Update on GEM chamber and DAQ at INFN

Transcription

1 Update on GEM chamber and DAQ at INFN Contributors: V. Bellini, E. Cisbani, S. Colilli, F. Giuliani, M. Gricia, F. Librizzi, M. Lucentini, F. Noto, P. Musico, R. Perrino, F. Santavenere... INFN / Bari-Lecce, Catania, Genova, Roma-Sanità 1

2 Progress on (since last presentation) Tools for assembling Service Frame (external frame of the chamber) DAQ hardware and software... waiting the readout planes from CERN (days?) 2

3 Tools / Foil Stretcher from v2 to v2.2 Grips replace screws Springs and lock washers added Conical washers added (to allow some some freedom of movement to the clamp) Transparent clamp top Reference pins added to the master plate Catania clean room 3

4 Tools / Foil stretcher details Transparent Top Plastic washer Conical washer Spring Grip Spring on this pins 4

5 Reference Pins on the frames 5

6 Assembling procedure (summary) CERN Pack Storage box Inspection / HV Test Assembling INFN/Catania 6

7 Gluing/Assembling procedure 1) Readout foil glued on honeycomb plate = R 2) GEM0 foil stretched 3) Solder bottom protective resistor 4) Frame0 glued on GEM0 = F0 5) R glued on F0 = R-F0 6) R-F0 removed from stretcher 7) Solder top resistors on GEM0 8) HV test 9) Repeat 2-8 for GEM1, GEM2 and Drift (no resistor) 10) Mylar foil glued on window frame = W 11) W glued on top of the GEM sandwich 12) Closing frame glued on top of W Stretched foils either on the stretcher or supported by the Honeycomb plate 7

8 Service Frame from v1 to v2 Old Eye bold / holding hole Backplane New 2 long bars replaced by 6 identical shorter bars Improve planarity Bars will be glued and screwed GEM modulle 8

9 Service Frame / Detail Eye bold hole Backplane FE Cards Reference pin as small mechanical support 9

10 Readout Electronics / FE v4 Front-end cards: first 25 samples of revision 4 under testing New connector: sligtly different connection scheme (middle spare pins are connected to ground) Old connectors 10

11 Readout Electronics / MPD v4 Design of v4 under finalization Move to HDMI type B only Remove 2 lemo connectors and USB (more space and firmware resources) Add piggy back connector for future extension Trigger sampling at maximum clock speed (240 MHz), time resolution expected at the level of few ns MPD Old version 11

12 (128+12)x25 ns (2x128+7)x20 ns + VME64x spare readout 12

13 Implemented on C++ Run on Linux MPD as independent library One configuration file (text format) Use open source libconfig++ Self consistent output binary raw data DAQ Software Largely rewritten in the past few weeks Bug fixing in progress Main Bus Interface Generic Model Low Level (virtual class) I2C DAQ MPD Wrapper Library High Level Initialize DB Module Structured text file for configuration Based on libconfig++ Analysis software: Based on C++/Root One geometry configuration file (text) Ingest raw data and fill a Root tree for further analysis Trigger ADC Other Configure Discovery Read 13

14 Readout electronics Porting/Test Olympus exp. Issues on MPD FIFO using a Struck master; we were unable to reproduce in Rome and Genova) Fast SBC Motorola (for Atlas micromegas test) Timing issue in ADC configuration (fixed, but not optimized) Improved timing for I2C configuration Noise characterization of the front-end card (under investigation) Addition work, but help fixing/testing the electronics 14

15 Gas Flow / COMSOL MultiPhysics Simulation 2012 Feb 29 / SBS Meeting E. Cisbani COMSOL/Thin-Film Flow Model Maximize uniformity and steady flux Minimize spacer apertures V. De Smet + F. Noto 15

16 Gas / First version Plexiglass custom joints + flex/ribbon pipes O-ring and screws for gas-tight

17 Gas / Current solutions under testing SMC/KR IN or OUT Out 13 mm Glued Out 6 mm In 4 mm 10 mm GEM Permaglas «Side» view In 4 mm Top view No metallic parts Custom and commercial joints Commercial joints are rather large (13 mm!) 17

18 Gas / Current solutions under testing IN or OUT Permaglas RILSAN 4/6 In 6 mm RILSAN 4/6 12 mm GEM In 4 mm «Side» view No metallic parts Joints are custom made by permaglas Pipes are glued in joints Joints are glued on the GEM top frame Commercial joints used out of the chamber active area 18

19 Short term plan As soon as the first readout foils arrive from CERN start assembling procedure (days??) Test first module (July-Sep?); possibility of 1 week test beam at CERN in second half of July If everything goes well with the first module, ask CERN for additional production Electronics Speed test right after software revision using fast Struck optical link master (June) MPD-VME board review at JLab before production (?) Start front-end card mass production as soon as we are satisfied with current version 19