BFG235. NPN Silicon RF Transistor*

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Transcription:

NPN Silicon RF Transistor* For low-distortion broadband output amplifier stages in antenna and telecommunication systems up to GHz at collector currents from 0 ma to 50 ma 4 3 Power amplifiers for DECT and PCN systems Integrated emitter ballast resistor f T = 5.5 GHz * Short term description ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Marking Pin Configuration Package BFG35 BFG35 = E = B 3 = E 4 = C - - SOT3 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage V CEO 5 V Collector-emitter voltage V CES 5 Collector-base voltage V CBO 5 Emitter-base voltage V EBO Collector current I C 300 ma Base current I B 40 Total power dissipation ) P tot W T S 80 C Junction temperature T j 50 C Ambient temperature T A -65... 50 Storage temperature T stg -65... 50 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point ) R thjs 35 K/W T S is measured on the collector lead at the soldering point to the pcb For calculation of RthJA please refer to Application Note Thermal Resistance 005--

Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage V (BR)CEO 5 - - V I C = ma, I B = 0 Collector-emitter cutoff current I CES - - 00 µa V CE = 5 V, V BE = 0 Collector-base cutoff current I CBO - - 0 na V CB = V, I E = 0 Emitter-base cutoff current I EBO - - µa V EB = V, I C = 0 DC current gain- I C = 00 ma, V CE = 8 V, pulse measured h FE 75 0 60-005--

Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit AC Characteristics (verified by random sampling) Transition frequency I C = 00 ma, V CE = 8 V, f = 00 MHz Collector-base capacitance V CB = V, f = MHz, V BE = 0, emitter grounded Collector emitter capacitance V CE = V, f = MHz, V BE = 0, base grounded Emitter-base capacitance V EB = 0.5 V, f = MHz, V CB = 0, collector grounded Noise figure I C = 60 ma, V CE = 8 V, Z S = Z Sopt, f = 900 MHz Power gain, maximum available ) I C = 00 ma, V CE = 8 V, Z S = Z Sopt, Z L = Z Lopt, f = 900 MHz min. typ. max. f T 4 5.5 - GHz C cb -. 3 pf C ce -.5 - C eb - 4 - F -.7 - db G ma -.5 - Transducer gain I C = 00 ma, V CE = 8 V, Z S = Z L = 50Ω, f = 900 MHz Third order intercept point at output V CE = 8 V, I C = 00 ma, f = 900 MHz, Z S = Z L = 50Ω S e - 6.5 - db IP 3-33 - dbm G ma = S /S (k-(k -) / ) 005-- 3

Total power dissipation P tot = ƒ(t S ) Permissible Pulse Load R thjs = ƒ(t p ) 00 mw 800 K/W Ptot 600 400 00 RthJS 00 800 600 400 00 0 0.5 0. 0. 0.05 0.0 0.0 0.005 D = 0 0 0 0 40 60 80 0 0 C 50 T S - -7-6 -5-4 -3 - s 0 t p Permissible Pulse Load P totmax /P totdc = ƒ(t p ) Ptotmax/PtotDC - D = 0 0.005 0.0 0.0 0.05 0. 0. 0.5 0-7 -6-5 -4-3 - s 0 t p 005-- 4

Package SOT3 BFG35 Package Outline A 6.5 ±0. 3 ±0. 0. MAX..6 ±0. 4 7 ±0.3 5 MAX. 3.5 ±0. B 3 0.7 ±0. 4.6.3 0.5 MIN. 0.8 ±0.04 Foot Print 0.5 M A 3.5 0.5 M B.4 4.8.4 Marking Layout.. Manufacturer Date code (Year/Calendarweek) 005, June Type code BCP5-6 Pin Example Packing Reel ø80 mm =.000 Pieces/Reel Reel ø330 mm = 4.000 Pieces/Reel 8 0.3 MAX. 7.55 Pin 6.8.75 005-- 5

Published by Infineon Technologies AG, St.-Martin-Strasse 53, 8669 München Infineon Technologies AG 005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 005--