A Design of X-Band Tile Type Active Transmit/Receive Module

Transcription

1 韓國電磁波學會論文誌第 21 卷第 12 號 2010 年 12 月論文 X A Design of X-Band Tile Type Active Transmit/Receive Module 하정현 문주영 이기원 남병창 윤상원 Jung-Hyen HaJu-Young MoonKi-Won Lee*Byung-Chang Nam*Sang-Won Yun 요약 X. fuzz button solderless 0.6 db, VSWR 1.7 X 30 %.. Abstract A tile type active T/R(Transmit/Receive) module for X-band active array radar is demonstrated in this paper. Proposed tile type structure based on fuzz button solderless vertical interconnection shows wide band characteristic of about 30 % bandwidth in X-band with insertion loss of below 0.6 db and input and output VSWR of less than 1.7. Moreover, the mismatching generally appeared in the vertical interconnection which shown wide band characteristic can also be minimized and, therefore, good gain flatness can be achieved. Key words : Tile Type T/R Module, Solderless Interconnection, Vertical Interconnection, Stack Structure. 서론.,.,, [1],[2].. TWT, Klystron. [3]. [4].,,,,. (Department of Electronic Engineering, Sogang University) *()(U-Tel Co., Ltd.) : : ( dialect@sogang.ac.kr) :

2 韓國電磁波學會論文誌第 21 卷第 12 號 2010 年 12 月, [5],[6]..,.. 타일형능동송수신모듈설계,.. 1., MMIC, MMIC. 그림 2. Fig. 2. Proposed tile type active t/r module. 2-1 수직연결. soldering solderless., solderless [7]. Solderless. 3 fuzz button solderless. Fuzz button Be-Cu. fuzz button X 0.3 그림 1. Fig. 1. Schematic of proposed tile type active t/r(transmit/receive) module. 그림 3. Solderless Fig. 3. Solderless type vertical interconnection. 1468

3 X 그림 4. Fig. 4. Structure of vertical interconnection. 표 1. Table 1. Target of vertical interconnection. Insertion loss Return loss < 1.2±0.2 db > 12±1 db < 1.7(VSWR) db, 15 db RF DC. Ansoft EM HFSS V fuzz button GHz 500 MHz 0.5 db. 그림 5. Solderless Fig. 5. Solderless type vertical interconnection test fixture. 그림 6. Fig. 6. Cross section of FRAME PCB. 2-2 타일형능동송수신모듈설계.. 그림 7. Fig. 7. Results of vertical interconnection. 1469

4 韓國電磁波學會論文誌第 21 卷第 12 號 2010 年 12 月 표 2. Table 2. Radar requirements. Operating frequency [GHz] 9.5 Detection range, R max [km] 10 RCS, σ [m 2 ] 1 Maximum target velocity, v [m/s] 500 Search coverage [ ] 표 3. Table 3. Design parameter. Azimuth 90 Elevation 90 (S/N) [db] [Target model=sw4, P d=90 %, P fa=10 7 ] 14 System loss, L s [db] 10 Frame time, t f [s] 15 error, E(n) 1, k [J /K] T 0 [ K] 300 Search solid angle, Ω 6.18 표 4. Table 4. Characteristics of MMICs. [ ] CHA5014 [UMS] TGA8399B-SCC [Triquint semiconductors] MA4SW210B-1 [M/A COM] TGL2201 [Triquint semiconductors] Gain: 20 db P1dB: 29 dbm Input return loss: 12 db Output return loss: 12 db Gain: 26 db Noise figure: 1.8 db Input return loss: 12 db Output return loss: 12 db Insertion loss: 1 db Isolation: 36.2 db Input return loss: 12 db Insertion loss: 0.5 db Maximum Pout: 20 dbm Input return loss: 20 db Output return loss: 20 db X 10 %. 2, , 3 (1) [8].. max,, (1) η 전체송수신모듈출력전력 개별송수신모듈출력전력 유효 apertur 면적 개별 aperture 면적 Antenna ef ficiency 배열개수 (1),, max, (1) (2). 2, [db]. (1), η (3). (2) (3)

5 X 표 5. Table 5. Power specification of unit module. [ : 15 dbm] [db] [dbm] [db] [db] LNA 4 5 HPA db. (3) Taylor weighting 40 db/ ( ), ( ) () () [8]. 9.5 GHz (m) ( ) m, 5 ( ) 28.5 dbm, () 3.82 db. (3). 6. Agilent ADS2008 표 6. Table 6. Target power spec. of t/r module. (n) ±1 db 28.5±1 dbm (VSWR) < ±1 db < 3.82 db (VSWR) < 타일형능동송수신모듈시험 Agilent PNA E8363B, P N1911A, N8975A.. 9, , 12., 8.5 GHz 500 MHz 2.5 VSWR 그림 Fig array tile type active t/r module. 1471

6 韓國電磁波學會論文誌第 21 卷第 12 號 2010 年 12 月 그림 9. [, ] Fig. 9. Results of transmit path[gain, return loss]. 그림 11. [, ] Fig. 11. Result of receive path[gain, return loss]. (a) 8.0 GHz[ 1] (b) 9.0 GHz[ 1] (a) 8.0 GHz[channel 1] (b) 9.0 GHz[channel 1] 그림 12. Fig. 12. Result of noise figure. (c) 10.0 GHz[ 1] (d) 8.0 GHz[ 2] (c) 10.0 GHz[channel 1] (d) 8.0 GHz[channel 2] (e) 9.0 GHz[ 2] (f) 10.0 GHz[ 2] (e) 9.0 GHz[channel 2] (f) 10.0 GHz[channel 2] 그림 10. [ ] Fig. 10. Results of transmit path[output power].., ±1 db.. 결론,,., X..,. 참고문헌 [1] Eli Brookner, "Phased array for the new milleni- 1472

7 X um", Chinese Institute of Electronics International Conference on Radar, pp , Oct [2] John Wooldridge, "High density microwave packaging for t/r modules", IEEE MTT-S Digest, pp , Jun [3] D. N. Mcquiddy Jr., R. L. Gassner, P. Hull, S. Mason, and J. M. Bedinger, "Transmit/receive module technology for x-band active array radar", Proceedings of the IEEE, vol. 79, pp , Mar [4] Bruce A. Kopp, Craig R. Moore, and Robert V. Coffman, "Transmit/receive module packaging: electrical design issues", Johns Hopkins Apl Technical Digest, vol. 20, no. 1, pp , [5] Mark S. Hauhe, John J. Wooldridge, "High density packaging of x-band active array modules", IEEE Trans. on Components, Packaging, and Manufacturing Technology - PART B, vol. 20, no. 3, pp , Aug [6] Y Mancuso, "Thales components and technologies for T/R modules", Microwave Integrated Circuits Conference EuMIC 2008, pp , [7] John Wooldridge, "Solderless interconnects for 3-D microwave packaging", Electrical Performance of Electronic Packaging, pp , [8] Merrill I. Skolnik, Introduction to Radar Systems 3Ed., McGraw Hill, pp , pp , : () : [ 주관심분야 ] RF : () : () : () [ 주관심분야 ], : () : () : [ 주관심분야 ], : () : () : () : () [ 주관심분야 ] 1473

8 韓國電磁波學會論文誌第 21 卷第 12 號 2010 年 12 月 : () : () : University of Texas at Austin () : [ 주관심분야 ], RF 1474