j STPS33/CT/CG/CR Low drop power Schottky rectifier Main product characteristics I F(AV) 2 x 15 A K V RRM 3 V T j (max) V F (max) 15 C.42 V K Features and benefits Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency Low thermal resistance Avalanche capability specified D 2 PAK STPS33CG K TO-22AB STPS33CT Description Dual Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in TO-22AB, D 2 PAK and I 2 PAK, this device is intended for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. K I 2 PAK STPS33CR October 26 Rev 4 1/9 www.st.com 9
Characteristics STPS33CT/CG/CR 1 Characteristics Table 1. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 3 V I F(RMS) RMS forward current 3 A I F(AV) Average forward current T c = 135 C Per diode 15 δ =.5 Per device 3 A I FSM Surge non repetitive forward current t p = 1 ms sinusoidal 25 A I RRM Peak repetitive reverse current t p = 2 µs square F= 1 khz 1 A I RSM Non repetitive peak reverse current t p = 1 µs square 3 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 25 C 41 W T stg Storage temperature range -65 to + 15 C T j Maximum operating junction temperature (1) 15 C dv/dt Critical rate of rise of reverse voltage (rated V R, T j = 25 C) 1 V/µs 1. dptot --------------- 1 condition to avoid thermal runaway for a diode on its own heatsink dtj Rth ( j a) Table 2. Thermal resistance Symbol Parameter Value Unit R th(j-c) Junction to case TO-22AB - D 2 PAK - I 2 Per diode 1.2 PAK Total.8 R th(c) Coupling.4 C/W Table 3. Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) Reverse leakage current T j = 25 C.23 1. V R = V RRM T j = 125 C 125 18 ma T j = 25 C I F = 15 A.44.49 V F (1) Forward voltage drop T j = 125 C I F = 15 A.36.4 T j = 25 C I F = 3 A.53.58 V T j = 125 C I F = 3 A.49.53 1. Pulse test: tp = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.26 x I F(AV) +.17 I F 2 (RMS) 2/9
STPS33CT/CG/CR Characteristics Figure 1. P(W) 1 9 8 7 6 5 4 3 2 1 Conduction losses versus average current δ =.5 δ =.1 δ =.2 δ =.5 I F(av) 2 4 6 8 1 12 14 16 18 2 (A) δ=tp/t δ = 1 T tp Figure 2. IF(av)(A) 18 16 14 12 1 8 6 4 2 Average forward current versus ambient temperature (δ =.5) Rth (j-a) =5 C/W Rth (j-a)=rth (j-c) Tamb( C) 25 5 75 1 125 15 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P ARM(t p) P ARM(1µs) 1 P ARM(t p) P ARM(25 C) 1.2 1.1.8.6.1.4.1.1.1 1 t p(µs) 1 1 1.2 T j( C) 25 5 75 1 125 15 Figure 5. IM(A) 25 225 2 Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. 1..9.8 Zth(j-c)/Rth(j-c) Relative variation of thermal impedance junction to case versus pulse duration 175 15 125 T C =25 C 1 T C=75 C 75 5 T C =125 C 25 t(s) 1.E-3 1.E-2 1.E-1 1.E+.7 δ =.5.6.5.4 δ =.2.3 δ =.1.2 Single pulse.1. T tp(s) δ=tp/t tp 1.E-3 1.E-2 1.E-1 1.E+ 3/9
Characteristics STPS33CT/CG/CR Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Figure 8. Junction capacitance versus reverse voltage applied (typical values) 1.E+3 IR(mA) C(nF) 1. 1.E+2 T j =15 C T j =125 C F=1MHz V osc=3mv T j =25 C 1.E+1 T j =1 C T j =75 C 1. 1.E+ T j=5 C 1.E-1 T j =25 C 1.E-2 VR(V) 5 1 15 2 25 3.1 VR(V) 1 1 1 Figure 9. 1 IFM(A) T j =125 C (Maximum values) T j =125 C (Typical values) Forward voltage drop versus forward current Figure 1. Rth(j-a)( C/W) 8 7 6 5 Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) D²PAK 1 T j=25 C (Maximum values) 4 3 2 V FM 1..2.4.6.8 1. 1.2 (V) 1 S(cm²) 5 1 15 2 25 3 35 4 4/9
STPS33CT/CG/CR Package information 2 Package information Epoxy meets UL94,V Cooling method: C Recommended torque value:.55 Nm Maximum torque value:.7 Nm Table 4. I 2 PAK dimensions Ref. Millimeters Dimensions Inches Min. Max. Min. Max. A A 4.4 4.6.173.181 E c2 2.4 2.72.94.17 L2 b.61.88.24.35 b1 1.14 1.7.44.67 D c.49.7.19.28 c2 1.23 1.32.48.52 L1 D 8.95 9.35.352.368 L b1 e 2.4 2.7.94.16 e1 4.95 5.15.195.23 E 1 1.4.394.49 e e1 b c L 13 14.512.551 L1 3.5 3.93.138.155 L2 1.27 1.4.5.55 5/9
Package information STPS33CT/CG/CR Table 5. D 2 PAK dimensions Ref Millimeters Dimensions Inches Min. Max. Min. Max. L2 E C2 A A 4.4 4.6.173.181 2.49 2.69.98.16.3.23.1.9 L D B.7.93.27.37 B2 1.14 1.7.45.67 L3 B2 B C R C.45.6.17.24 C2 1.23 1.36.48.54 D 8.95 9.35.352.368 G E 1. 1.4.393.49 G 4.88 5.28.192.28 L 15. 15.85.59.624 M * V2 * FLAT ZONE NO LESS THAN 2mm L2 1.27 1.4.5.55 L3 1.4 1.75.55.69 M 2.4 3.2.94.126 R.4 typ..16 typ. V2 8 8 Figure 11. Footprint (dimensions in millimeters) 16.9 1.3 5.8 1.3 8.9 3.7 6/9
STPS33CT/CG/CR Package information Table 6. TO-22AB dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. A 4.4 4.6.173.181 C 1.23 1.32.48.51 H2 A D 2.4 2.72.94.17 Dia C E.49.7.19.27 L5 L7 F.61.88.24.34 L2 F2 F1 F G1 G L9 L6 L4 D M E F1 1.14 1.7.44.66 F2 1.14 1.7.44.66 G 4.95 5.15.194.22 G1 2.4 2.7.94.16 H2 1 1.4.393.49 L2 16.4 typ..645 typ. L4 13 14.511.551 L5 2.65 2.95.14.116 L6 15.25 15.75.6.62 L7 6.2 6.6.244.259 L9 3.5 3.93.137.154 M 2.6 typ..12 typ. Diam 3.75 3.85.147.151 In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9
Ordering information STPS33CT/CG/CR 3 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS33CT STPS33CT TO-22AB 2.2 g 5 Tube STPS33CG STPS33CG D 2 PAK 1.48 g 5 Tube STPS33CG-TR STPS33CG D 2 PAK 1.48 g 1 Tape and reel STPS33CR STPS33CR I 2 PAK 1.49 g 5 Tube 4 Revision history Date Revision Changes Jul-26 3A Initial release. 16-Oct-26 4 Reformatted to current standards. Corrected dimensions for I 2 PAK in Table 4 8/9
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