Arria 10 Device Datasheet
|
|
- Rudolf Simon
- 5 years ago
- Views:
Transcription
1 Subscribe This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing for Arria 10 devices. Arria 10 devices are offered in extended and industrial grades. Extended devices are offered in E1 (fastest), E2, and E3 speed grades. Industrial grade devices are offered in the I1, I2, and I3 speed grades. The suffix after the speed grade denotes the power options offered in Arria 10 devices. L Low static power S Standard power M Enabled with the V CC PowerManager feature (you can power V CC and V CCP at nominal voltage of 0.90 V or lower voltage of 0.83 V) V Supported with the SmartVID feature (lowest static power) Related Information Arria 10 Device Overview Provides more information about the densities and packages of devices in the Arria 10 family. Electrical Characteristics The following sections describe the operating conditions and power consumption of Arria 10 devices. Operating Conditions Arria 10 devices are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of the Arria 10 devices, you must consider the operating requirements described in this section All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are trademarks of and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for products or services. ISO 9001:2008 Registered Innovation Drive, San Jose, CA 95134
2 2 Absolute Maximum Ratings Absolute Maximum Ratings This section defines the maximum operating conditions for Arria 10 devices. The values are based on experiments conducted with the devices and theoretical modeling of breakdown and damage mechanisms. The functional operation of the device is not implied for these conditions. Caution: Conditions outside the range listed in the following table may cause permanent damage to the device. Additionally, device operation at the absolute maximum ratings for extended periods of time may have adverse effects on the device. Table 1: Absolute Maximum Ratings for Arria 10 Devices Preliminary Symbol Description Condition Minimum Maximum Unit V CC Core voltage power supply V V CCP Periphery circuitry and transceiver fabric interface power supply V V CCERAM Embedded memory power supply V V CCPT V CCBAT Power supply for programmable power technology and I/O pre-driver Battery back-up power supply for design security volatile key register V V V CCPGM Configuration pins power supply (1) V V CCIO I/O buffers power supply 3 V I/O V LVDS I/O V V CCA_PLL Phase-locked loop (PLL) analog power supply V V CCT_GXB Transmitter power V V CCR_GXB Receiver power V V CCH_GXB Transmitter output buffer power V V CCL_HPS HPS core voltage and periphery circuitry power supply V V CCIO_HPS HPS I/O buffers power supply 3 V I/O V LVDS I/O V (1) The LVDS I/O values are applicable to all dedicated and dual-function configuration I/Os.
3 Maximum Allowed Overshoot and Undershoot Voltage 3 Symbol Description Condition Minimum Maximum Unit V CCIOREF_HPS HPS I/O pre-driver power supply V V CCPLL_HPS HPS PLL power supply V I OUT DC output current per pin ma T J Operating junction temperature C T STG Storage temperature (no bias) C Maximum Allowed Overshoot and Undershoot Voltage During transitions, input signals may overshoot to the voltage listed in the following table and undershoot to 2.0 V for input currents less than 100 ma and periods shorter than 20 ns. The maximum allowed overshoot duration is specified as a percentage of high time over the lifetime of the device. A DC signal is equivalent to 100% duty cycle. For example, a signal that overshoots to 2.70 V for LVDS I/O can only be at 2.70 V for ~4% over the lifetime of the device. Table 2: Maximum Allowed Overshoot During Transitions for Arria 10 Devices Preliminary This table lists the maximum allowed input overshoot voltage and the duration of the overshoot voltage as a percentage of device lifetime. The LVDS I/O values are applicable to the VREFP_ADC and VREFN_ADC I/O pins. Symbol Description LVDS I/O (2) Condition (V) 3 V I/O Overshoot Duration as % at T J = 100 C % % Unit Vi (AC) AC input voltage % % % > 2.70 > 4.00 No overshoot allowed % (2) The LVDS I/O values are applicable to all dedicated and dual-function configuration I/Os.
4 4 Recommended Operating Conditions Recommended Operating Conditions This section lists the functional operation limits for the AC and DC parameters for Arria 10 devices. Recommended Operating Conditions Table 3: Recommended Operating Conditions for Arria 10 Devices Preliminary This table lists the steady-state voltage values expected from Arria 10 devices. Power supply ramps must all be strictly monotonic, without plateaus. V CC V CCP Symbol Description Condition Minimum (3) Typical Maximum (3) Unit V CCPGM Core voltage power supply Periphery circuitry and transceiver fabric interface power supply Configuration pins power supply Standard and low power (4) 0.93 V V CC PowerManager (5) 0.8, , , 0.93 V SmartVID (6) V Standard and low power (4) 0.93 V V CC PowerManager (5) 0.8, , , 0.93 V SmartVID (6) V 1.8 V V 1.5 V V 1.2 V V V CCERAM Embedded memory power supply 0.9 V (4) 0.93 V (3) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements. (4) You can operate 1 and 2 speed grade devices at 0.9 V or 0.95 V typical value. You can operate -3 speed grade device at only 0.9 V typical value. Core performance shown in this datasheet is applicable for the operation at 0.9 V. Operating at 0.95 V results in higher core performance and higher power consumption. For more information about the performance and power consumption of 0.95 V operation, refer to the Quartus Prime software timing reports, PowerPlay Power Analyzer report, and Early Power Estimator (EPE). (5) You can operate V CC PowerManager devices at either 0.83 V or 0.9 V. Power V CC and V CCP at 0.9 V to achieve 1 speed grade performance. Power V CC and V CCP at 0.83 V to achieve lower performance using the lowest power. (6) SmartVID is supported in devices with 2V and 3V speed grades only.
5 Recommended Operating Conditions 5 Symbol Description Condition Minimum (3) Typical Maximum (3) Unit V CCBAT (7) V CCPT V CCIO V CCA_PLL V REFP_ADC V I (9) Battery back-up power supply (For design security volatile key register) Power supply for programmable power technology and I/O pre-driver I/O buffers power supply PLL analog voltage regulator power supply Precision voltage reference for voltage sensor DC input voltage 1.8 V V 1.2 V V 1.8 V V 3.0 V (for 3 V I/O only) V 2.5 V (for 3 V I/O only) V 1.8 V V 1.5 V V 1.35 V (8) 1.35 (8) V 1.25 V V 1.2 V (8) 1.2 (8) V V V 3 V I/O V LVDS I/O V V O Output voltage 0 V CCIO V T J Operating junction temperature Extended C Industrial C (3) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements. (7) If you do not use the design security feature in Arria 10 devices, connect V CCBAT to a 1.5-V or 1.8-V power supply. Arria 10 power-on reset (POR) circuitry monitors V CCBAT. Arria 10 devices do not exit POR if V CCBAT is not powered up. (8) For minimum and maximum voltage values, refer to the I/O Standard Specifications section. (9) The LVDS I/O values are applicable to all dedicated and dual-function configuration I/Os.
6 6 Transceiver Power Supply Operating Conditions Symbol Description Condition Minimum (3) Typical Maximum (3) Unit t RAMP (10)(11) Power supply ramp time Related Information I/O Standard Specifications on page 17 Transceiver Power Supply Operating Conditions Table 4: Transceiver Power Supply Operating Conditions for Arria 10 GX/SX Devices Preliminary Standard POR 200 µs 100 ms Fast POR 200 µs 4 ms Symbol Description Condition (12) Minimum (13) Typical Maximum Unit V CCT_GXB[L,R] Transmitter power supply Chip-to-Chip 17.4 Gbps Or Backplane (14) 16.0 Gbps Chip-to-Chip 11.3 Gbps Or Backplane (14) Gbps V V (3) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements. (10) This is also applicable to HPS power supply. For HPS power supply, refer to t RAMP specifications for standard POR when HPS_PORSEL = 0 and t RAMP specifications for fast POR when HPS_PORSEL = 1. (11) t ramp is the ramp time of each individual power supply, not the ramp time of all combined power supplies. (12) These data rate ranges vary depending on the transceiver speed grade. Refer to Transceiver Performance for Arria 10 GX/SX Devices for exact data rate ranges. (13) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements. (14) Backplane applications assume advanced equalization circuitry, such as decision feedback equalization (DFE), is enabled to compensate for signal impairments. Chip-to-chip links are assumed to be applications with short reach channels that do not require DFE.
7 Transceiver Power Supply Operating Conditions 7 Symbol Description Condition (12) Minimum (13) Typical Maximum Unit V CCR_GXB[L,R] Receiver power supply Chip-to-Chip 17.4 Gbps Or Backplane (14) 16.0 Gbps Chip-to-Chip 11.3 Gbps Or Backplane (14) Gbps V V V CCH_GXB[L,R] Transceiver high voltage power V Note: Most VCCR_GXB and VCCT_GXB pins associated with unused transceiver channels can be grounded on a per-side basis to minimize power consumption. Refer to the Arria 10 GX, GT, and SX Device Family Pin Connection Guidelines and the Quartus Prime pin report for information about pinning out the package to minimize power consumption for your specific design. (12) These data rate ranges vary depending on the transceiver speed grade. Refer to Transceiver Performance for Arria 10 GX/SX Devices for exact data rate ranges. (13) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
8 8 Transceiver Power Supply Operating Conditions Table 5: Transceiver Power Supply Operating Conditions for Arria 10 GT Devices Preliminary Symbol Description Condition (15) Minimum (13) Typical Maximum Unit Chip-to-Chip < 28.3 Gbps (16) V Or Backplane (14) < 17.4 Gbps V CCT_GXB[L,R] V CCR_GXB[L,R] Transmitter power supply Receiver power supply Chip-to-Chip < 15 Gbps Or Backplane (14) < 14.2 Gbps Chip-to-Chip < 11.3 Gbps Or Backplane (14) < Gbps Chip-to-Chip < 28.3 Gbps Or Backplane (14) < 17.4 Gbps Chip-to-Chip < 15 Gbps Or Backplane (14) < 14.2 Gbps Chip-to-Chip < 11.3 Gbps Or Backplane (14) < Gbps V V V V V (15) These data rate ranges vary depending on the transceiver speed grade. Refer to Transceiver Performance for Arria 10 GT Devices table for exact data rate ranges.
9 HPS Power Supply Operating Conditions 9 Symbol Description Condition (15) Minimum (13) Typical Maximum Unit V CCH_GXB[L,R] Related Information Transceiver high voltage power supply Transceiver Performance for Arria 10 GT Devices on page 26 Provides the data rate ranges for different transceiver speed grades. Transceiver Performance for Arria 10 GX/SX Devices on page 23 Provides the data rate ranges for different transceiver speed grades. Arria 10 GX, GT, and SX Device Family Pin Connection Guidelines HPS Power Supply Operating Conditions Table 6: HPS Power Supply Operating Conditions for Arria 10 SX Devices Preliminary V This table lists the steady-state voltage and current values expected from Arria 10 system-on-a-chip (SoC) devices with ARM -based hard processor system (HPS). Power supply ramps must all be strictly monotonic, without plateaus. Refer to Recommended Operating Conditions for Arria 10 Devices table for the steady-state voltage values expected from the FPGA portion of the Arria 10 SoC devices. Symbol Description Condition Minimum (17) Typical Maximum (17) Unit V CCL_HPS V CCIO_HPS HPS core voltage and periphery circuitry power supply HPS I/O buffers power supply HPS processor speed = 1.2 GHz HPS processor speed = 1.5 GHz, 1 speed grade V V 3.0 V V 2.5 V V 1.8 V V (15) These data rate ranges vary depending on the transceiver speed grade. Refer to Transceiver Performance for Arria 10 GT Devices table for exact data rate ranges. (16) 28.3 Gbps is the maximum data rate for GT channels Gbps is the maximum data rate for GX channels. (17) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
10 10 DC Characteristics Symbol Description Condition Minimum (17) Typical Maximum (17) Unit V CCIOREF_HPS HPS I/O pre-driver power supply V V CCPLL_HPS HPS PLL analog voltage regulator power supply Related Information Recommended Operating Conditions on page 4 Provides the steady-state voltage values for the FPGA portion of the device. DC Characteristics V The OCT variation after power-up calibration specifications will be available in a future release of the. Supply Current and Power Consumption Altera offers two ways to estimate power for your design the Excel-based Early Power Estimator (EPE) and the Quartus Prime PowerPlay Power Analyzer feature. Use the Excel-based EPE before you start your design to estimate the supply current for your design. The EPE provides a magnitude estimate of the device power because these currents vary greatly with the usage of the resources. The Quartus Prime PowerPlay Power Analyzer provides better quality estimates based on the specifics of the design after you complete place-androute. The PowerPlay Power Analyzer can apply a combination of user-entered, simulation-derived, and estimated signal activities that, when combined with detailed circuit models, yield very accurate power estimates. Related Information PowerPlay Early Power Estimator User Guide Provides more information about power estimation tools. PowerPlay Power Analysis chapter, Quartus Prime Handbook Provides more information about power estimation tools. (17) This value describes the budget for the DC (static) power supply tolerance and does not include the dynamic tolerance requirements. Refer to the PDN tool for the additional budget for the dynamic tolerance requirements.
11 I/O Pin Leakage Current 11 I/O Pin Leakage Current Table 7: I/O Pin Leakage Current for Arria 10 Devices Preliminary If V O = V CCIO to V CCIOMAX, 300 μa of leakage current per I/O is expected. Symbol Description Condition Min Max Unit I I Input pin V I = 0 V to V CCIOMAX µa I OZ Tri-stated I/O pin V O = 0 V to V CCIOMAX µa Bus Hold Specifications The bus-hold trip points are based on calculated input voltages from the JEDEC standard. Table 8: Bus Hold Parameters for Arria 10 Devices Preliminary V CCIO (V) Parameter Symbol Condition Min Max Min Max Min Max Min Max Min Max Unit Bus-hold, low, sustaining current I SUSL V IN > V IL (max) 8 (18), 12 (18), 30 (18), µa 26 (19) 32 (19) 55 (19) Bus-hold, high, sustaining current I SUSH V IN < V IH (min) 8 (18), 12 (18), 30 (18), µa 26 (19) 32 (19) 55 (19) Bus-hold, low, overdrive current I ODL 0 V < V IN µa < V CCIO (18) This value is only applicable for LVDS I/O bank. (19) This value is only applicable for 3 V I/O bank.
12 12 OCT Calibration Accuracy Specifications Parameter Symbol Condition V CCIO (V) Min Max Min Max Min Max Min Max Min Max Unit Bus-hold, high, overdrive current I ODH 0 V < V IN µa < V CCIO Bus-hold trip point V TRIP V OCT Calibration Accuracy Specifications If you enable on-chip termination (OCT) calibration, calibration is automatically performed at power up for I/Os connected to the calibration block. Table 9: OCT Calibration Accuracy Specifications for Arria 10 Devices Preliminary Calibration accuracy for the calibrated on-chip series termination (R S OCT) and on-chip parallel termination (R T OCT) are applicable at the moment of calibration. When process, voltage, and temperature (PVT) conditions change after calibration, the tolerance may change. Symbol Description Condition (V) Calibration Accuracy E1, I1 E2, I2 E3, I3 Unit 48-Ω, 60-Ω, 80-Ω, and 240-Ω R S Internal series termination with calibration (48-Ω, 60-Ω, 80-Ω, and 240-Ω setting) 34-Ω and 40-Ω R S Internal series termination with calibration (34-Ω and 40-Ω setting) 25-Ω R S Internal series termination with calibration 50-Ω R S Internal series termination with calibration V CCIO = 1.2 ±15 ±15 ±15 % V CCIO = 1.5, 1.35, 1.25, 1.2 ±15 ±15 ±15 % V CCIO = 1.8, 1.5, 1.2 ±15 ±15 ±15 % V CCIO = 1.8, 1.5, 1.2 ±15 ±15 ±15 %
13 OCT Without Calibration Resistance Tolerance Specifications 13 Symbol Description Condition (V) 34-Ω, 40-Ω, 48-Ω, and 60-Ω R S 34-Ω, 40-Ω, 48-Ω, 60-Ω, 80-Ω, 120-Ω, and 240-Ω R T Internal series termination with calibration (34-Ω, 40-Ω, 48-Ω, and 60-Ωsetting) Internal parallel termination with calibration (34-Ω, 40-Ω, 48-Ω, 60-Ω, 80-Ω, 120-Ω, and 240-Ω setting) 60-Ω and 120-Ω R T Internal parallel termination with calibration (60-Ω and 120-Ω setting) 30-Ω and 40-Ω R T Internal parallel termination with calibration (30-Ω and 40-Ω setting) 50-Ω R T Internal parallel termination with calibration (50-Ω setting) OCT Without Calibration Resistance Tolerance Specifications POD12 I/O standard, V CCIO = 1.2 POD12 I/O standard, V CCIO = 1.2 V CCIO = 1.5, 1.35, 1.25, 1.2 Calibration Accuracy E1, I1 E2, I2 E3, I3 Unit ±15 ±15 ±15 % ±15 ±15 ±15 % 10 to to to +40 % V CCIO = 1.5, 1.35, to to to +40 % V CCIO = 1.8, 1.5, to to to +40 % Table 10: OCT Without Calibration Resistance Tolerance Specifications for Arria 10 Devices Preliminary This table lists the Arria 10 OCT without calibration resistance tolerance to PVT changes. Symbol Description Condition (V) Internal series termination without 25-Ω R S calibration (25-Ω setting) Internal series termination without 34-Ω R S calibration (34-Ω setting) Resistance Tolerance E1, I1 E2, I2 E3, I3 V CCIO = 2.5, to +30 ± 40 ± 40 % V CCIO = 1.8, to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % V CCIO = 1.5, 1.35, to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % POD12 I/O standard 50 to +30 ± 50 ± 50 % Unit
14 14 OCT Without Calibration Resistance Tolerance Specifications Symbol Description Condition (V) Internal series termination without 40-Ω R S calibration (40-Ω setting) 48-Ω R S Internal series termination without calibration(48-ω setting) Internal series termination without 50-Ω R S calibration (50-Ω setting) 60-Ω R S Internal series termination without calibration (60-Ω setting) 100-Ω R D Internal differential termination (100-Ω setting) 120-Ω R S Internal series termination without calibration (120-Ω setting) Figure 1: Equation for OCT Variation Without Recalibration Preliminary Resistance Tolerance E1, I1 E2, I2 E3, I3 V CCIO = 1.5, 1.35, to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % POD12 I/O standard 50 to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % POD12 I/O standard 50 to +30 ± 50 ± 50 % VCCIO = 2.5, to +30 ± 40 ± 40 % V CCIO = 1.8, to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % V CCIO = to +30 ± 50 ± 50 % V CCIO = 1.8, 1.5 ± 25 ± 35 ± 40 % V CCIO = to +30 ± 50 ± 50 % Unit
15 Pin Capacitance 15 The definitions for the equation are as follows: The R OCT value calculated shows the range of OCT resistance with the variation of temperature and V CCIO. R SCAL is the OCT resistance value at power-up. ΔT is the variation of temperature with respect to the temperature at power up. ΔV is the variation of voltage with respect to the V CCIO at power up. dr/dt is the percentage change of R SCAL with temperature. dr/dv is the percentage change of R SCAL with voltage. Pin Capacitance Table 11: Pin Capacitance for Arria 10 Devices Preliminary Symbol Description Value Unit C IO_COLUMN Input capacitance on column I/O pins 2.5 pf C OUTFB Input capacitance on dual-purpose clock output/feedback pins 2.5 pf Internal Weak Pull-Up and Weak Pull-Down Resistor All I/O pins, except configuration, test, and JTAG pins, have an option to enable weak pull-up. The weak pull-down feature is only available for the pins as described in the Internal Weak Pull-Down Resistor Values for Arria 10 Devices table.
16 16 Internal Weak Pull-Up and Weak Pull-Down Resistor Table 12: Internal Weak Pull-Up Resistor Values for Arria 10 Devices Preliminary Symbol Description Condition (V) (20) Value (21) Unit R PU Value of the I/O pin pull-up resistor before and during configuration, as well as user mode if you have enabled the programmable pull-up resistor option. Table 13: Internal Weak Pull-Down Resistor Values for Arria 10 Devices Preliminary V CCIO = 3.0 ±5% 25 kω V CCIO = 2.5 ±5% 25 kω V CCIO = 1.8 ±5% 25 kω V CCIO = 1.5 ±5% 25 kω V CCIO = 1.35 ±5% 25 kω V CCIO = 1.25 ±5% 25 kω V CCIO = 1.2 ±5% 25 kω Pin Name Description Condition (V) Value (21) Unit nio_pullup TCK MSEL[0:2] Dedicated input pin that determines the internal pull-ups on user I/O pins and dualpurpose I/O pins. Dedicated JTAG test clock input pin. Configuration input pins that set the configuration scheme for the FPGA device. V CC = 0.9 ±3.33% 25 kω V CCPGM = 1.8 ±5 % 25 kω V CCPGM = 1.5 ±5% 25 kω V CCPGM = 1.2 ±5% 25 kω V CCPGM = 1.8 ±5% 25 kω V CCPGM = 1.5 ±5% 25 kω V CCPGM = 1.2 ±5% 25 kω Related Information Arria 10 Device Family Pin Connection Guidelines Provides more information about the pins that support internal weak pull-up and internal weak pull-down features. (20) Pin pull-up resistance values may be lower if an external source drives the pin higher than V CCIO. (21) Valid with ±25% tolerances to cover changes over PVT.
17 I/O Standard Specifications 17 I/O Standard Specifications Tables in this section list the input voltage (V IH and V IL ), output voltage (V OH and V OL ), and current drive characteristics (I OH and I OL ) for various I/O standards supported by Arria 10 devices. For minimum voltage values, use the minimum V CCIO values. For maximum voltage values, use the maximum V CCIO values. You must perform timing closure analysis to determine the maximum achievable frequency for general purpose I/O standards. Related Information Recommended Operating Conditions on page 4 Single-Ended I/O Standards Specifications Table 14: Single-Ended I/O Standards Specifications for Arria 10 Devices Preliminary I/O Standard 3.0-V LVTTL 3.0-V LVCMOS V CCIO (V) V IL (V) V IH (V) V OL (V) V OH (V) I OL (22) Min Typ Max Min Max Min Max Max Min (ma) I OH (22) (ma) V CCIO V V V CCIO 0.65 V CCIO V CCIO V CCIO V V CCIO 0.65 V CCIO V CCIO V CCIO 0.75 V CCIO V V CCIO 0.65 V CCIO V CCIO V CCIO 0.75 V CCIO 2 2 (22) To meet the I OL and I OH specifications, you must set the current strength settings accordingly. For example, to meet the 3.0-V LVTTL specification (2 ma), you should set the current strength settings to 2 ma. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet.
18 18 Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Table 15: Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications for Arria 10 Devices Preliminary I/O Standard SSTL-18 Class I, II SSTL-15 Class I, II V CCIO (V) V REF (V) V TT (V) Min Typ Max Min Typ Max Min Typ Max V REF 0.04 V REF V REF V CCIO 0.5 V CCIO 0.51 V CCIO 0.49 V CCIO 0.5 V CCIO 0.51 V CCIO SSTL V CCIO 0.5 V CCIO 0.51 V CCIO 0.49 V CCIO 0.5 V CCIO 0.51 V CCIO SSTL V CCIO 0.5 V CCIO 0.51 V CCIO 0.49 V CCIO 0.5 V CCIO 0.51 V CCIO SSTL V CCIO 0.5 V CCIO 0.51 V CCIO 0.49 V CCIO 0.5 V CCIO 0.51 V CCIO HSTL-18 Class I, II HSTL-15 Class I, II HSTL-12 Class I, II V CCIO / V CCIO / V CCIO 0.5 V CCIO 0.53 V CCIO V CCIO /2 HSUL V CCIO 0.5 V CCIO 0.51 V CCIO POD V CCIO 0.7 V CCIO 0.71 V CCIO V CCIO
19 Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications 19 Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications Table 16: Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications for Arria 10 Devices Preliminary I/O Standard SSTL-18 Class I SSTL-18 Class II SSTL-15 Class I SSTL-15 Class II V IL(DC) (V) V IH(DC) (V) V IL(AC) (V) V IH(AC) (V) V OL (V) V OH (V) I OL (23) Min Max Min Max Max Min Max Min 0.3 V REF V REF V CCIO V REF 0.25 V REF V TT V TT V REF V REF V CCIO V REF 0.25 V REF V CCIO V REF 0.1 V REF V REF V REF V CCIO 0.8 V CCIO 8 8 V REF 0.1 V REF V REF V REF V CCIO 0.8 V CCIO SSTL-135 V REF 0.09 V REF V REF 0.16 V REF V CCIO 0.8 V CCIO SSTL-125 V REF 0.09 V REF V REF 0.15 V REF V CCIO 0.8 V CCIO SSTL-12 V REF 0.10 V REF V REF 0.15 V REF V CCIO 0.8 V CCIO HSTL-18 Class I HSTL-18 Class II HSTL-15 Class I HSTL-15 Class II HSTL-12 Class I V REF 0.1 V REF V REF 0.2 V REF V CCIO V REF 0.1 V REF V REF 0.2 V REF V CCIO V REF 0.1 V REF V REF 0.2 V REF V CCIO V REF 0.1 V REF V REF 0.2 V REF V CCIO V REF 0.08 V REF V CCIO V REF 0.15 V REF V CCIO 0.75 V CCIO 8 8 (ma) I OH (23) (ma) (23) To meet the I OL and I OH specifications, you must set the current strength settings accordingly. For example, to meet the SSTL15CI specification (8 ma), you should set the current strength settings to 8 ma. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet.
20 20 Differential SSTL I/O Standards Specifications I/O Standard HSTL-12 Class II V IL(DC) (V) V IH(DC) (V) V IL(AC) (V) V IH(AC) (V) V OL (V) V OH (V) I OL (23) Min Max Min Max Max Min Max Min 0.15 V REF 0.08 V REF V CCIO V REF 0.15 V REF V CCIO 0.75 V CCIO HSUL-12 V REF 0.13 V REF V REF 0.22 V REF V CCIO 0.9 V CCIO POD V REF 0.08 V REF V CCIO V REF 0.15 V REF ( ) V CCIO ( ) V CCIO Differential SSTL I/O Standards Specifications Table 17: Differential SSTL I/O Standards Specifications for Arria 10 Devices Preliminary I/O Standard SSTL-18 Class I, II SSTL-15 Class I, II V CCIO (V) V SWING(DC) (V) V SWING(AC) (V) V IX(AC) (V) Min Typ Max Min Max Min Max Min Typ Max V CCIO V CCIO V CCIO / (24) 2(V IH(AC) V REF ) SSTL (24) 2(V IH(AC) V REF ) SSTL (24) 2(V IH(AC) V REF ) SSTL (24) 2(V IH(AC) V REF ) 2(V REF V IL(AC) ) 2(V IL(AC) V REF ) 2(V IL(AC) V REF ) 2(V IL(AC) V REF ) V CCIO / V CCIO / V CCIO / (ma) I OH (23) (ma) V CCIO / V CCIO / V CCIO /2 V CCIO / V CCIO /2 V CCIO / V REF 0.15 V CCIO /2 V REF POD V REF 0.08 V REF (23) To meet the I OL and I OH specifications, you must set the current strength settings accordingly. For example, to meet the SSTL15CI specification (8 ma), you should set the current strength settings to 8 ma. Setting at lower current strength may not meet the I OL and I OH specifications in the datasheet. (24) The maximum value for V SWING(DC) is not defined. However, each single-ended signal needs to be within the respective single-ended limits (V IH(DC) and V IL(DC) ).
21 Differential HSTL and HSUL I/O Standards Specifications 21 Differential HSTL and HSUL I/O Standards Specifications Table 18: Differential HSTL and HSUL I/O Standards Specifications for Arria 10 Devices Preliminary I/O Standard HSTL-18 Class I, II HSTL-15 Class I, II HSTL-12 Class I, II V CCIO (V) V DIF(DC) (V) V DIF(AC) (V) V IX(AC) (V) V CM(DC) (V) Min Typ Max Min Max Min Max Min Typ Max Min Typ Max V CCIO HSUL (V IH(DC) V REF ) Differential I/O Standards Specifications 2(V REF V IH(DC) ) 0.3 V CCIO (V IH(AC) V REF ) 2(V REF V IH(AC) ) Table 19: Differential I/O Standards Specifications for Arria 10 Devices Preliminary Differential inputs are powered by V CCPT which requires 1.8 V. I/O Standard PCML 0.5 V CCIO 0.4 V CCIO 0.5 V CCIO 0.6 V CCIO 0.5 V CCIO V CCIO V CCIO V CCIO V CCIO V CCIO V CCIO (V) V ID (mv) (25) V ICM(DC) (V) V OD (V) (26) V OCM (V) (26) Min Typ Max Min Condition Max Min Condition Max Min Typ Max Min Typ Max Transmitter, receiver, and input reference clock pins of high-speed transceivers use the CML I/O standard. For transmitter, receiver, and reference clock I/O pin specifications, refer to Transceiver Specifications for Arria 10 GX, SX, and GT Devices table. (25) The minimum V ID value is applicable over the entire common mode range, V CM. (26) R L range: 90 R L 110 Ω.
22 22 Switching Characteristics I/O Standard V CCIO (V) V ID (mv) (25) V ICM(DC) (V) V OD (V) (26) V OCM (V) (26) Min Typ Max Min Condition Max Min Condition Max Min Typ Max Min Typ Max LVDS (27) RSDS (HIO) (28) V CM = 1.25 V V CM = 1.25 V 0 D MAX 700 Mbps 1 D MAX > 700 Mbps Mini-LVDS (HIO) (29) LVPECL (30) D MAX 700 Mbps 1 D MAX > 700 Mbps Related Information Transceiver Specifications for Arria 10 GX, SX, and GT Devices on page 29 Provides the specifications for transmitter, receiver, and reference clock I/O pin Switching Characteristics This section provides the performance characteristics of Arria 10 core and periphery blocks for extended grade devices. (25) The minimum V ID value is applicable over the entire common mode range, V CM. (26) R L range: 90 R L 110 Ω. (27) For optimized LVDS receiver performance, the receiver voltage input range must be within 1.0 V to 1.6 V for data rates above 700 Mbps and 0 V to 1.85 V for data rates below 700 Mbps. (28) For optimized RSDS receiver performance, the receiver voltage input range must be within 0.3 V to 1.4 V. (29) For optimized Mini-LVDS receiver performance, the receiver voltage input range must be within 0.4 V to V. (30) For optimized LVPECL receiver performance, the receiver voltage input range must be within 0.85 V to 1.75 V for data rates above 700 Mbps and 0.45 V to 1.95 V for data rates below 700 Mbps.
23 Transceiver Performance Specifications 23 Transceiver Performance Specifications Transceiver Performance for Arria 10 GX/SX Devices Table 20: Transmitter and Receiver Data Rate Performance Preliminary Symbol/Description Condition Transceiver Speed Grade 1 Transceiver Speed Grade 2 Transceiver Speed Grade 3 Transceiver Speed Grade 4 Transceiver Speed Grade 5 (31) Unit Chip-to-Chip (32) Maximum data rate V CCR_GXB = V CCT_GXB = 1.03 V Maximum data rate V CCR_GXB = V CCT_GXB = 0.95 V Gbps Gbps Minimum Data Rate 1.0 (33) Gbps Maximum data rate V CCR_GXB = V CCT_GXB = 1.03 V Gbps Backplane (32) Maximum data rate V CCR_GXB = V CCT_GXB = 0.95 V Gbps Minimum Data Rate 1.0 (33) Gbps (31) Transceiver speed grade 5 supports PCI Express (PCIe ) Gen3. (32) Backplane applications assume advanced equalization circuitry, such as decision feedback equalization (DFE), is enabled to compensate for signal impairments. Chip-to-chip links are assumed to be applications with short reach channels that do not require DFE. (33) Arria 10 transceivers can support data rates down to 125 Mbps with over sampling.
24 24 Transceiver Performance for Arria 10 GX/SX Devices Table 21: ATX PLL Performance Preliminary Symbol/Description Supported Output Frequency Condition Maximum Frequency Minimum Frequency Transceiver Speed Grade 1 Transceiver Speed Grade 2 Transceiver Speed Grade 3 Transceiver Speed Grade 4 Transceiver Speed Grade GHz Unit 500 MHz Table 22: Fractional PLL Performance Preliminary Symbol/ Description Supported Output Frequency Condition Maximum Frequency Minimum Frequency Transceiver Speed Grade 1 Transceiver Speed Grade 2 Transceiver Speed Grade 3 Transceiver Speed Grade 4 Transceiver Speed Grade GHz Unit 500 MHz Table 23: CMU PLL Performance Preliminary Symbol/ Description Supported Output Frequency Condition Maximum Frequency Minimum Frequency Transceiver Speed Grade 1 Transceiver Speed Grade 2 Transceiver Speed Grade 3 Transceiver Speed Grade 4 Transceiver Speed Grade GHz Unit 500 MHz Related Information Transceiver Power Supply Operating Conditions on page 6
25 High-Speed Serial Transceiver-Fabric Interface Performance for Arria High-Speed Serial Transceiver-Fabric Interface Performance for Arria 10 GX/SX Devices Table 24: High-Speed Serial Transceiver-Fabric Interface Performance for Arria 10 GX/SX Devices Preliminary Symbol/Description Condition (V) -E1M / -I1M Core Speed Grade with Power Options -E1L / -E1S / -I1L -E2L / -I2L -E3S / -I3S / M3 20-bit interface - FIFO V CC = MHz 20-bit interface - Registered V CC = MHz 32-bit interface - FIFO V CC = MHz 32-bit interface - Registered V CC = MHz 64-bit interface - FIFO V CC = MHz 64-bit interface - Registered V CC = MHz PCIe Gen3 HIP-Fabric interface V CC = MHz 20-bit interface - FIFO V CC = MHz 20-bit interface - Registered V CC = MHz 32-bit interface - FIFO V CC = MHz 32-bit interface - Registered V CC = MHz 64-bit interface - FIFO V CC = MHz 64-bit interface - Registered V CC = MHz PCIe Gen3 HIP-Fabric interface V CC = MHz Unit
26 26 Transceiver Performance for Arria 10 GT Devices Transceiver Performance for Arria 10 GT Devices Table 25: Transmitter and Receiver Data Rate Performance Preliminary Symbol/Description Condition Transceiver Speed Grade 2 Maximum data rate V CCR_GXB = V CCT_GXB = 1.12 V Transceiver Speed Grade 3 Transceiver Speed Grade 4 Unit GT Channel (35) 28.3/28.1 (36) Gbps GX Channel Gbps Chip-to-chip (34) Maximum data rate V CCR_GXB = V CCT_GXB = 1.03 V Maximum data rate V CCR_GXB = V CCT_GXB = 0.95 V GX Channel Gbps GX Channel Gbps Minimum data rate GT Channel GX Channel 1.0 (37) Gbps (34) Backplane applications assume advanced equalization circuitry, such as decision feedback equalization (DFE), is enabled to compensate for signal impairments. Chip-to-chip links are assumed to be applications with short reach channels that do not require DFE. (35) GT channels are only available when V CCT_GXB = 1.12 V and V CCR_GXB = 1.12 V. (36) To achieve 28.3 Gbps, you must use a -1 core speed grade and a -2 transceiver speed grade device configuration. To achieve 28.1 Gbps, you must use a -2 core speed grade and a -2 transceiver speed grade device configuration. (37) Arria 10 transceivers can support data rates down to 125 Mbps with over sampling.
27 Transceiver Performance for Arria 10 GT Devices 27 Symbol/Description Condition Transceiver Speed Grade 2 Maximum data rate V CCR_GXB = V CCT_GXB = 1.12 V Transceiver Speed Grade 3 Transceiver Speed Grade 4 Unit GX Channel Gbps Backplane (34) Maximum data rate V CCR_GXB = V CCT_GXB = 1.03 V Maximum data rate V CCR_GXB = V CCT_GXB = 0.95 V GX Channel Gbps GX Channel Gbps Table 26: ATX PLL Performance Preliminary Minimum data rate GX Channel 1.0 (37) Gbps Symbol/Description Condition Transceiver Speed Grade 2 Supported Output Frequency Transceiver Speed Grade 3 Transceiver Speed Grade 4 Maximum frequency GHz Minimum frequency 500 MHz Table 27: Fractional PLL Performance Preliminary Symbol/Description Condition Transceiver Speed Grade 2 Supported Output Frequency Transceiver Speed Grade 3 Transceiver Speed Grade 4 Maximum frequency 6.25 GHz Minimum frequency 500 MHz Unit Unit
28 28 High-Speed Serial Transceiver-Fabric Interface Performance for Arria Table 28: CMU PLL Performance Preliminary Symbol/Description Condition Transceiver Speed Grade 2 Supported Output Frequency Transceiver Speed Grade 3 Transceiver Speed Grade 4 Maximum frequency GHz Minimum frequency 500 MHz Related Information Transceiver Power Supply Operating Conditions on page 6 High-Speed Serial Transceiver-Fabric Interface Performance for Arria 10 GT Devices Table 29: High-Speed Serial Transceiver-Fabric Interface Performance for Arria 10 GT Devices Preliminary Symbol/Description Condition (V) Core Speed Grade with Power Options bit interface - FIFO V CC = MHz 20-bit interface - Registered V CC = MHz 32-bit interface - FIFO V CC = MHz 32-bit interface - Registered V CC = MHz 64-bit interface - FIFO V CC = MHz 64-bit interface - Registered V CC = MHz PCIe Gen3 HIP-Fabric interface V CC = MHz Unit Unit
29 Transceiver Specifications for Arria 10 GX, SX, and GT Devices 29 Transceiver Specifications for Arria 10 GX, SX, and GT Devices Table 30: Reference Clock Specifications Preliminary Symbol/Description Supported I/O Standards Input Reference Clock Frequency (CMU PLL) Input Reference Clock Frequency (ATX PLL) Input Reference Clock Frequency (fpll PLL) Condition Dedicated reference clock pin RX reference clock pin Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max CML, Differential LVPECL, LVDS, and HCSL CML, Differential LVPECL, and LVDS Unit MHz MHz MHz Rise time 20% to 80% 400 ps Fall time 80% to 20% 400 ps Duty cycle % Spread-spectrum modulating clock frequency PCIe khz Spread-spectrum downspread PCIe 0 to 0.5 % On-chip termination resistors 100 Ω Absolute V MAX Dedicated reference clock pin 1.6 V RX reference clock pin 1.2 V Absolute V MIN 0.4 V Peak-to-peak differential input voltage mv
30 30 Transceiver Specifications for Arria 10 GX, SX, and GT Devices Symbol/Description V ICM (AC coupled) V ICM (DC coupled) Transmitter REFCLK Phase Noise (622 MHz) (38) Transmitter REFCLK Phase Jitter (100 MHz) Condition Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max V CCR_GXB = 0.95 V 0.95 V V CCR_GXB = 1.03 V 1.03 V V CCR_GXB = 1.12 V 1.12 V HCSL I/O standard for PCIe reference clock Unit mv 100 Hz 70 dbc/hz 1 khz 90 dbc/hz 10 khz 100 dbc/hz 100 khz 110 dbc/hz 1 MHz 120 dbc/hz 1.5 to 100 MHz (PCIe) 4.2 ps (rms) R REF 2.0 k ±1% Ω T SSC-MAX-PERIOD-SLEW Max SSC df/dt 0.75 Table 31: Transceiver Clocks Specifications Preliminary Symbol/Description CLKUSR pin for transceiver calibration Condition Transceiver Calibration Transceiver Speed Grades 1, 2, 3, 4, and 5 Unit Min Typ Max MHz (38) To calculate the REFCLK phase noise requirement at frequencies other than 622 MHz, use the following formula: REFCLK phase noise at f (MHz) = REFCLK phase noise at 622 MHz + 20*log(f/622).
31 Transceiver Specifications for Arria 10 GX, SX, and GT Devices 31 Symbol/Description reconfig_clk Condition Reconfiguration interface Transceiver Speed Grades 1, 2, 3, 4, and 5 Unit Min Typ Max MHz Table 32: Transceiver Clock Network Maximum Data Rate Specifications Clock Network Maximum Performance ATX (39) fpll CMU Channel Span x channels Gbps x N/A 6 channels Gbps x6 PLL feedback N/A Side-wide Gbps xn at 0.95 V N/A Up two banks and down two banks xn at 1.03 V N/A Up two banks and down two banks xn at 1.12 V N/A Up two banks and down two banks Table 33: Receiver Specifications Preliminary Symbol/Description Supported I/O Standards Condition Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max High Speed Differential I/O, CML, Differential LVPECL, and LVDS Absolute V MAX for a receiver pin (40) 1.2 V Unit Gbps Gbps Gbps Unit (39) ATX maximum data rate support per speed grade.
32 32 Transceiver Specifications for Arria 10 GX, SX, and GT Devices Symbol/Description Condition Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max Absolute V MIN for a receiver pin (40) -0.4 V Maximum peakto-peak differential input voltage V ID (diff p-p) before device configuration (41) Maximum peakto-peak differential input voltage V ID (diff p-p) after device configuration (41) Minimum differential eye opening at receiver serial input pins (42) Differential onchip termination resistors 1.6 V V CCR_GXB = 1.12 V 2.0 V V CCR_GXB = 1.03 V 2.0 V V CCR_GXB = 0.95 V 2.4 V 50 mv 85-Ω setting 85 ± 30% Ω 100-Ω setting 100 ± 30% Ω Unit (40) The device cannot tolerate prolonged operation at this absolute maximum. (41) DC coupling specifications are pending silicon characterization. (42) The differential eye opening specification at the receiver input pins assumes that Receiver Equalization is disabled. If you enable Receiver Equalization, the receiver circuitry can tolerate a lower minimum eye opening, depending on the equalization level.
33 Transceiver Specifications for Arria 10 GX, SX, and GT Devices 33 Symbol/Description V ICM (AC and DC coupled) Condition Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max V CCR_GXB = 0.95 V 600 mv V CCR_GXB = 1.03 V 700 mv V CCR_GXB = 1.12 V 700 mv t LTR (43) 10 µs t LTD (44) 4 µs t LTD_manual (45) 4 µs t LTR_LTD_manual (46) 15 µs Run Length 200 UI CDR PPM tolerance Programmable DC Gain PCIe-only PPM All other protocols PPM DC Gain Setting = 0-10 db DC Gain Setting = db DC Gain Setting = 2-3 db DC Gain Setting = db DC Gain Setting = 4 4 db Unit (43) t LTR is the time required for the receive CDR to lock to the input reference clock frequency after coming out of reset. (44) t LTD is time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high. (45) t LTD_manual is the time required for the receiver CDR to start recovering valid data after the rx_is_lockedtodata signal goes high when the CDR is functioning in the manual mode. (46) t LTR_LTD_manual is the time the receiver CDR must be kept in lock to reference (LTR) mode after the rx_is_lockedtoref signal goes high when the CDR is functioning in the manual mode.
34 34 Transceiver Specifications for Arria 10 GX, SX, and GT Devices Table 34: Transmitter Specifications Preliminary Symbol/Description Supported I/O Standards Differential onchip termination resistors V OCM (AC coupled) V OCM (DC coupled) Condition Transceiver Speed Grades 1, 2, 3, 4, and 5 Min Typ Max High Speed Differential I/O (47) 85-Ω setting 85 ± 20% Ω 100-Ω setting 100 ± 20% Ω 120-Ω setting 120 ± 20% Ω 150-Ω setting 150 ± 20% Ω V CCT = 0.95 V 450 mv V CCT = 1.03 V 500 mv V CCT = 1.12 V 550 mv V CCT = 0.95 V 450 mv V CCT = 1.03 V 500 mv V CCT = 1.12 V 550 mv Rise time (48) 20% to 80% ps Fall time (48) 80% to 20% ps Intra-differential pair skew (49) TX V CM = 0.5 V and slew rate of 15 ps 15 ps Unit (47) High Speed Differential I/O is the dedicated I/O standard for the transmitter in Arria 10 transceivers. (48) The Quartus Prime software automatically selects the appropriate slew rate depending on the configured data rate or functional mode. (49) In QPI mode, if V CM < 0.17 V, the input Vid must be greater than 100 mv. If V CM > 0.17 V, the input Vid must be greater than 70 mv.
35 Transceiver Specifications for Arria 10 GX, SX, and GT Devices 35 Table 35: Typical Transmitter V OD Settings Preliminary Symbol V OD Setting V OD /V CCT Ratio V OD differential value = V OD /V CCT ratio x V CCT
36 36 Core Performance Specifications Core Performance Specifications Clock Tree Specifications Table 36: Clock Tree Performance for Arria 10 Devices Preliminary Parameter Global clock, regional clock, and small periphery clock E1L, E1M (50), E1S, I1L, I1M (50), I1S Performance E2L, E2S, I2L, I2S E1M (51), I1M (51), E3S, I3S MHz Large periphery clock MHz PLL Specifications Fractional PLL Specifications Table 37: Fractional PLL Specifications for Arria 10 Devices Preliminary Symbol Parameter Condition Min Typ Max Unit f IN Input clock frequency MHz f INPFD f VCO Input clock frequency to the phase frequency detector (PFD) PLL voltage-controlled oscillator (VCO) operating range Unit MHz GHz t EINDUTY Input clock duty cycle % (50) When you power V CC and V CCP at nominal voltage of 0.90 V. (51) When you power V CC and V CCP at lower voltage of 0.83 V. (52) This specification is limited in the Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O standard.
37 Fractional PLL Specifications 37 Symbol Parameter Condition Min Typ Max Unit f OUT f DYCONFIGCLK t LOCK t DLOCK Output frequency for internal global or regional clock Dynamic configuration clock for reconfig_clk Time required to lock from end-ofdevice configuration or deassertion of pll_powerdown Time required to lock dynamically (after switchover or reconfiguring any non-post-scale counters/delays) 644 MHz 100 MHz 1 ms 1 ms f CLBW PLL closed-loop bandwidth TBD MHz t PLL_PSERR Accuracy of PLL phase shift ±50 ps t ARESET t INCCJ (53)(54) t FOUTPJ (55) t FOUTCCJ (55) t OUTPJ (55) Minimum pulse width on the pll_ powerdown signal Input clock cycle-to-cycle jitter Period jitter for clock output in fractional mode Cycle-to-cycle jitter for clock output in fractional mode Period jitter for clock output in integer mode 10 ns F REF 100 MHz TBD UI (p-p) F REF < 100 MHz TBD ps (p-p) F OUT 100 MHz TBD ps (p-p) F OUT < 100 MHz TBD mui (p-p) F OUT 100 MHz TBD ps (p-p) F OUT < 100 MHz TBD mui (p-p) F OUT 100 MHz TBD ps (p-p) F OUT < 100 MHz TBD mui (p-p) (53) A high input jitter directly affects the PLL output jitter. To have low PLL output clock jitter, you must provide a clean clock source with jitter < 120 ps. (54) F REF is f IN /N, specification applies when N = 1. (55) External memory interface clock output jitter specifications use a different measurement method, which are available in Memory Output Clock Jitter Specification for Arria 10 Devices table.
38 38 I/O PLL Specifications Symbol Parameter Condition Min Typ Max Unit t OUTCCJ (55) dk BIT Cycle-to-cycle jitter for clock output in integer mode Bit number of Delta Sigma Modulator (DSM) F OUT 100 MHz TBD ps (p-p) F OUT < 100 MHz TBD mui (p-p) Related Information Memory Output Clock Jitter Specifications on page 58 Provides more information about the external memory interface clock output jitter specifications. I/O PLL Specifications Table 38: I/O PLL Specifications for Arria 10 Devices Preliminary f IN 32 bit Symbol Parameter Condition Min Typ Max Unit Input clock frequency 1 speed grade (56) MHz 2 speed grade (56) MHz 3 speed grade (56) MHz f INPFD Input clock frequency to the PFD MHz f VCO PLL VCO operating range 1 speed grade MHz 2 speed grade MHz 3 speed grade MHz f CLBW PLL closed-loop bandwidth MHz t EINDUTY f OUT Input clock or external feedback clock input duty cycle Output frequency for internal global or regional clock (C counter) % 1, 2, 3 speed grade 644 MHz (56) This specification is limited in the Quartus Prime software by the I/O maximum frequency. The maximum I/O frequency is different for each I/O standard.
Intel Stratix 10 Device Datasheet
Subscribe Send Feedback Latest document on the web: PDF HTML Contents Contents... 3 Electrical Characteristics... 3 Operating Conditions...4 Switching Characteristics...22 L-Tile Transceiver Performance
More informationIntel Cyclone 10 GX Device Datasheet
Subscribe Send Feedback Latest document on the web: PDF HTML Contents Contents...3 Electrical Characteristics... 3 Operating Conditions...3 Switching Characteristics...19 Transceiver Performance Specifications...
More informationArria V Device Datasheet
Arria V Device Datasheet TOC-2 Contents... 1-1 Electrical Characteristics... 1-1 Operating Conditions... 1-1 Switching Characteristics...1-23 Transceiver Performance Specifications... 1-23 Core Performance
More informationCyclone V Device Datasheet
2016.12.09 CV-51002 Subscribe This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing for Cyclone V devices. Cyclone V devices are
More informationCyclone V Device Datasheet
2015.12.04 CV-51002 Subscribe This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing for Cyclone V devices. Cyclone V devices are
More informationCyclone V Device Datasheet
Cyclone V Device Datasheet June 2013 CV-51002-3.4 CV-51002-3.4 Datasheet This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing
More informationStratix V Device Datasheet
Stratix V Device Datasheet SV53001-3.2 This document covers the electrical and switching characteristics for Stratix V devices. Electrical characteristics include operating conditions and power consumption.
More informationArria II Device Handbook Volume 3: Device Datasheet and Addendum
Arria II Device Handbook Volume 3: Device Datasheet and Addendum Arria II Device Handbook Volume 3: Device Datasheet and Addendum 101 Innovation Drive San Jose, CA 95134 www.altera.com AIIGX5V3-4.4 Document
More informationCyclone V Device Datasheet
Cyclone V Device Datasheet June 2012 CV-51002-2.0 CV-51002-2.0 Datasheet This datasheet describes the electrical characteristics, switching characteristics, configuration specifications, and I/O timing
More informationStratix IV Device Handbook Volume 4: Device Datasheet and Addendum
Stratix IV Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com SIV5V4-5.9 2014 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS
More informationHardCopy IV Device Handbook, Volume 4: Datasheet
HardCopy IV Device Handbook, Volume 4: Datasheet 101 Innovation Drive San Jose, CA 95134 www.altera.com HC4_H5V4-2.2 2012 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX,
More informationStratix V Device Handbook Volume 3: Datasheet
Stratix V Device Handbook Volume 3: Datasheet Stratix V Device Handbook Volume 3: Datasheet 101 Innovation Drive San Jose, CA 95134 www.altera.com SV5V3-1.1 10.1 2010 Altera Corporation. All rights reserved.
More information4. Operating Conditions
4. Operating Conditions H51005-3.4 Recommended Operating Conditions Tables 4 1 through 4 3 provide information on absolute maximum ratings, recommended operating conditions, DC operating conditions, and
More information2. Cyclone IV Reset Control and Power Down
May 2013 CYIV-52002-1.3 2. Cyclone IV Reset Control and Power Down CYIV-52002-1.3 Cyclone IV GX devices offer multiple reset signals to control transceiver channels independently. The ALTGX Transceiver
More informationThis document addresses transceiver-related known errata for the Stratix GX FPGA family production devices.
Stratix GX FPGA ES-STXGX-1.8 Errata Sheet This document addresses transceiver-related known errata for the Stratix GX FPGA family production devices. 1 For more information on Stratix GX device errata,
More informationImplementing QPI Using the Transceiver Native PHY IP Core in Stratix V Devices
Implementing QPI Using the Transceiver Native PHY IP Core in Stratix V Devices AN-687 Subscribe This application note describes how to implement the Intel QuickPath Interconnect (QPI) protocol with Altera
More informationHigh-Speed Link Tuning Using Signal Conditioning Circuitry in Stratix V Transceivers
High-Speed Link Tuning Using Signal Conditioning Circuitry in Stratix V Transceivers AN678 Subscribe This application note provides a set of guidelines to run error free across backplanes at high-speed
More informationCDR in Mercury Devices
CDR in Mercury Devices February 2001, ver. 1.0 Application Note 130 Introduction Preliminary Information High-speed serial data transmission allows designers to transmit highbandwidth data using differential,
More information2. HardCopy IV GX Dynamic Reconfiguration
March 2012 HIV53002-2.1 2. HardCopy IV GX Dynamic Reconfiguration HIV53002-2.1 HardCopy IV GX transceivers allow you to dynamically reconfigure different portions of the transceivers without powering down
More information8. QDR II SRAM Board Design Guidelines
8. QDR II SRAM Board Design Guidelines November 2012 EMI_DG_007-4.2 EMI_DG_007-4.2 This chapter provides guidelines for you to improve your system's signal integrity and layout guidelines to help successfully
More information3. Cyclone IV Dynamic Reconfiguration
3. Cyclone IV Dynamic Reconfiguration November 2011 CYIV-52003-2.1 CYIV-52003-2.1 Cyclone IV GX transceivers allow you to dynamically reconfigure different portions of the transceivers without powering
More informationInteger-N Clock Translator for Wireline Communications AD9550
Integer-N Clock Translator for Wireline Communications AD955 FEATURES BASIC BLOCK DIAGRAM Converts preset standard input frequencies to standard output frequencies Input frequencies from 8 khz to 2 MHz
More information2. Transceiver Basics for Arria V Devices
2. Transceiver Basics for Arria V Devices November 2011 AV-54002-1.1 AV-54002-1.1 This chapter contains basic technical details pertaining to specific features in the Arria V device transceivers. This
More informationICS LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER. Description. Features. Block Diagram DATASHEET
DATASHEET ICS670-04 Description The ICS670-04 is a high speed, low phase noise, Zero Delay Buffer (ZDB) which integrates IDT s proprietary analog/digital Phase Locked Loop (PLL) techniques. It is identical
More informationICS CLOCK SYNTHESIZER FOR PORTABLE SYSTEMS. Description. Features. Block Diagram PRELIMINARY DATASHEET
PRELIMINARY DATASHEET ICS1493-17 Description The ICS1493-17 is a low-power, low-jitter clock synthesizer designed to replace multiple crystals and oscillators in portable audio/video systems. The device
More informationFeatures. Applications
267MHz 1:2 3.3V HCSL/LVDS Fanout Buffer PrecisionEdge General Description The is a high-speed, fully differential 1:2 clock fanout buffer with a 2:1 input MUX optimized to provide two identical output
More informationICS PCI-EXPRESS CLOCK SOURCE. Description. Features. Block Diagram DATASHEET
DATASHEET ICS557-0 Description The ICS557-0 is a clock chip designed for use in PCI-Express Cards as a clock source. It provides a pair of differential outputs at 00 MHz in a small 8-pin SOIC package.
More informationLOW PHASE NOISE CLOCK MULTIPLIER. Features
DATASHEET Description The is a low-cost, low phase noise, high performance clock synthesizer for applications which require low phase noise and low jitter. It is IDT s lowest phase noise multiplier. Using
More informationPCI-EXPRESS CLOCK SOURCE. Features
DATASHEET ICS557-01 Description The ICS557-01 is a clock chip designed for use in PCI-Express Cards as a clock source. It provides a pair of differential outputs at 100 MHz in a small 8-pin SOIC package.
More informationStratix GX FPGA. Introduction. Receiver Phase Compensation FIFO
November 2005, ver. 1.5 Errata Sheet Introduction This document addresses transceiver-related known errata for the Stratix GX FPGA family production devices. 1 For more information on Stratix GX device
More informationLow-Jitter, Precision Clock Generator with Two Outputs
19-2456; Rev 0; 11/07 E V A L U A T I O N K I T A V A I L A B L E Low-Jitter, Precision Clock Generator Ethernet Networking Equipment General Description The is a low-jitter precision clock generator optimized
More informationICS NETWORKING AND PCI CLOCK SOURCE. Description. Features. Block Diagram DATASHEET
DATASHEET Description The is a low cost frequency generator designed to support networking and PCI applications. Using analog/digital Phase Locked-Loop (PLL) techniques, the device uses a standard fundamental
More informationSY89871U. General Description. Features. Typical Performance. Applications
2.5GHz Any Diff. In-To-LVPECL Programmable Clock Divider/Fanout Buffer w/ Internal Termination General Description The is a 2.5V/3.3V LVPECL output precision clock divider capable of accepting a high-speed
More informationPCKV MHz differential 1:10 clock driver
INTEGRATED CIRCUITS Supersedes data of 2001 Mar 16 File under Intergrated Circuits ICL03 2001 Jun 12 FEATURES ESD classification testing is done to JEDEC Standard JESD22. Protection exceeds 2000 V to HBM
More informationAdvance Information Clock Generator for PowerQUICC III
Freescale Semiconductor Technical Data Advance Information The is a PLL based clock generator specifically designed for Freescale Microprocessor and Microcontroller applications including the PowerPC and
More informationICS QUAD PLL CLOCK SYNTHESIZER. Description. Features. Block Diagram PRELIMINARY DATASHEET
PRELIMINARY DATASHEET ICS348-22 Description The ICS348-22 synthesizer generates up to 9 high-quality, high-frequency clock outputs including multiple reference clocks from a low frequency crystal or clock
More information3.3 VOLT COMMUNICATIONS CLOCK PLL MK Description. Features. Block Diagram DATASHEET
DATASHEET 3.3 VOLT COMMUNICATIONS CLOCK PLL MK2049-45 Description The MK2049-45 is a dual Phase-Locked Loop (PLL) device which can provide frequency synthesis and jitter attenuation. The first PLL is VCXO
More informationICS LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER. Description. Features. Block Diagram DATASHEET
DATASHEET ICS670-02 Description The ICS670-02 is a high speed, low phase noise, Zero Delay Buffer (ZDB) which integrates IDT s proprietary analog/digital Phase Locked Loop (PLL) techniques. Part of IDT
More informationLow-Jitter, 8kHz Reference Clock Synthesizer Outputs MHz
19-3530; Rev 0; 1/05 Low-Jitter, 8kHz Reference General Description The low-cost, high-performance clock synthesizer with an 8kHz input reference clock provides six buffered LVTTL clock outputs at 35.328MHz.
More informationFeatures. Applications
2.5GHz, Any Differential, In-to-LVPECL, Programmable Clock Divider/Fanout Buffer with Internal Termination General Description This low-skew, low-jitter device is capable of accepting a high-speed (e.g.,
More informationPI6C557-03AQ. PCIe 2.0 Clock Generator with 2 HCSL Outputs for Automotive Applications. Description. Features. Pin Configuration (16-Pin TSSOP)
PCIe.0 Clock Generator with HCSL Outputs for Automotive Applications Features ÎÎPCIe.0 compliant à à Phase jitter -.1ps RMS (typ) ÎÎLVDS compatible outputs ÎÎSupply voltage of 3.3V ±10% ÎÎ5MHz crystal
More informationPCKV MHz differential 1:10 clock driver
INTEGRATED CIRCUITS Supersedes data of 2001 Dec 03 2002 Sep 13 FEATURES ESD classification testing is done to JEDEC Standard JESD22. Protection exceeds 2000 V to HBM per method A114. Latch-up testing is
More informationICS309 SERIAL PROGRAMMABLE TRIPLE PLL SS VERSACLOCK SYNTH. Description. Features. Block Diagram DATASHEET
DATASHEET ICS309 Description The ICS309 is a versatile serially-programmable, triple PLL with spread spectrum clock source. The ICS309 can generate any frequency from 250kHz to 200 MHz, and up to 6 different
More information100-MHz Pentium II Clock Synthesizer/Driver with Spread Spectrum for Mobile or Desktop PCs
0 Features CY2280 100-MHz Pentium II Clock Synthesizer/Driver with Spread Spectrum for Mobile or Desktop PCs Mixed 2.5V and 3.3V operation Clock solution for Pentium II, and other similar processor-based
More informationTRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER. Features
DATASHEET ICS280 Description The ICS280 field programmable spread spectrum clock synthesizer generates up to four high-quality, high-frequency clock outputs including multiple reference clocks from a low-frequency
More informationSERIALLY PROGRAMMABLE CLOCK SOURCE. Features
DATASHEET ICS307-02 Description The ICS307-02 is a versatile serially programmable clock source which takes up very little board space. It can generate any frequency from 6 to 200 MHz and have a second
More informationImplementing Dynamic Reconfiguration in Cyclone IV GX Devices
Implementing Dynamic Reconfiguration in Cyclone IV GX Devices AN-609-2013.03.05 Application Note Cyclone IV GX transceivers support the dynamic reconfiguration feature which provides a solution that allows
More informationPI6C557-03B. PCIe 3.0 Clock Generator with 2 HCSL Outputs. Features. Description. Pin Configuration (16-Pin TSSOP) Block Diagram
Features ÎÎPCIe 3.0 compliant à à PCIe 3.0 Phase jitter - 0.45ps RMS (High Freq. Typ.) ÎÎLVDS compatible outputs ÎÎSupply voltage of 3.3V ±10% ÎÎ5MHz crystal or clock input frequency ÎÎHCSL outputs, 0.8V
More informationXCO FAST TURNAROUND CLOCK OSCILLATOR HIGH FREQUENCY, LOW JITTER CLOCK OSCILLATOR FEATURES + DESCRIPTION SELECTOR GUIDE LVCMOS LVDS LVPECL
XCO FAST TURNAROUND DESCRIPTION FEATURES + The XCO clock series is a cutting edge family of low to high frequency, low jitter output, single or multi - frequency clock oscillators. The XCO clocks are available
More informationNote Using the PXIe-5785 in a manner not described in this document might impair the protection the PXIe-5785 provides.
SPECIFICATIONS PXIe-5785 PXI FlexRIO IF Transceiver This document lists the specifications for the PXIe-5785. Specifications are subject to change without notice. For the most recent device specifications,
More informationPI6C PCI Express Clock. Product Features. Description. Block Diagram. Pin Configuration
Product Features ÎÎLVDS compatible outputs ÎÎSupply voltage of 3.3V ±10% ÎÎ5MHz input frequency ÎÎHCSL outputs, 0.7V Current mode differential pair ÎÎJitter 60ps cycle-to-cycle (typ) ÎÎSpread of ±0.5%,
More informationFeatures. Applications
Ultra-Precision, 8:1 MUX with Internal Termination and 1:2 LVPECL Fanout Buffer Precision Edge General Description The is a low-jitter, low-skew, high-speed 8:1 multiplexer with a 1:2 differential fanout
More informationICS NETWORKING CLOCK SYNTHESIZER. Description. Features. Block Diagram DATASHEET
DATASHEET Description The generates four high-quality, high-frequency clock outputs. It is designed to replace multiple crystals and crystal oscillators in networking applications. Using ICS patented Phase-Locked
More informationICS502 LOCO PLL CLOCK MULTIPLIER. Description. Features. Block Diagram DATASHEET
DATASHEET ICS502 Description The ICS502 LOCO TM is the most cost effective way to generate a high-quality, high-frequency clock output and a reference from a lower frequency crystal or clock input. The
More informationHIGH FREQUENCY, LOW JITTER CLOCK OSCILLATOR
DESCRIPTION FEATURES + The XCO clock series is a cutting edge family of low to high frequency, low jitter output, single or multi - frequency clock oscillators. The XCO clocks are available in 7.0 x 5.0,
More informationSpread Spectrum Frequency Timing Generator
Spread Spectrum Frequency Timing Generator Features Maximized EMI suppression using Cypress s Spread Spectrum technology Generates a spread spectrum copy of the provided input Selectable spreading characteristics
More informationICS CLOCK MULTIPLIER AND JITTER ATTENUATOR. Description. Features. Block Diagram DATASHEET
DATASHEET ICS2059-02 Description The ICS2059-02 is a VCXO (Voltage Controlled Crystal Oscillator) based clock multiplier and jitter attenuator designed for system clock distribution applications. This
More informationFeatures. Micrel Inc Fortune Drive San Jose, CA USA tel +1 (408) fax + 1 (408)
2.5V Low Jitter, Low Skew 1:12 LVDS Fanout Buffer with 2:1 Input MUX and Internal Termination General Description The is a 2.5V low jitter, low skew, 1:12 LVDS fanout buffer optimized for precision telecom
More informationSSTV V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM
INTEGRATED CIRCUITS 2000 Dec 01 File under Integrated Circuits ICL03 2002 Feb 19 FEATURES Stub-series terminated logic for 2.5 V (SSTL_2) Optimized for stacked DDR (Double Data Rate) SDRAM applications
More informationPeak Reducing EMI Solution
Peak Reducing EMI Solution Features Cypress PREMIS family offering enerates an EMI optimized clocking signal at the output Selectable input to output frequency Single 1.% or.% down or center spread output
More informationMK AMD GEODE GX2 CLOCK SOURCE. Description. Features. Block Diagram DATASHEET
DATASHEET MK1491-09 Description The MK1491-09 is a low-cost, low-jitter, high-performance clock synthesizer for AMD s Geode-based computer and portable appliance applications. Using patented analog Phased-Locked
More informationFeatures. Applications. Micrel Inc Fortune Drive San Jose, CA USA tel +1 (408) fax + 1 (408)
Flexible Ultra-Low Jitter Clock Synthesizer Clockworks FLEX General Description The SM802xxx series is a member of the ClockWorks family of devices from Micrel and provide an extremely low-noise timing
More informationPLL & Timing Glossary
February 2002, ver. 1.0 Altera Stratix TM devices have enhanced phase-locked loops (PLLs) that provide designers with flexible system-level clock management that was previously only available in discrete
More informationDual-Rate Fibre Channel Repeaters
9-292; Rev ; 7/04 Dual-Rate Fibre Channel Repeaters General Description The are dual-rate (.0625Gbps and 2.25Gbps) fibre channel repeaters. They are optimized for use in fibre channel arbitrated loop applications
More informationTOP VIEW. Maxim Integrated Products 1
19-2213; Rev 0; 10/01 Low-Jitter, Low-Noise LVDS General Description The is a low-voltage differential signaling (LVDS) repeater, which accepts a single LVDS input and duplicates the signal at a single
More informationICS LOW PHASE NOISE CLOCK MULTIPLIER. Features. Description. Block Diagram DATASHEET
DATASHEET ICS601-01 Description The ICS601-01 is a low-cost, low phase noise, high-performance clock synthesizer for applications which require low phase noise and low jitter. It is IDT s lowest phase
More informationFIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER. Features VDD PLL1 PLL2 GND
DATASHEET ICS252 Description The ICS252 is a low cost, dual-output, field programmable clock synthesizer. The ICS252 can generate two output frequencies from 314 khz to 200 MHz using up to two independently
More informationFeatures. Applications
Ultra-Precision 1:8 LVDS Fanout Buffer with Three 1/ 2/ 4 Clock Divider Output Banks Revision 6.0 General Description The is a 2.5V precision, high-speed, integrated clock divider and LVDS fanout buffer
More informationSY89540U. General Description. Features. Typical Performance. Applications. Precision Low Jitter 4x4 LVDS Crosspoint Switch with Internal Termination
Precision Low Jitter 4x4 LVDS Crosspoint Switch with Internal Termination General Description The is a low-jitter, low skew, high-speed 4x4 crosspoint switch optimized for precision telecom and enterprise
More informationXR81112 Universal Clock - High Frequency LVCMOS/LVDS/LVPECL Clock Synthesizer
Universal Clock - High Frequency LVCMOS/LVDS/LVPECL Clock Synthesizer General Description The XR81112 is a family of Universal Clock synthesizer devices in a compact FN-12 package. The devices generate
More informationMK VCXO-BASED FRAME CLOCK FREQUENCY TRANSLATOR. Features. Description. Block Diagram DATASHEET. Pullable Crystal
DATASHEET MK2059-01 Description The MK2059-01 is a VCXO (Voltage Controlled Crystal Oscillator) based clock generator that produces common telecommunications reference frequencies. The output clock is
More informationCLK_EN CLK_SEL. Q3 THIN QFN-EP** (4mm x 4mm) Maxim Integrated Products 1
19-2575; Rev 0; 10/02 One-to-Four LVCMOS-to-LVPECL General Description The low-skew, low-jitter, clock and data driver distributes one of two single-ended LVCMOS inputs to four differential LVPECL outputs.
More informationEVALUATION KIT AVAILABLE +3.3V, Low-Jitter Crystal to LVPECL Clock Generator QA_C. 125MHz QA QA. 125MHz MAX3679A QB0 QB MHz QB1 QB
19-4858; Rev 0; 8/09 EVALUATION KIT AVAILABLE +3.3V, Low-Jitter Crystal to LVPECL General Description The is a low-jitter precision clock generator with the integration of three LVPECL and one LVCMOS outputs
More informationSY89838U. General Description. Features. Applications. Markets. Precision 1:8 LVDS Clock Fanout Buffer with 2:1 Runt Pulse Eliminator Input MUX
Precision 1:8 LVDS Clock Fanout Buffer with 2:1 Runt Pulse Eliminator Input MUX General Description The is a low jitter, low skew, high-speed 1:8 fanout buffer with a unique, 2:1 differential input multiplexer
More informationICS LOW EMI CLOCK GENERATOR. Description. Features. Block Diagram DATASHEET
DATASHEET ICS180-51 Description The ICS180-51 generates a low EMI output clock from a clock or crystal input. The device uses IDT s proprietary mix of analog and digital Phase-Locked Loop (PLL) technology
More informationMK SPREAD SPECTRUM MULTIPLIER CLOCK. Description. Features. Block Diagram DATASHEET
DATASHEET MK1714-01 Description The MK1714-01 is a low cost, high performance clock synthesizer with selectable multipliers and percentages of spread spectrum designed to generate high frequency clocks
More informationMK SPREAD SPECTRUM MULTIPLIER CLOCK. Description. Features. Block Diagram DATASHEET
DATASHEET MK1714-02 Description The MK1714-02 is a low cost, high performance clock synthesizer with selectable multipliers and percentages of spread designed to generate high frequency clocks with low
More informationFeatures. Applications
PCIe Fanout Buffer 267MHz, 8 HCSL Outputs with 2 Input MUX PrecisionEdge General Description The is a high-speed, fully differential 1:8 clock fanout buffer optimized to provide eight identical output
More information19MHz to 250MHz Low Phase-Noise XO PAD CONFIGURATION
FEATURES < 0.6ps RMS phase jitter (12kHz to 20MHz) at 155.52MHz 30ps max peak to peak period jitter 8bit Switch Capacitor for ±50PPM crystal CLoad tuning о Load Capacitance Tuning Range: 8pF to 12pF Ultra
More informationYT0 YT1 YC1 YT2 YC2 YT3 YC3 FBOUTT FBOUTC
Differential Clock Buffer/Driver Features Phase-locked loop (PLL) clock distribution for Double Data Rate Synchronous DRAM applications 1:5 differential outputs External feedback pins (, ) are used to
More informationFeatures VDD 1 CLK1. Output Divide PLL 2 OE0 GND VDD. IN Transition Detector CLK1 INB. Output Divide PLL 2 OE0 GND
DATASHEET ICS58-0/0 Description The ICS58-0/0 are glitch free, Phase Locked Loop (PLL) based clock multiplexers (mux) with zero delay from input to output. They each have four low skew outputs which can
More informationFeatures. EXTERNAL PULLABLE CRYSTAL (external loop filter) FREQUENCY MULTIPLYING PLL 2
DATASHEET 3.3 VOLT COMMUNICATIONS CLOCK VCXO PLL MK2049-34A Description The MK2049-34A is a VCXO Phased Locked Loop (PLL) based clock synthesizer that accepts multiple input frequencies. With an 8 khz
More informationTOP VIEW MAX9111 MAX9111
19-1815; Rev 1; 3/09 EVALUATION KIT AVAILABLE Low-Jitter, 10-Port LVDS Repeater General Description The low-jitter, 10-port, low-voltage differential signaling (LVDS) repeater is designed for applications
More informationProduct Data Sheet. PIN ASSIGNMENT (9 x 9 mm SMT) Loop Filter. M Divider. Mfin Div (1, 4, 8, 32) or ( 1, 4, 8, 16)
GENERAL DESCRIPTION The is a VCSO (Voltage Controlled SAW Oscillator) based clock jitter attenuator PLL designed for clock jitter attenuation and frequency translation. The device is ideal for generating
More informationLow-Jitter, Precision Clock Generator with Four Outputs
19-5005; Rev 0; 10/09 EVALUATION KIT AVAILABLE General Description The is a low-jitter, precision clock generator optimized for networking applications. The device integrates a crystal oscillator and a
More informationICS LOW EMI CLOCK GENERATOR. Features. Description. Block Diagram DATASHEET
DATASHEET ICS10-52 Description The ICS10-52 generates a low EMI output clock from a clock or crystal input. The device uses ICS proprietary mix of analog and digital Phase-Locked Loop (PLL) technology
More informationPT7C4511. PLL Clock Multiplier. Features. Description. Pin Configuration. Pin Description
Features Zero ppm multiplication error Input crystal frequency of 5-30 MHz Input clock frequency of - 50 MHz Output clock frequencies up to 200 MHz Peak to Peak Jitter less than 200ps over 200ns interval
More informationM2040 FREQUENCY TRANSLATION PLL WITH AUTOSWITCH
GENERAL DESCRIPTION The is a VCSO (Voltage Controlled SAW Oscillator) based clock generator PLL designed for clock protection, frequency translation and jitter attenuation in fault tolerant computing applications.
More informationMK LOW PHASE NOISE T1/E1 CLOCK GENERATOR. Features. Description. Block Diagram DATASHEET. Pullable Crystal
DATASHEET LOW PHASE NOISE T1/E1 CLOCK ENERATOR MK1581-01 Description The MK1581-01 provides synchronization and timing control for T1 and E1 based network access or multitrunk telecommunication systems.
More informationHigh-Frequency Programmable PECL Clock Generator
High-Frequency Programmable PECL Clock Generator 1CY2213 Features Jitter peak-peak (TYPICAL) = 35 ps LVPECL output Default Select option Serially-configurable multiply ratios Output edge-rate control 16-pin
More informationFeatures. Applications. Markets
Precision LVPECL Runt Pulse Eliminator 2:1 MUX with 1:2 Fanout and Internal Termination General Description The is a low jitter PECL, 2:1 differential input multiplexer (MUX) optimized for redundant source
More information3.3V Dual-Output LVPECL Clock Oscillator
19-4558; Rev 1; 3/10 3.3V Dual-Output LVPECL Clock Oscillator General Description The is a dual-output, low-jitter clock oscillator capable of producing frequency output pair combinations ranging from
More informationMAX 10 Analog to Digital Converter User Guide
MAX 10 Analog to Digital Converter User Guide Subscribe UG-M10ADC 101 Innovation Drive San Jose, CA 95134 www.altera.com TOC-2 Contents MAX 10 ADC Overview... 1-1 ADC Block Counts in MAX 10 Devices...
More informationSL28SRC01. PCI Express Gen 2 & Gen 3 Clock Generator. Features. Pin Configuration. Block Diagram
PCI Express Gen 2 & Gen 3 Clock Generator Features Low power PCI Express Gen 2 & Gen 3clock generator One100-MHz differential SRC clocks Low power push-pull output buffers (no 50ohm to ground needed) Integrated
More informationLVDS/Anything-to-LVPECL/LVDS Dual Translator
19-2809; Rev 1; 10/09 LVDS/Anything-to-LVPECL/LVDS Dual Translator General Description The is a fully differential, high-speed, LVDS/anything-to-LVPECL/LVDS dual translator designed for signal rates up
More informationSSTVN bit 1:2 SSTL_2 registered buffer for DDR
INTEGRATED CIRCUITS 2004 Jul 15 Philips Semiconductors FEATURES Stub-series terminated logic for 2.5 V V DD (SSTL_2) Designed for PC1600 PC2700 (at 2.5 V) and PC3200 (at 2.6 V) applications Pin and function
More informationFeatures VDD 2. 2 Clock Synthesis and Control Circuitry. Clock Buffer/ Crystal Oscillator GND
DATASHEET Description The is a low cost, low jitter, high performance clock synthesizer for networking applications. Using analog Phase-Locked Loop (PLL) techniques, the device accepts a.5 MHz or 5.00
More informationFeatures. Applications. Markets
3.2Gbps Precision, LVDS 2:1 MUX with Internal Termination and Fail Safe Input General Description The is a 2.5V, high-speed, fully differential LVDS 2:1 MUX capable of processing clocks up to 2.5GHz and
More informationPCK MHz I 2 C differential 1:10 clock driver INTEGRATED CIRCUITS
INTEGRATED CIRCUITS 70 190 MHz I 2 C differential 1:10 clock driver Product data Supersedes data of 2001 May 09 File under Integrated Circuits, ICL03 2001 Jun 12 FEATURES Optimized for clock distribution
More information