TI Designs: CC256x Bluetooth Reference Design

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1 Miguel Sanchez, ana Myers Lit # TIR Reference esign #XEM-R TI esigns: x luetooth Reference esign n IMPORTNT NOTIE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information.

2 TI esigns: x luetooth Reference esign SLOW_LK_EGE VT_EGE 9 nshutown_v ME 9 V_IN uf.uf REVISION HISTORY dded, R ohm resistor was deleted R when installed connected MLO_OUT to VT_ elete net SLOW_LK_G, connect net SLOW-LK-EGE to pin. RF HI_TS_V SLOW_LK_EXT_V HI_RX_V HI_TX_V SFM---L U_LK_V U_FSYN_V U_IN_V U_OUT_V HI_TX_V HI_RX_V HI_TS_V HI_RTS_V TX_EUG_V EUG HR VT uf VT_MU R U_FSYN_V U_LK_V nshutn_v RF 9 9 SFM---L-- U_OUT_V onfiguration Notes: -EM -OM RF Install Removed RF Install Removed EGE R, U_FSYN_V U_LK_V,, U_OUT_V U_IN_V, LK_REQ_OUT_V 9 SLOW_LK_EGE, HI_TX_V HI_RX_V,, HI_TS_V HI_RTS_V, TX_EUG_V nshutown_v, V_V x9 U_IN_V HI_RTS_V oard Interface T GN lk T GN lk Line Line L pproval esigner RIG OHREN xqfn-em rawn y JOHN MOWELL Size EGE No Rev. Layout JOHN MOWELL ate Wednesday, July, Page of

3 TI esigns: x luetooth Reference esign Level Shifters V_V_LS.uF.uF U V V nshutn_v R nshutown_v SLOW_LK_EXT_V 9 R SLOW_LK_EXT_V R K IR IR IR IR OE GN SNVTRSV, V_V_LS VT VT_EGE VT_MU R R J VT_ R. /W luetooth Power supply (.-.V rail + p IO supply) VT_ VIO.V m F KHS-T U uf.uf OHM.uF MHz VIN IN OUT R GN NR/F L9-V GRN V PWR T V_IN R J V_V onfiguration Notes:.uF U V V HI_TS_V HI_RX_V HI_TX_V HI_RTS_V 9 R K IR IR IR IR OE GN SNVTRSV V_V VOUT R R. EN.V 9 F /W V_V_LS.uF uf KHS-T.uF OHM MHz U.uF V_V_K V V R U_LK_V U_FSYN_V U_IN_V F U_OUT_V 9 KHS-T OHM MHz IR V_V_LS IR R9 R IR IR OE GN SNVTRSV R9 K R R K.uF.uF R R R R HI_TS_V HI_RX_V HI_TX_V HI_RTS_V U_LK_V U_FSYN_V U_IN_V U_OUT_V,,,,,,,, -EM -OM R Removed Install R Install Removed Power / Level Shifter xqfn-em Size EGE No Rev. ate Wednesday, July, Page of

4 TI esigns: x luetooth Reference esign x HI lass. capable luetooth device U RVM FL NT opper ntenna on P N_ N_ N_ N_ N_ N_ N_ N_ N_9 N_ N_ N_ N_ 9 N_9 N_ N_ N_ N_ N_ N_ N_ N_ N_ N_ N_ N_ N_ N_ N_9 N_ N_ N_ T_RF pf T_RF_IN T_RF V V_IO_ V_V, HI_TX_V V_IO_, HI_RX_V HI_TX V_IO_ 9 9 HI_RTS_V, HI_RX V_IO_.uF.uF.uF, HI_TS V_IO_ V_V_K, U_FSYN_V V_IO_, U_LK_V U_FSYN V_IO_.uF, U_IN_V U_LK, U_OUT_V U_IN U_OUT L._LO_IN R MLO_IN.K SLOW_LK_EXT_V OS R SLOW_LK_IN EP MLO_OUT MLO_OUT_ SLOW_LK_INT_V R MLO_OUT_ V OUT 9.uF.uF EN GN MLO_OUT_ SLOW_LK_EGE R MLO_OUT_.KHz pf R nshutown_v, SRM_LO_OUT nshut PP_LO_OUT TX_EUG_V L._LO_OUT LK_REQ_OUT_V TX_G O_LO_OUT LK_REQ_OUT IG_LO_OUT_ Y IG_LO_OUT_ IG_LO_OUT_ G FREFP IG_LO_OUT_ G FREFM IG_LO_OUT_ IG_LO_OUT_ Internal lock HI_TS_V 9 HI_RTS V_IO_ MHz R R pf pf pf K K IG_LO_OUT_ IG_LO_OUT V V.uF.uF.uF VSS_FREF VSS_O VSS_ VSS_ EP VSS_.GHz LFGSG.uF LO VT_ LO RF_NT.uF LO SLO R 9.uF.uF.uF.uF.uF R9 NT UL FEE OXIL TEST PORT G G SHL G G G G G G G G xqfn ate Wednesday, July, Page of XSHL RF SHIEL OVER xqfn-em Size EGE No Rev.

5 IMPORTNT NOTIE FOR TI REFERENE ESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( uyers ) who are developing systems that incorporate TI semiconductor products (also referred to herein as components ). uyer understands and agrees that uyer remains responsible for using its independent analysis, evaluation and judgment in designing uyer s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. uyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LIENSE, EXPRESS OR IMPLIE, Y ESTOPPEL OR OTHERWISE TO NY OTHER TI INTELLETUL PROPERTY RIGHT, N NO LIENSE TO NY THIR PRTY TEHNOLOGY OR INTELLETUL PROPERTY RIGHT, IS GRNTE HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI REFERENE ESIGNS RE PROVIE "S IS". TI MKES NO WRRNTIES OR REPRESENTTIONS WITH REGR TO THE REFERENE ESIGNS OR USE OF THE REFERENE ESIGNS, EXPRESS, IMPLIE OR STTUTORY, INLUING URY OR OMPLETENESS. 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With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in F lass III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. uyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at uyer's risk, and uyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS99 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS99. Mailing ddress: Texas Instruments, Post Office ox, allas, Texas opyright, Texas Instruments Incorporated

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