HX/883B ADC-HX/883B ADC-HZ/883B MNADC87MXA ADC-HZ/883B MNADC87MXC MNADC87H/B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address Datel, Inc. 11 Cabot Boulevard Mansfield, MA The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.