Features. Description. Table 1. Device summary. Order code Marking Package Packaging. STB100N6F7 100N6F7 D²PAK Tape and Reel

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Transcription:

N-channel 60 V, 4.7 mω typ.,100 A STripFET F7 Power MOSFET in a D²PAK package Features Datasheet - production data Order code V DS R DS(on) max. I D P TOT STB100N6F7 60 V 5.6 mω 100A 125 W Among the lowest R DS(on) on the market Excellent figure of merit (FoM) Low C rss /C iss ratio for EMI immunity High avalanche ruggedness Applications Switching applications Figure 1. Internal schematic diagram Description This N-channel Power MOSFET utilizes STripFET F7 technology with an enhanced trench gate structure that results in very low onstate resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. Table 1. Device summary Order code Marking Package Packaging STB100N6F7 100N6F7 D²PAK Tape and Reel December 2015 DocID027210 Rev 3 1/15 This is information on a product in full production. www.st.com

Contents STB100N6F7 Contents 1 Electrical ratings............................................ 3 2 Electrical characteristics..................................... 4 2.1 Electrical characteristics (curves)................................ 6 3 Test circuits.............................................. 8 4 Package information......................................... 9 5 Packing information........................................ 12 6 Revision history........................................... 14 2/15 DocID027210 Rev 3

Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V DS Drain-source voltage 60 V V GS Gate-source voltage ± 20 V I D Drain current (continuous) at T C = 25 C 100 A I D Drain current (continuous) at T C = 100 C 75 A (1) I DM Drain current (pulsed) 400 A P TOT Total dissipation at T C = 25 C 125 W E (2) AS Single pulse avalanche energy 200 mj T j Operating junction temperature T stg Storage temperature - 55 to 175 C 1. Pulse width is limited by safe operating area 2. Starting Tj =25 C, I D = 20 A, V DD = 30 V Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case 1.2 C/W R (1) thj-pcb thermal resistance junction-pcb 35 C/W 1. When mounted on FR-4 board of 1inch², 2oz Cu DocID027210 Rev 3 3/15 15

Electrical characteristics STB100N6F7 2 Electrical characteristics (T CASE = 25 C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS Drain-source breakdown voltage Zero gate voltage Drain current V GS = 0 V, I D = 1 ma 60 V V GS = 0 V, V DS = 60 V 1 µa V GS = 0 V, V DS = 60 V, T J = 125 C 100 µa I GSS Gate-source leakage current V DS = 0 V, V GS = 20 V 100 na V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa 2 4 V R DS(on) Static drain-source on-resistance V GS =10 V, I D = 50 A 4.7 5.6 mω Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 1980 - pf C oss Output capacitance V GS = 0 V, V DS = 25V, - 970 - pf C rss f = 1 MHz Reverse transfer capacitance - 86 - pf Q g Total gate charge - 30 - nc Q gs Gate-source charge V DD = 30 V, I D = 100 A, V GS = 10 V - 12.6 - nc Q gd Gate-drain charge - 5.9 - nc Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time - 21.6 - ns t r Rise time V DD = 30 V, I D = 50 A, - 55.5 - ns t d(off) Turn-off-delay time R G =4.7Ω, V GS =10V - 28.6 - ns t f Fall time - 15 - ns 4/15 DocID027210 Rev 3

Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit (1) V SD Forward on voltage V GS = 0 V, I SD = 100A - 1.2 V t rr Reverse recovery time - 48.4 ns Q rr Reverse recovery charge I SD = 100 A, di/dt = 100 A/µs, V DD = 48 V - 47 nc I RRM Reverse recovery current - 2.0 A 1. Pulse test: pulse duration = 300 µs, duty cycle 1.5% DocID027210 Rev 3 5/15 15

Electrical characteristics STB100N6F7 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance Figure 4. Output characteristics Figure 6. Gate charge vs gate-source voltage Figure 5. Transfer characteristics Figure 7. Static drain-source on-resistance 6/15 DocID027210 Rev 3

Electrical characteristics Figure 8. Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on-resistance vs temperature Figure 11. Source-drain diode forward characteristics Figure 12. Normalized V (BR)DSS vs temperature DocID027210 Rev 3 7/15 15

Test circuits STB100N6F7 3 Test circuits Figure 13. Switching times test circuit for resistive load Figure 14. Gate charge test circuit VDD VGS VD RG RL D.U.T. 2200 μf 3.3 μf VDD Vi=20V=VGMAX 2200 μf 12V IG=CONST 2.7kΩ 47kΩ 100Ω 100nF D.U.T. 1kΩ VG PW 47kΩ PW 1kΩ AM01468v1 AM01469v1 Figure 15. Test circuit for inductive load switching and diode recovery times Figure 16. Unclamped inductive load test circuit G 25 Ω D S A D.U.T. B A FAST DIODE B A B D L=100μH 3.3 1000 μf μf VDD VD ID L 2200 μf 3.3 μf VDD G RG S Vi D.U.T. AM01470v1 Pw AM01471v1 Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform V(BR)DSS ton toff VD tdon tr tdoff tf ID IDM 0 90% 10% VDS 10% 90% VDD VDD VGS 90% AM01472v1 0 10% AM01473v1 8/15 DocID027210 Rev 3

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 19. D²PAK (TO-263) package outline DocID027210 Rev 3 9/15 15

Package information STB100N6F7 Table 8. D²PAK (TO-263) package mechanical data Dim. mm Min. Typ. Max. A 4.40 4.60 A1 0.03 0.23 b 0.70 0.93 b2 1.14 1.70 c 0.45 0.60 c2 1.23 1.36 D 8.95 9.35 D1 7.50 7.75 8.00 D2 1.10 1.30 1.50 E 10 10.40 E1 8.50 8.70 8.90 E2 6.85 7.05 7.25 e 2.54 e1 4.88 5.28 H 15 15.85 J1 2.49 2.69 L 2.29 2.79 L1 1.27 1.40 L2 1.30 1.75 R 0.4 V2 0 8 10/15 DocID027210 Rev 3

Package information Figure 20. D²PAK footprint (a) a. All dimension are in millimeters DocID027210 Rev 3 11/15 15

Packing information STB100N6F7 5 Packing information Figure 21. Tape 12/15 DocID027210 Rev 3

Packing information Figure 22. Reel Table 9. D²PAK (TO-263) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 10.5 10.7 A 330 B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 13.2 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 26.4 F 11.4 11.6 N 100 K0 4.8 5.0 T 30.4 P0 3.9 4.1 P1 11.9 12.1 Base qty 1000 P2 1.9 2.1 Bulk qty 1000 R 50 T 0.25 0.35 W 23.7 24.3 DocID027210 Rev 3 13/15 15

Revision history STB100N6F7 6 Revision history Table 10. Document revision history Date Revision Changes 26-Nov-2014 1 First release. 14-Jan-2015 2 15-Dec-2015 3 Text amendments throughout document On cover page: Changed title description Changed features and descriptions Updated Table 2: Absolute maximum ratings Updated Table 4: On/off states Updated Table 5: Dynamic Updated Table 6: Switching times Updated Table 7: Source drain diode Added Section 2.1: Electrical characteristics (curves) Updated Section 4: Package mechanical data Updated Table 3: Thermal data. Minor text changes. 14/15 DocID027210 Rev 3

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved DocID027210 Rev 3 15/15 15