Silicon Schottky Diode For mixer applications in VHF/UHF range For highspeed switching application Pbfree (RoHS compliant) package BAT17 BAT17 BAT17W BAT175 BAT175W BAT176W BAT177 " ESD (Electrostatic discharge) sensitive device observe handling precaution Type Package Configuration L S (nh) Marking BAT17 BAT17 BAT17W BAT175 BAT175W BAT176W BAT177 SOT23 SOT23 SOT323 SOT23 SOT323 SOT323 SOT13 single series series common cathode common cathode common anode parallel pair 1.8 1.8 1. 1.8 1. 1. 2 53s 5s 5s 55s 55s 56s 57s 1
Maximum Ratings at T A = 25 C unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R V Forward current I F 13 Total power dissipation BAT17 T S 77 C BAT17 T S 61 C BAT175T S 6 C BAT17W 5W 6W T S 92 C BAT177 T S 6 C P tot mw Junction temperature T j C Operating temperature range T op 55... 125 Storage temperature T stg 55... Thermal Resistance Parameter Symbol Value Unit Junction soldering point 1) BAT17 BAT17 BAT177 BAT175 BAT17W BAT175W BAT176W R thjs 1 For calculation of R thja please refer to Application Note Thermal Resistance K/W 9 59 69 39 2
Electrical Characteristics at T A = 25 C unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I (BR) = µa V (BR) V Reverse current V R = 3 V V R = V V R = 3 V T A = 6 C Forward voltage I F =.1 I F = 1 I F = Forward voltage matching 1) I F = 1 I R V F µa.25 1.25 mv 2 275 35 25 3 5 35 25 6 V F 2 AC Characteristics Diode capacitance V R = f = 1 MHz Differential forward resistance I F = 5 f = khz C T..55.75 pf R F 8 15 Ω 1 V F is the difference between lowest and highest V F in multiple diode component. 3
Diode capacitance C T = ƒ (V R ) f = 1MHz Forward resistance r f = ƒ (I F ) f = khz.6 3 EHD79 pf r f Ω CT. 2.3 1.2.1.5 1 1.5 2 2.5 3 3.5 V 5 V R 1 1 Ι F 2 Reverse current I R = ƒ(v R ) Forward current I F = ƒ (V F ) T A = Parameter T A = Parameter 2 EHD77 2 EHD76 Ι R µ A Ι F 1 T A = C 1 85 C T A = C 25 C 85 C C 1 2 25 C 1 3. 1. 2. 3. V. V R 2..1.2.3..5 V.6 V F
Forward current I F = ƒ (T S ) BAT17 Forward current I F = ƒ (T S ) BAT17 BAT177 1 1 IF 8 IF 8 6 6 2 2 15 3 5 6 75 9 5 12 C 15 3 5 6 75 9 5 12 C T S T S Forward current I F = ƒ (T S ) BAT175 1 IF 8 6 2 15 3 5 6 75 9 5 12 C T S 5
Package SOT13 BAT17... Package Outline.2 +.1.8.5 2.9 ±.1 1.9 1.7 3 1 2 B +.1..5.25 M B 2. ±.15.15 MIN. MAX....8.2 M A 1±.1.1 MAX. MAX..8...15 1.3 ±.1 A Foot Print.8 1.2.8 1.2.8.8.9 1.1.9 Marking Layout (Example) RF s 56 Manufacturer 25 June Date code (YM) BFP181 Type code Standard Packing Reel ø18 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel.2 2.6 8 3.15 1.15 6
Package SOT23 BAT17... Package Outline +.1 1)..5 2.9 ±.1 1.9 3 1 2 B C.95 2. ±.15.15 MIN. MAX. 1±.1.1 MAX....8 MAX..8...15 1.3 ±.1 A.25 M BC.2 M A Foot Print 1) Lead width can be.6 max. in dambar area.8.8 1.2.9 1.3.9 Marking Layout (Example) EH s Manufacturer 25 June Date code (YM) BCW66 Type code Standard Packing Reel ø18 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel.9.2 8 2.13 2.65 3.15 1.15 7
Package SOT323 BAT17... Package Outline 2 ±.2.3 +.1.5 3 3x.1 M.1 MAX..1.9 ±.1 A 1 2.65.65 2.1±.1.1 MIN..15 +.1.5 1.25 ±.1.2 M A Foot Print.6 Marking Layout (Example) Standard Packing Reel ø18 mm = 3. Pieces/Reel Reel ø33 mm =. Pieces/Reel.2 2.3 8.8 1.6.65.65 Manufacturer 25 June Date code (YM) BCR8W Type code 2.15 1.1 8
Edition 291116 Published by Infineon Technologies AG 81726 Munich Germany 29 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein any typical values stated herein and/or any information regarding the application of the device Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology delivery terms and conditions and prices please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in lifesupport devices or systems only with the express written approval of Infineon Technologies if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail it is reasonable to assume that the health of the user or other persons may be endangered. 9