Peak Reducing EMI Solution

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1 Peak Reducing EMI Solution Features Cypress PREMIS family offering enerates an EMI optimized clocking signal at the output Selectable input to output frequency Single 1.% or.% down or center spread output Integrated loop filter components Operates with a.v or V supply Low power CMOS design Available in -pin SOIC (Small Outline Integrated Circuit) or 1-pin TSSOP (Thin Shrink Small Outline Package select options only) Key Specifications Supply Voltages:...V DD =.V±% or V DD = V±10% Frequency Range:... MHz F in MHz Crystal Reference Range... MHz F in 0 MHz Cycle to Cycle Jitter: ps (max.) Selectable Spread Percentage:...1.% or.% Duty Cycle:... 0/0% (worst case) Rise and Fall Time:... ns (max.) Simplified Block Diagram. or.0v Table 1. Modulation Width Selection W11-01, 0, 0 SS% 0 F in F out F in 1.% 1 F in F out F in.% Table. Frequency Range Selection W11 Option# W11-1,, F in + 0.% F in 0.% F in + 1.% F in 1.% FS FS1-01, 1 (MHz) -0, (MHz) -0, (MHz) 0 0 F IN F IN N/A 0 1 F IN F IN N/A 1 0 F IN 0 N/A F IN F IN N/A F IN Pin Configurations SOIC XTAL Input 0 MHz Max. X1 X W11. or.0v Spread Spectrum (EMI suppressed) CLKIN or X1 or X ND SS% CLKIN or X1 or X ND SS% 1 1 W11-01/1 W11-0/0 W11-/ FS FS1 VDD CLKOUT SSON# FS1 VDD CLKOUT TSSOP Oscillator or Reference Input W11 Spread Spectrum (EMI suppressed) FS CLKIN or X1 or X ND SS% 1 W FS1 VDD CLKOUT PREMIS is a trademark of Cypress Semiconductor Corporation. Cypress Semiconductor Corporation 901 North First Street San Jose CA July 1, 000, rev. *B

2 Pin Definitions Pin Name Pin No. (SOIC) Pin No. (TSSOP)(-01) Pin Type Pin Description CLKOUT O Modulated Frequency: Frequency modulated copy of the unmodulated input clock (SSON# asserted). CLKIN or X1 1 I Crystal Connection or External Reference Frequency Input: This pin has dual functions. It may either be connected to an external crystal, or to an external reference clock. or X I Crystal Connection: If using an external reference, this pin must be left unconnected. SSON# (0/0// ) -- I Spread Spectrum Control (Active LOW): Asserting this signal (active LOW) turns the internal modulation waveform on. This pin has an internal pull-down resistor. FS1:, (01/1) 1, 1 I Frequency Selection Bit(s) 1 and : These pins select the frequency range of operation. Refer to Table. These pins have internal pull-up resistors. SS% I Modulation Width Selection: When Spread Spectrum feature is turned on, this pin is used to select the amount of variation and peak EMI reduction that is desired on the output signal. This pin has an internal pull-up resistor. VDD 10 P Power Connection: Connected to.v or V power supply. ND round Connection: Connect all ground pins to the common system ground plane.,, 9, 11, 1, 1 No Connection.

3 Overview The W11 products are one series of devices in the Cypress PREMIS family. The PREMIS family incorporates the latest advances in PLL spread spectrum frequency synthesizer techniques. By frequency modulating the output with a lowfrequency carrier, peak EMI is greatly reduced. Use of this technology allows systems to pass increasingly difficult EMI testing without resorting to costly shielding or redesign. In a system, not only is EMI reduced in the various clock lines, but also in all signals which are synchronized to the clock. Therefore, the benefits of using this technology increase with the number of address and data lines in the system. The Simplified Block Diagram on page 1 shows a simple implementation. Functional Description The W11 uses a Phase-Locked Loop (PLL) to frequency modulate an input clock. The result is an output clock whose frequency is slowly swept over a narrow band near the input signal. The basic circuit topology is shown in Figure 1. The input reference signal is divided by Q and fed to the phase detector. A signal from the VCO is divided by P and fed back to the phase detector also. The PLL will force the frequency of the VCO output signal to change until the divided output signal and the divided reference signal match at the phase detector input. The output frequency is then equal to the ratio of P/Q times the reference frequency. (Note: For the W11 the output frequency is equal to the input frequency.) The unique feature of the Spread Spectrum Frequency Timing enerator is that a modulating waveform is superimposed at the input to the VCO. This causes the VCO output to be slowly swept across a predetermined frequency band. Because the modulating frequency is typically 1000 times slower than the fundamental clock, the spread spectrum process has little impact on system performance. Frequency Selection With SSFT In Spread Spectrum Frequency Timing eneration, EMI reduction depends on the shape, modulation percentage, and frequency of the modulating waveform. While the shape and frequency of the modulating waveform are fixed for a given frequency, the modulation percentage may be varied. Using frequency select bits (FS1: pins), the frequency range can be set. Spreading percentage is set to be 1.% or.% (see Table 1). A larger spreading percentage improves EMI reduction. However, large spread percentages may either exceed system maximum frequency ratings or lower the average frequency to a point where performance is affected. For these reasons, spreading percentages between 0.% and.% are most common. V DD Clock Input Reference Input Freq. Divider Q Phase Detector Charge Pump Σ VCO Post Dividers CLKOUT (EMI suppressed) Modulating Waveform Feedback Divider P PLL ND Figure 1. Functional Block Diagram

4 Spread Spectrum Frequency Timing eneration The device generates a clock that is frequency modulated in order to increase the bandwidth that it occupies. By increasing the bandwidth of the fundamental and its harmonics, the amplitudes of the radiated electromagnetic emissions are reduced. This effect is depicted in Figure. As shown in Figure, a harmonic of a modulated clock has a much lower amplitude than that of an unmodulated signal. The reduction in amplitude is dependent on the harmonic number and the frequency deviation or spread. The equation for the reduction is: db =. + 9*log 10 (P) + 9*log 10 (F) Where P is the percentage of deviation and F is the frequency in MHz where the reduction is measured. The output clock is modulated with a waveform depicted in Figure. This waveform, as discussed in Spread Spectrum Clock eneration for the Reduction of Radiated Emissions by Bush, Fessler, and Hardin produces the maximum reduction in the amplitude of radiated electromagnetic emissions. Figure details the Cypress spreading pattern. Cypress does offer options with more spread and greater EMI reduction. Contact your local Sales representative for details on these devices. SSFT Typical Clock EMI Reduction Amplitude (db) Amplitude (db) Spread Spectrum Enabled Non- Spread Spectrum Frequency Span (MHz) Center Spread Frequency Span (MHz) Down Spread Figure. Clock Harmonic with and without SSC Modulation Frequency Domain Representation MAX. FREQUEY 10% 0% 0% 0% 0% 0% 0% 0% 90% 100% 10% 0% 0% 0% 0% 0% 0% 0% 90% 100% MIN. Figure. Typical Modulation Profile

5 Absolute Maximum Ratings Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only. Operation of the device at these or any other conditions above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability. Parameter Description Rating Unit V DD, V IN Voltage on any pin with respect to ND 0. to +.0 V T ST Storage Temperature to +10 C T A Operating Temperature 0 to +0 C T B Ambient Temperature under Bias to +1 C P D Power Dissipation 0. W DC Electrical Characteristics: 0 C < T A < 0 C, V DD =.V ±% Parameter Description Test Condition Min. Typ. Max. Unit I DD Supply Current 1 ma t ON Power-Up Time First locked clock cycle after Power ms ood V IL Input Low Voltage 0. V V IH Input High Voltage. V V OL Low Voltage 0. V V OH High Voltage. V I IL Input Low Current Note µa I IH Input High Current Note 1 10 µa I OL Low 0.V, V DD =.V 1 ma I OH High V DD =.V 1 ma C I Input Capacitance All pins except CLKIN pf C I Input Capacitance CLKIN pin only 10 pf R P Input Pull-Up Resistor 00 kω Z OUT Clock Impedance Ω Note: 1. Inputs FS1: have a pull-up resistor; Input SSON# has a pull-down resistor.

6 DC Electrical Characteristics: 0 C < T A < 0 C, V DD = V ±10% Parameter Description Test Condition Min. Typ. Max. Unit I DD Supply Current 0 0 ma t ON Power-Up Time First locked clock cycle after ms Power ood V IL Input Low Voltage 0.1V DD V V IH Input High Voltage 0.V DD V V OL Low Voltage 0. V V OH High Voltage. V I IL Input Low Current Note µa I IH Input High Current Note 1 10 µa I OL Low 0.V, V DD = V ma I OH High V DD = V ma C I Input Capacitance All pins except CLKIN pf C I Input Capacitance CLKIN pin only 10 pf R P Input Pull-Up Resistor 00 kω Z OUT Clock Impedance Ω AC Electrical Characteristics: T A = 0 C to +0 C, V DD =.V ±% or V±10% Parameter Description Test Condition Min. Typ. Max. Unit f IN Input Frequency Input Clock MHz f OUT Frequency Spread Off MHz t R Rise Time V DD, 1-pF load 0.V.V ns t F Fall Time V DD, 1-pF load.v 0.V ns t OD Duty Cycle 1-pF load 0 0 % t ID Input Duty Cycle 0 0 % t JCYC Jitter, Cycle-to-Cycle 0 00 ps Harmonic Reduction f out = 0 MHz, third harmonic measured, reference board, 1-pF load db

7 Application Information Recommended Circuit Configuration For optimum performance in system applications the power supply decoupling scheme shown in Figure should be used. V DD decoupling is important to both reduce phase jitter and EMI radiation. The 0.1-µF decoupling capacitor should be placed as close to the V DD pin as possible, otherwise the increased trace inductance will negate its decoupling capability. The 10-µF decoupling capacitor shown should be a tantalum type. For further EMI protection, the V DD connection can be made via a ferrite bead, as shown. Recommended Board Layout Figure shows a recommended -layer board layout. Reference Input ND 1 W11 R1 Clock C1 0.1 µf. or V System Supply FB C 10 µf Tantalum Figure. Recommended Circuit Configuration FB C1 = C = R1 = = High frequency supply decoupling capacitor (0.1-µF recommended). Common supply low frequency decoupling capacitor (10-µF tantalum recommended). Match value to line impedance Ferrite Bead = Via To ND Plane Reference Input C1 R1 Clock Power Supply Input (. or V) FB C Figure. Recommended Board Layout (-Layer Board) Ordering Information Freq. Mask Ordering Code Code W11 01, 0, 0 1,, Document #: B Package Name Package Type -pin Plastic SOIC (10-mil) W11 01 X 1-pin Plastic TSSOP

8 Package Diagram 1-pin Thin Shrink Small Outline Package

9 Package Diagram (continued) -Pin Small Outline Integrated Circuit (SOIC, 10 mils) Cypress Semiconductor Corporation, 000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.

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