PART MAX1642C/D MAX1642EUA MAX1643C/D TOP VIEW PFI BATTLO LOW-BATTERY DETECTOR OUTPUT
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1 ; Rev ; 6/97 EALUATION KIT MANUAL FOLLOWS DATA SHEET High-Efficiency, Step-Up General Description The are high-efficiency, low-voltage, step-up DC-DC converters intended for devices powered by a single alkaline cell. They feature low quiescent supply currents and are supplied in the ultra-small µmax package, which is only 1.1mm high. The guaranteed start-up voltage is.88. Each device consists of an internal 1Ω, N-channel MOSFET power switch; a built-in synchronous rectifier that acts as the catch diode; an oscillator; a reference; and pulse-frequency-modulation (PFM) control circuitry. Both devices feature an independent undervoltage comparator (/PFO). The also includes a 2 logic-controlled shutdown mode. The MAX1643 offers a dedicated low-battery detector (LO) in lieu of shutdown. The output voltage for each device is preset to 3.3 ±4%, or can be adjusted from +2 to +5.2 using only two resistors. Applications Pagers Remote Controls Pointing Devices Personal Medical Monitors Single-Cell Battery-Powered Devices Features Built-In Synchronous Rectifier.88 Guaranteed Start-Up Ultra-Small µmax Package: 1.1mm High 83% Efficiency 4 Quiescent Supply Current into Pin 2 Logic-Controlled Shutdown () Two Undervoltage Detectors (MAX1643) 2 to 5.2 Output Range 2mA Output Current at 1.2 Input Reverse Battery Protection Ordering Information PART C/D EUA MAX1643C/D TOP IEW TEMP. RANGE C to +7 C -4 C to +85 C C to +7 C PIN-PACKAGE Dice* 8 µmax Dice* MAX1643EUA -4 C to +85 C 8 µmax *Dice are tested at T A = +25 C. Note: To order these devices shipped in tape and reel, add a -T to the part number. Pin Configurations Typical Operating Circuit PFO INPUT.88 TO µH 22µF ON OFF LOW-ERY DETECTOR INPUT SHDN PFO PUT µF LOW-ERY DETECTOR PUT SHDN LO µmax MAX PFO 4 5 µmax Maxim Integrated Products 1 For free samples & the latest literature: or phone For small orders, phone ext
2 ABSOLUTE MAXIMUM RATINGS to to 6. Forward Current...5A to to 6., Current...1A to to 6. SHDN,, LO, PFO to to 6. to to Reverse Battery Current (T A = +25 C) (Note 1)...22mA R L = 3kΩ, T A = +25 C <.1 External feedback External feedback = 3.3 = 3.3 = 1. () I LOAD = 2mA = 1.3 Falling, hysteresis = 1% Continuous Power Dissipation µmax (derate 4.1mW/ C above 7 C)...33mW Operating Temperature Range EUA/MAX1643EUA...-4 C to +85 C Junction Temperature C Storage Temperature Range C to +165 C Lead Temperature (soldering, 1sec)...+3 C Note 1: The reverse battery current is measured from the Typical Operating Circuit s input terminal to when the battery is connected backward. A reverse current of 22mA will not exceed package dissipation limits but, if left for an extended time (more than 1 minutes), may degrade performance. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = SHDN = 1.3, I LOAD = ma, =, T A = C to +85 C, unless otherwise noted. Typical values are at T A = +25 C.) Minimum Operating Input oltage Maximum Operating Input oltage Start-Up oltage (Note 2) Start-Up oltage Tempco Output oltage Output oltage Range Set oltage N-Channel On-Resistance P-Channel On-Resistance P-Channel Catch-Diode oltage On-Time Constant Off-Time Tracking Ratio (Note 3) Quiescent Current into Quiescent Current into Shutdown Current into Shutdown Current into Efficiency Input Current Trip oltage Input Current PARAMETER PFO, LO Low Output oltage PFO, LO Leakage Current LO Trip oltage SHDN Input Low oltage SHDN Input High oltage SHDN Input Current SYMBOL (MIN) K RATIO I Q I Q I SHDN, I SHDN, η OL IL IH I DIODE = 1mA, P-channel switch off.9 < < 1.5 (t ON = K / ).9 < < 1.5, = 3.3 = 3.5 CONDITIONS = 3.5 () = 65m =, = 3.3, I SINK = 1mA = 65m, PFO = 6 = 3.3, hysteresis = 2% (MAX1643) % of () % of () () MIN TYP MAX UNITS m/ C Ω Ω -µs % na m na % % na 2
3 ELECTRICAL CHARACTERISTICS ( = SHDN = 1.3, I LOAD = ma, =, T A = -4 C to +85 C, unless otherwise noted.) (Note 4) Output oltage Set oltage PARAMETER N-Channel On-Resistance P-Channel On-Resistance On-Time Constant Quiescent Current into Quiescent Current into Shutdown Current into Shutdown Current into Trip oltage LO Trip oltage SYMBOL K I Q I Q I SHDN, I SHDN, <.1 External feedback = 3.3 = < < 1.5 (t ON = K / ) = 3.5 = 3.5 () CONDITIONS = 1. () Falling, hysteresis = 1% Falling, = 3.3, hysteresis = 2% (MAX1643) MIN MAX UNITS Ω Ω -µs m Note 2: Start-up guaranteed by correlation to measurements of device parameters (i.e., switch on-resistance, on-times, off-times, and output voltage trip points). t Note 3: t = ON x OFF. This guarantees discontinuous conduction. - x RATIO Note 4: Specifications to -4 C are guaranteed by design, not production tested. Typical Operating Characteristics (Circuit of Figure 4, = 1.2, R1 + R2 = 1MΩ, T A = +25 C, unless otherwise noted.) EFFICIENCY vs. PUT CURRENT ( = 2.4) IN = 1.6 /43 TOC1A EFFICIENCY vs. PUT CURRENT ( = 2.4) IN = 1.6 /43 TOC1B EFFICIENCY vs. PUT CURRENT ( = 3.3) IN = 1.6 /43 TOC2A EFFICIENCY (%) IN =.85 IN = 1. IN = 1.2 EFFICIENCY (%) IN =.85 IN = 1. IN = 1.2 EFFICIENCY (%) IN =.85 IN = 1. IN = L1 = 1µH SUMIDA CD PUT CURRENT (ma) 2 1 L1 = 15µH TDK NLC5655T-151K PUT CURRENT (ma) 2 1 L1 = 1µH SUMIDA CD PUT CURRENT (ma) 3
4 EFFICIENCY (%) Typical Operating Characteristics (continued) (Circuit of Figure 4, = 1.2, R1 + R2 = 1MΩ, T A = +25 C, unless otherwise noted.) EFFICIENCY vs. PUT CURRENT ( = 3.3) IN = IN = IN = IN = L1 = 15µH TDK NLC5655T-151K PUT CURRENT (ma) /43 TOC2B EFFICIENCY (%) EFFICIENCY vs. PUT CURRENT ( = 5.) IN = 1. IN = 1.2 L1 = 1µH SUMIDA CD54-11 IN = 1.6 IN = PUT CURRENT (ma) /43 TOC3a EFFICIENCY (%) EFFICIENCY vs. PUT CURRENT ( = 5.) IN = 1. IN = 1.2 L1 = 15µH TDK NLC5655T-151K IN = 1.6 IN = PUT CURRENT (ma) /43 TOC3b QUIESCENT CURRENT (ma) 1, 1 1 NO-LOAD ERY CURRENT vs. INPUT OLTAGE = 5. /43 TOC4 QUIESCENT CURRENT () NO-LOAD ERY CURRENT vs. TEMPERATURE = 1.2 = 3.3 /43 TOC5 QUIESCENT CURRENT () AND PIN QUIESCENT CURRENTS vs. TEMPERATURE 3 = 1.2 = I /43 TOC6 = 2.5 OR I INPUT OLTAGE () TEMPERATURE ( C) TEMPERATURE ( C) START-UP INPUT OLTAGE () MINIMUM START-UP INPUT OLTAGE vs. PUT CURRENT L1 = 1µH SUMIDA CD54-11 = 5 = 2.4, 3.3 /43 TOC7a START-UP INPUT OLTAGE () MINIMUM START-UP INPUT OLTAGE vs. PUT CURRENT L1 = 15µH TDK NLC5655T-151K = 5 = 2.4, 3.3 /43 TOC7b PUT CURRENT (ma) PUT CURRENT (ma) 4
5 Typical Operating Characteristics (continued) (Circuit of Figure 4, = 1.2, R1 + R2 = 1MΩ, T A = +25 C, unless otherwise noted.) MAXIMUM PUT CURRENT (ma) MAXIMUM PUT CURRENT vs. INPUT OLTAGE = 2.4 L1 = 1µH SUMIDA CD54-11 = 3.3 = INPUT OLTAGE () /43 TOC8b MAXIMUM PUT CURRENT (ma) MAXIMUM PUT CURRENT vs. INPUT OLTAGE = 2.4 = 3.3 L1 = 15µH TDK NLC5655T-151K = INPUT OLTAGE () /43 TOC8c A B C SWITCHING WAEFORMS 1ms/div = 3.3, IN = 1.2, I = 12mA A:, 2/div, L1 = TDK NLC5655T-151K B:, 2m/div, 3.3 DC OFFSET C: INDUCTOR CURRENT, 1mA/div /43 TOC9 LOAD-TRANSIENT RESPONSE LINE-TRANSIENT RESPONSE SHUTDOWN RESPONSE AND INDUCTOR CURRENT A /43 TOC1 A /43 TOC11 A /43 TOC12 B B B C 4µs/div = 3.3, = 1.2 A:, 2m/div, 3.3 DC OFFSET B: LOAD, 2mA to 2mA, 1mA/div 4µs/div = 3.3, LOAD = 15mA A:, 5m/div, 3.3 DC OFFSET B:, 1 to 1.5, 5m/div 1ms/div = 3.3, = 1.2, I = 5mA A:, 1/div B: INDUCTOR CURRENT, 2mA/div C: SHDN, 2/div 5
6 Pin Description PIN MAX NAME LO PFO SHDN Open-Drain Power-Fail Output. Sinks current when drops below 614m. Active-Low Shutdown Input. Connect to for normal operation. Feedback Input for adjustable-output operation. Connect to an external resistor voltage divider between and. Connect to for fixed-output operation. Ground FUNCTION IC Battery-Power Input. Sense input for LO comparator (MAX1643 only). Power-Fail Input. When the voltage on drops below 614m, PFO sinks current. Open-Drain Battery-Low Output. When the voltage at drops below 1, LO sinks current. N-Channel MOSFET Switch Drain and P-Channel Synchronous-Rectifier Drain 8 8 Power Output. Feedback input for fixed 3.3 operation and IC power input. Connect filter capacitor close to. Detailed Description The each consist of an internal 1Ω, N-channel MOSFET power switch, a built-in synchronous rectifier that acts as the catch diode, an oscillator, a reference, and PFM control circuitry (Figure 1). These devices are optimized for applications with power-management features that operate from one alkaline cell, such as pagers, remote controls, and battery-powered instruments. They are designed to meet the specific demands of the operating states characteristic of such systems: 1) Primary battery is good and the load is active: In this state, the system draws tens of milliamperes, and the typically offer 8% efficiency. 2) Primary battery is good and the load is sleeping: In this state, the load is drawing hundreds of microamperes, and the DC-DC converter IC draws very low quiescent current. In many applications, the load is expected to be in this state most of the time. Operating Principle The employ a proprietary pulsefrequency-modulation (PFM) control scheme that combines the ultra-low quiescent current traditional of pulse-skipping PFM converters with the high-load efficiency of pulse-width-modulation (PWM) converters. The on-time and minimum off-times are varied as a function of the input and output voltages: K t ON = 1.2 x K t OFF(MIN) = - where K is typically 25-µs. This enables the to maintain high efficiency over a wide range of loads and input/output voltages. The DC- DC converter is powered from the pin. 6
7 When the error comparator detects that the output voltage is too low, it turns on the internal N-channel MOSFET switch until the on-time is satisfied (see Figure 1 and the Standard Application Circuits, Figures 2 and 3). During the on-time, current ramps up in the inductor, storing energy in a magnetic field. When the MOS- FET turns off, during the second half of each cycle, the magnetic field collapses, causing the inductor voltage to force current through the synchronous rectifier, transferring the stored energy to the output filter capacitor and load. The output filter capacitor stores charge while current from the inductor is high, then holds up the output voltage until the second half of the next switching cycle, smoothing power flow to the load. Bootstrap DC-DC Block The bootstrap block contains a low-voltage start-up oscillator. This oscillator pumps up the output voltage to approximately 1.7, where the main DC-DC converter can operate. The oscillator is powered from the input and drives an NPN switch. During start-up, the P-channel synchronous rectifier remains off and either its body diode or an external diode is used as an output rectifier. Reduce the load as needed to allow start-up with input voltages below 2 (see Typical Operating Characteristics). Shutdown () Pulling SHDN low places the in shutdown mode (I SHDN = 2 typical). In shutdown, the internal switching MOSFET turns off, PFO goes highimpedance, and the synchronous rectifier turns off to prevent reverse current from flowing from the output back to the input. However, there is still a forward current path through the synchronous-rectifier body diode from the input to the output. Thus, in shutdown, the output remains one diode drop below the battery voltage ( ). To disable the shutdown feature, connect SHDN (a logic input) to..5ref TON TIMING TOFF EN LOGIC PDR NDR P PFO REF N RFRDY REF REF.5REF START-UP OSCILLATOR SHDN 1.7 Figure 1. Functional Diagram 7
8 LO (MAX1643) The MAX1643 contains an on-chip comparator for lowbattery detection. If the voltage at drops below 1, LO sinks current. LO is an open-drain output. In combination with /PFO, this allows monitoring of both the input and output voltages. Reverse-Battery Protection The can sustain/survive single-cell battery reversal up to the package power-dissipation limit. An internal 5Ω resistor in series with a diode limits reverse current to less than 22mA, which prevents damage to the. Prolonged operation above 22mA reverse-battery current can degrade the devices performance. Design Information Output oltage Selection The operate with a 3.3 ±4% or adjustable output. To select fixed-voltage operation, connect to. For an adjustable output between 2 and 5.2, connect to a resistor voltage divider between and (Figure 4). regulates to Since leakage is 1nA max, select feedback resistor R2 in the 1kΩ to 1MΩ range. R1 is given by: R1 = R2 REF where REF = Power-Fail Detection The have an on-chip comparator for power-fail detection. This comparator can detect loss of power at the input or output. If the voltage at falls below 614m, the PFO output sinks current to. Hysteresis at the power-fail input is 1%. The power-fail monitor s threshold is set by two resistors: R3 and R4 (Figure 5). Set the threshold using the following equation: R3 = R4 TH where TH is the desired threshold of the power-fail detector, and is the 614m reference of the powerfail comparator. Since leakage is 1nA max, select feedback resistor R4 in the 1kΩ to 1MΩ range. Low-Battery Start-Up The are bootstrapped circuits with a low-voltage start-up oscillator. They can start under low-load conditions at lower battery voltages than at full load. Once started, the output can maintain the load as.88 to 1.65 INPUT 22µF.1µF PF 1µH, 35mA SHDN the battery voltage decreases below the start-up voltage (see Typical Operating Characteristics). Inductor Selection A 1µH inductor is recommended for most applications. The use of lower inductor values (down to 68µH) increases maximum output current. Higher values (up to 22µH) reduce peak inductor current and consequent ripple and noise. The inductor s saturationcurrent rating must exceed the peak current limit synthesized by the s timing algorithms: I = K MAX PEAK LMIN where K MAX = 35-µs. The maximum recommended I PEAK is 35mA. For best efficiency, inductor series resistance should be less than 1Ω..1µF Figure Standard Application Circuit.88 to 1.65 INPUT 22µF.1µF 1µH, 35mA LO MAX1643 PFO.1µF Figure 3. MAX Standard Application Circuit µF 22µF 3.3 8
9 Capacitor Selection Choose input and output capacitors to service input and output peak currents with acceptable voltage ripple. A 22µF, 6, low-esr, surface-mount tantalum output filter capacitor typically provides 6m output ripple when stepping up from 1.3 to 3.3 at 2mA. The input filter capacitor (C IN ) also reduces peak currents drawn from the battery and improves efficiency. Low equivalent series resistance (ESR) capacitors are recommended. Capacitor ESR is a major contributor to output ripple (usually more than 6%). Ceramic capacitors have the lowest ESR, but low-esr tantalums represent a good balance between cost and performance. Low-ESR aluminum electrolytic capacitors are tolerable, and standard aluminum electrolytic capacitors should be avoided. Do not exceed tantalum capacitors ripplecurrent ratings; select capacitors with a rating exceeding the peak inductor current (I PEAK ). PC Board Layout and Grounding High switching frequencies and large peak currents make PC board layout an important part of design. Poor design can result in excessive EMI on the feedback paths and voltage gradients in the ground plane. Both of these factors can result in instability or regulation errors. The pin must be bypassed directly to as close to the IC as possible (within.2 in. or 5mm). Place power components such as the / MAX1643, inductor, input filter capacitor, and output filter capacitor as close together as possible. Keep their traces short, direct, and wide ( 5 mil or 1.25mm), and place their ground pins close together in a star-ground configuration. Keep the extra copper on the board and integrate it into ground as a pseudo-ground plane. On multilayer boards, route the star ground using component-side copper fill, then connect it to the internal ground plane using vias. Place the external voltage-feedback network very close to the pin (within.2 in. or 5mm). Noisy traces, such as from the pin, should be kept away from the voltagefeedback network and separated from it using grounded copper. The evaluation kit manual shows an example PC board layout, routing, and pseudo-ground plane. Noise and oltage Ripple EMI and output voltage ripple can be minimized by following a few simple design rules. 1) Place the DC-DC converter and digital circuitry on an opposite corner of the PC board, away from sensitive RF and analog input stages..88 to 1.65 INPUT 22µF.1µF *OPTIONAL COMPENSATION PF SHDN 1µH Figure 4. Adjustable-Output Circuit MAX1643 Figure 5. Power-Fail Detection Circuit 1pF* = 2 TO 5.2 2) Use a closed-core inductor, such as toroid or shielded bobbin, to minimize fringe magnetic fields. 3) Choose the largest inductor value that satisfies the load requirement to minimize peak switching current and resulting ripple and noise. 4) Use low-esr input and output filter capacitors. 5) Follow sound circuit-board layout and grounding rules (see the PC Board Layout and Grounding section). 6) Where necessary, add LC pi filters, linear post-regulators such as the MAX8863 and MAX8864 (SOT23 package), or shielding. The LC pi filter s cutoff frequency should be at least a decade or two below the DC-DC converter s switching frequency for the specified load and input voltage. TH R3 R4 R1 R2 9
10 Table 1. Component Suppliers SUPPLIER PHONE FAX AX USA (83) (83) (8) Coilcraft USA (847) (847) Coiltronics USA (561) (561) Dale USA (65) (65) Nichicon USA (847) (847) Japan Sanyo USA (619) (619) Japan Sprague USA (63) (63) Sumida USA (847) (847) Japan TDK USA (847) (847) Chip Information TRANSISTOR COUNT: 594 SUBSTRATE CONNECTED TO Table 2. Surface-Mount Inductor Information INDUCTANCE (µh) ENDOR/PART RESISTANCE (Ω) INDUCTOR SPECIFICATION I SAT (ma) 68 Coilcraft DO Sumida CD Coilcraft DO Sumida CD TDK NLC5655T-11K Coilcraft DO Sumida CD TDK NLC5655T-151K Coilcraft DO Sumida CD
11 Package Information 8LUMAXD.EPS 11
12 NOTES 12
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