STPS3M6DJF High efficiency power Schottky diode Datasheet production data Features Very low conduction losses Low forward voltage drop Low thermal resistance K High specified avalanche capability High integration ECOPCK 2 compliant component K K Description The STPS3M6DJF is a power Schottky rectifier, suited for high frequency switch mode power supply and DC to DC converters. Packaged in PowerFLT, this device is intended to be used in notebook, game station and desktop adapters, providing in these applications a good efficiency at both low and high load. Its low profile was especially designed to be used in applications with space-saving constraints. Table 1. PowerFLT 5x6 STPS3M6DJF Device summary Symbol Value I F(V) 3 V RRM 6 V V F (typ).46 V T (max) 15 C TM: PowerFLT is a trademark of STMicroelectronics pril 212 Doc ID 2312 Rev 1 1/8 This is information on a product in full production. www.st.com 8
Characteristics STPS3M6DJF 1 Characteristics Table 2. bsolute ratings (limiting values, anode terminals 1 and 3 short circuited) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 6 V I F(RMS) Forward rms current 45 I F(V) verage forward current δ =.5 T c = 1 C 3 I FSM Surge non repetitive forward current t p = 1 ms sinusoidal 25 P (1) RM Repetitive peak avalanche power 35 W V RM Maximum repetitive peak avalanche voltage t p < 1 µs, T < 15 C I R < 13 8 V T stg Storage temperature range -65 to +175 C T Maximum operating unction temperature (2) 15 C 1. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics application notes N1768 and N225. dptot 1 2. < condition to avoid thermal runaway for a diode on its own heatsink dt Rth(-a) Table 3. Thermal resistance Symbol Parameter Value Unit R th(-c) Junction to case 2. C/W Table 4. Static electrical characteristics (anode terminals short circuited) Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop T = 25 C - - 9 µ V R = V RRM T = 125 C - 2 5 m T = 25 C - -.59 I F = 15 T = 125 C -.46.52 V T = 25 C - -.72 I F = 3 T = 125 C -.57.67 1. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.55 x I F(V) +.4 x I F 2 (RMS) 2/8 Doc ID 2312 Rev 1
STPS3M6DJF Characteristics Figure 1. 3 25 2 15 1 5 P F(V) (W) verage forward power dissipation versus average forward current δ =.1 δ =.5 δ =.2 δ =.5 δ = t / T p δ = 1 5 1 15 2 25 3 35 4 I T F(V) t p () Figure 2. I 35 3 25 2 15 1 F(V) () T verage forward current versus ambient temperature (δ =.5) R th(-a) 5 δ = t p / T t p T amb( C) 25 5 75 1 125 15 = R th(-c) Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus unction temperature 1 P RM(tp) P RM(1 µs) 1.2 P RM(T) P RM(25 C) 1.1.8.6.1.4.1.1.1 1 t (µs) p 1 1 1.2 T ( C) 25 5 75 1 125 15 Figure 5. 28 24 2 I () M Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. 1..9.8.7 Z th(-c) /Rth(-c) Relative variation of thermal impedance unction to case versus pulse duration 16 12 8 T = 25 C c T = 75 C c 4 I M T c = 125 C t δ =.5 t(s) 1.E-3 1.E-2 1.E-1 1.E+.6.5.4.3.2.1. Single pulse t (s) p 1.E-5 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ Doc ID 2312 Rev 1 3/8
Characteristics STPS3M6DJF Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 1.E+3 1.E+2 1.E+1 I (m) R T = 15 C T = 125 C C(pF) 1 F = 1 MHz V osc = 3 mv T = 25 C RMS 1.E+ T = 1 C 1 1.E-1 T = 75 C T = 5 C 1.E-2 T = 25 C V R(V) 1.E-3 5 1 15 2 25 3 35 4 45 5 55 6 V R(V) 1 1 1 1 Figure 9. I FM() 1. Forward voltage drop versus forward current T = 125 C (Maximum values) Figure 1. R th(-a) ( C/W) 25 2 Thermal resistance unction to ambient versus copper surface under tab epoxy printed board FR4, copper thickness = 35 µm 1. T = 125 C (Typical values) 15 1. T = 25 C (Maximum values) 1 5 V FM(V).1..1.2.3.4.5.6.7.8.9 1. 1 2 3 4 5 6 7 8 9 1 S cu (cm²) Figure 11. Reverse safe operating area (t p < 1 µs and T < 15 C) 2 I arm () 15 1 5 V arm 6 65 7 75 8 85 9 95 1 15 11 4/8 Doc ID 2312 Rev 1
STPS3M6DJF Package information 2 Package information Epoxy meets UL94,V Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPCK packages, depending on their level of environmental compliance. ECOPCK specifications, grade definitions and product status are available at: www.st.com. ECOPCK is an ST trademark. Table 5. PowerFLT 5x6 dimensions Dimensions Ref. Millimeters Inches D2 Min. Typ. Max. Min. Typ. Max. E2.8 1..31.39 1 e D b L K 2 1.2.5.1.2 2.25.1 b.3.5.12.2 D 5.2.25 D2 4.11 4.31.162.17 e 1.27.5 E E 6.15.242 E2 3.5 3.7.138.146 L.5.8.2.31 K 1.275 1.575.5.62 Figure 12. Footprint (dimensions in mm) 5.35 4.41 3.86 4.33 6.29.98.95 1.27.62 Doc ID 2312 Rev 1 5/8
Package information STPS3M6DJF Figure 13. Tape and reel specifications Dot identifying Pin 1 location 2. 4. Ø 1.55.3 1.75.2 Ø 1.5 5.3 12. 5.5 R.5 6.3 1.2 8. ll dimensions are typical values in mm User direction of unreeling 6/8 Doc ID 2312 Rev 1
STPS3M6DJF Ordering information 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3M6DJF-TR PS3 M6 PowerFLT 5x6 95 mg 3 Tape and reel 4 Revision history Table 7. Document revision history Date Revision Changes 18-pr-212 1 First issue. Doc ID 2312 Rev 1 7/8
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