PIXIS-XO: 400B 1340 x 400 imaging array 20 x 20 µm pixels Direct detection
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- Nelson McDaniel
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1 PIXIS-XO: 400B 1340 x 400 imaging array 20 x 20 µm pixels Direct detection The PIXIS-XO series of fully integrated imaging cameras utilizes back-illuminated (BI) and back-illuminated, deepdepletion (BR) CCDs without AR coating, for direct detection of the widest range of X-rays between ~ 10 ev and 30 kev (AR coated devices are not useful for X-ray energies < 500eV). With a 1340 x 400 imaging array, 20 µm pixels, 100% fill factor, low noise electronics and -90 C thermoelectric cooling with either air or water, this system is ideal for worry-free operation in research and OEM environments. The rotatable conflat flange with high-vacuum-seal design, software selectable gains and readout speeds make these cameras well suited for ultra-high vacuum applications. FEATURES Back-illuminated deep depletion and back-illuminated CCD, with no AR coating 2 Mhz / 16-bit readout 100 khz / 16-bit readout Software selectable gains for each digitization speed 1340 x 400 image area, 20 x 20 µm pixels Ultra low noise electronics Flexible user-selectable binning & readout Kinetics Deep thermoelectric air cooling Deep thermoelectric water cooling Conflat vacuum interface TTL input and output USB 2.0 interface Optional: LightField (for Windows 10/8/7, 64-bit) Or WinView/Spec (for Windows 8/7/XP, 32-bit) PICAM (64-bit) / PVCAM (32-bit) software development kits (SDKs) LabView Scientific Imaging ToolKit (SITK TM ) BENEFITS Provides very low X-ray flux imaging, high sensitivity and high spatial resolution High speed readout for rapid image acquisition; Slow speed readout for high sensitivity with wide dynamic range, high signal-to-noise ratio (SNR) and excellent energy resolution Allows optimization of system performance for lowest noise to highest SNR Spectroscopy format designed for high frame rate imaging Best possible system performance Total flexibility to optimize experiments and SNR Custom readout mode offers microsecond resolution Maintenance-free operation - NO need for a liquid circulator or additional power supply Vibration free operation Industry-standard, high-vacuum compatibility External Trigger input with programmable polarity; TTL output with exposure or readout monitor Seamless, plug-and-play connection to PC notebooks & desktops; Easy OEM integration Flexible software packages for data acquisition, display and analysis with built in math engine; LightField offers intuitive, cutting edge user interface and more. Compatible with Windows 10/8/7 (64-bit), and Linux (contact factory for an update) Universal programming interfaces for easy custom programming. Predefined VIs for easy integration of camera controls into large experiment Applications: X-ray Spectroscopy, EUV Lithography and X-ray Plasma Diagnostics Page 1 of 5
2 SPECIFICATIONS PIXIS-XO: 400B PIXIS-XO: 400BR CCD Image Sensor Dark -75 C (with ambient +20 C) CCD format Deepest cooling temperature, TE air cooling* (with ambient +20 C) Thermostating precision Cooling method 1340 x 400 imaging pixels; 20 x 20 mm pixels; 100% fill factor; 13.3 x 13.3 mm (optically centered) -90 C typical; -75 C guaranteed ±0.05 C Thermoelectric air or liquid cooling (CoolCUBE II required) Full well Single pixel: 100 ke- (typical), 60 ke- (minimum) High Sensitivity node: 250 ke- (typical), 220 ke- (minimum) High Capacity node: 1000 ke- (typical), 750 ke- (minimum) ADC speed/bits System read MHz Vertical shift speed Non-linearity Software selectable gains Data interface I/O signals Operating environment Bakeout temperature Vacuum Compatibility Certification Dimensions / Weight 100 khz/16-bit and 2 MHz/16-bit 3.0 e- rms (typical), 5 e- rms (max) 11 e- rms (typical), 16 e- rms (max) <15 msec/row (programmable) 100 khz 2 MHz 1, 2, 4 e- (high sensitivity); 4, 8, 16 e- (high capacity); available at all speeds USB2.0 (5m interface cable provided); Optional Fiberoptic interface is available for remote operation Two MCX connectors for programmable frame readout, shutter, trigger in +5 C to +30 C non-condensing 70 C (maximum) 10-8 Torr CE Princeton Instruments exclusive; scientific-grade 1; MPP; back-illuminated (BI); no AR coating (B) for sensitivity between ~10 ev to 20 kev e-/p/sec (typical) e-/p/sec (max) Princeton Instruments exclusive; scientific-grade 1; NIMO; back-illuminated deep-depletion (BR); no AR coating for sensitivity between ~10 ev to 30 kev e-/p/sec (typical) e-/p/sec (max) cm (6.53") x cm (4.65") x cm (4.48") (L x W x H) / 2.27 kg (5 lbs) All specifications subject to change * The minimum temperature attainable is dependent on the vacuum condition - temperature can be lowered w/lower vacuum Spectral khz Full Vertical Binning (FVB) 60 2 MHz Full Vertical Binning (FVB) MHz (0.2 mm high) 1300 fps Page 2 of 5
3 Quantum Efficiency Curve QE (%) Photon Energy (ev) * BI basic Process, NoAR BI, enhanced process, NoAR BI DD NoAR BI DD AR Coated 0.50 mm Be/FI_DD 0.50 mm Be/BI_DD * - For reference purpose only Page 3 of 5
4 OUTLINE DRAWING 4.5 Conflat Water cooled Air cooled CCD Array 1340 x 400 CCD Image Area inches (mm) x (26.8 x 8.0) Mask Opening ±.001 inches (±.0254 mm) x ( x 7.899) Page 4 of 5
5 OUTLINE DRAWING 6.0 Conflat Water cooled Air cooled Page 1 of 5 CCD Array CCD Image Area inches (mm) Mask Opening ±.001 inches (±.0254 mm) 1340 x x (26.8 x 8.0) x ( x 7.899) Page 5 of 5
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