Power Schottky rectifier Features High junction temperature capability valanche rated Low leakage current Good trade-off between leakage current and forward voltage drop High frequency operation 1 2 K 2 1 K STPS3H6CFP Description Dual centre tab Schottky rectifier suited for high frequency switch mode power supply. Packaged in, TO-22B, TO-247, I 2 PK, and D 2 PK, this device is intended to be used in notebook and LCD adaptors and desktop SMPS. In these applications the STPS3H6C provides a good margin between the remaining voltages applied on the diode and the voltage capability of the diode. TO-22B STPS3H6CT K 1 K 2 1 K 2 I 2 PK STPS3H6CR 2 1 D 2 PK STPS3H6CG 1 K 2 TO-247 STPS3H6CW Table 1. Symbol Device summary Value I F(V) 2 X 15 V RRM 6 V T j 175 C V F (typ).535 V July 211 Doc ID 12123 Rev 3 1/11 www.st.com 11
Characteristics STPS3H6C 1 Characteristics Table 2. bsolute ratings (limiting values per diode) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 6 V I F(RMS) Forward rms current 3 I F(V) verage forward current, δ =.5 TO-22B T c = 155 C T c = 125 C Per diode 15 Total package 3 Per diode 15 T c = 9 C Total package 3 I FSM Surge non repetitive forward current t p = 1 ms sinusoidal 23 P RM Releative peak avalanche power T j = 25 C t p = 1 µs 1 2 W T stg Storage temperature range -65 to + 175 C T j Maximum operating junction temperature (1) 175 C 1. dptot 1 < dtj Rth(j-a) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal parameters Symbol Parameter Value Unit R th(j-c) R th(c) Junction to case Coupling TO-22B, I 2 PK, D 2 PK, TO-247 Per diode 1.5 Total.8 Per diode 4.7 Total 3.95 TO-22B, I 2 PK, D 2 PK, TO-247.1 3.2 Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop 1. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.45 x I F(V) +.8 x I F 2 (RMS) C/W T j = 25 C 6 µ V R = V RRM T j = 125 C 8 25 m T j = 25 C 55 I F = 7.5 T j = 125 C 435 47 T j = 25 C 66 I F = 15 T j = 125 C 535 57 T j = 25 C 82 I F = 3 T j = 125 C 635 69 mv 2/11 Doc ID 12123 Rev 3
Characteristics Figure 1. Conduction losses versus average forward current Figure 2. verage forward current versus ambient temperature (δ =.5, per diode) 12 1 P F(V) (W) δ=.5 δ=.1 δ=.2 δ=.5 δ=1 I F(V) () 18 16 14 R th(j-a) =R th(j-c) 8 12 6 4 1 8 6 R th(j-a) =15 C/W T 2 I F(V) () δ=tp/t tp 2 4 6 8 1 12 14 16 18 4 2 T amb( C) 25 5 75 1 125 15 175 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature 1 P P RM RM (tp) (1µs) P RM(T) j P RM(25 C) 1.2 1.1.8.6.1.4.1.1.1 1.2 t (µs) T j( C) p 1 1 1 25 5 75 1 125 15 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) 2 18 I () M 2 2 TO-22B,TO-247 D PK, I PK 12 I () M 16 1 14 12 T C =5 C 8 T C =5 C 1 T C =75 C 8 6 T C =125 C 4 IM 2 t δ =.5 t(s) 1.E-3 1.E-2 1.E-1 1.E+ 6 T C =75 C 4 T 2 C =125 C IM t t(s) δ =.5 1.E-3 1.E-2 1.E-1 1.E+ Doc ID 12123 Rev 3 3/11
Characteristics STPS3H6C Figure 7. Relative variation of thermal impedance junction to case versus pulse duration Figure 8. Relative variation of thermal impedance junction to case versus pulse duration 1..9.8.7.6.5.4.3.2 Z th(j-c) /Rth(j-c) 2 2 TO-22B,TO-247 D PK, I PK δ=.5 δ=.2 δ=.1.1 Single pulse t p(s) δ=tp/t tp. 1.E-3 1.E-2 1.E-1 1.E+ T 1..9.8.7.6.5.4.3.2.1. Z th(j-c) /Rth(j-c) δ=.5 δ=.2 δ=.1 Single pulse t (s) p δ=tp/t 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 T tp Figure 9. 1.E+2 1.E+1 I (m) R Reverse leakage current versus reverse voltage applied (typical values, per diode) T j =15 C T j =125 C Figure 1. C(nF) 1. Junction capacitance versus reverse voltage applied (typical values, per diode) F=1MHz V osc =3mV RMS T j =25 C 1.E+ 1.E-1 T j =1 C T j =75 C T j =5 C 1. 1.E-2 1.E-3 T j =25 C V (V) R 5 1 15 2 25 3 35 4 45 5 55 6.1 V (V) R 1 1 1 Figure 11. Forward voltage drop versus forward current (per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab I FM() 1 T J =125 C Maximum values 8 7 R th(j-a) ( C/W) epoxy printed board FR4, copper thickness = 35 µm 2 D PK T J =125 C Typical values T J =25 C Maximum values 6 5 1 4 3 2 V FM(V) 1..1.2.3.4.5.6.7.8.9 1. 1.1 1.2 1.3 1.4 1 S(cm²) 5 1 15 2 25 3 35 4 4/11 Doc ID 12123 Rev 3
Package information 2 Package information Epoxy meets UL94, V Cooling method: by conduction (C) Recommended torque values: and TO-22B.4 to.6 N m TO-247.9 to 1.2 N m In order to meet environmental requirements, ST offers these devices in different grades of ECOPCK packages, depending on their level of environmental compliance. ECOPCK specifications, grade definitions and product status are available at: www.st.com. ECOPCK is an ST trademark. Table 5. dimensions Ref. Millimeters Dimensions Inches H B Min. Max. Min. Max. 4.4 4.6.173.181 B 2.5 2.7.98.16 D 2.5 2.75.98.18 E.45.7.18.27 Dia F.75 1.3.39 L6 F1 1.15 1.7.45.67 L2 L7 F2 1.15 1.7.45.67 L3 G 4.95 5.2.195.25 L4 F1 F2 L5 D G1 2.4 2.7.94.16 H 1 1.4.393.49 L2 16 Typ..63 Typ. G1 F E L3 28.6 3.6 1.126 1.25 L4 9.8 1.6.386.417 G L5 2.9 3.6.114.142 L6 15.9 16.4.626.646 L7 9. 9.3.354.366 Dia. 3. 3.2.118.126 Doc ID 12123 Rev 3 5/11
Package information STPS3H6C Table 6. TO-22B dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. 4.4 4.6.173.181 H2 Dia C C 1.23 1.32.48.51 D 2.4 2.72.94.17 L5 L7 E.49.7.19.27 F.61.88.24.34 L6 F1 1.14 1.7.44.66 L2 F2 F1 L9 D F2 1.14 1.7.44.66 G 4.95 5.15.194.22 G1 2.4 2.7.94.16 L4 H2 1 1.4.393.49 F G1 G M E L2 16.4 typ..645 typ. L4 13 14.511.551 L5 2.65 2.95.14.116 L6 15.25 15.75.6.62 L7 6.2 6.6.244.259 L9 3.5 3.93.137.154 M 2.6 typ..12 typ. Diam. 3.75 3.85.147.151 6/11 Doc ID 12123 Rev 3
Package information Table 7. TO-247 dimensions Dimensions Ref Millimeters Inches Min. Typ. Max. Min. Typ. Max. 4.85 5.15.191.23 V D 2.2 2.6.86.12 E.4.8.15.31 V Dia F 1. 1.4.39.55 F1 3..118 H F2 2..78 F3 2. 2.4.78.94 L5 F4 3. 3.4.118.133 L F1 V2 F(x3) G F2 F3 F4 L2 L4 L1 L3 M D E G 1.9.429 H 15.45 15.75.68.62 L 19.85 2.15.781.793 L1 3.7 4.3.145.169 L2 18.5.728 L3 14.2 14.8.559.582 L4 34.6 1.362 L5 5.5.216 M 2. 3..78.118 V 5 5 V2 6 6 Dia. 3.55 3.65.139.143 Doc ID 12123 Rev 3 7/11
Package information STPS3H6C Table 8. I 2 PK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. 4.4 4.6.173.181 L2 E c2 1 2.4 2.72.94.17 b.61.88.24.35 b1 1.14 1.7.44.67 D c.49.7.19.28 c2 1.23 1.32.48.52 L1 1 D 8.95 9.35.352.368 L b1 e 2.4 2.7.94.16 e1 4.95 5.15.195.23 E 1 1.4.394.49 e e1 b c L 13 14.512.551 L1 3.5 3.93.138.155 L2 1.27 1.4.5.55 8/11 Doc ID 12123 Rev 3
Package information Table 9. D 2 PK dimensions Dimensions Ref. Millimeters Inches Min. Max Min. Max. L2 E C2 4.4 4.6.173.181 1 2.49 2.69.98.16 2.3.23.1.9 L D B.7.93.27.37 B2 1.14 1.7.45.67 L3 B2 B 1 C R C.45.6.17.24 C2 1.23 1.36.48.54 D 8.95 9.35.352.368 G E 1. 1.4.393.49 2 G 4.88 5.28.192.28 M * V2 L 15. 15.85.59.624 L2 1.27 1.4.5.55 * FLT ZONE NO LESS THN 2mm L3 1.4 1.75.55.69 M 2.4 3.2.94.126 R.4 typ..16 typ. V2 8 8 Figure 13. Footprint (dimensions in millimeters) 16.9 1.3 5.8 1.3 8.9 3.7 Doc ID 12123 Rev 3 9/11
Ordering information STPS3H6C 3 Ordering information Table 1. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3H6CT STPS3H6CT TO-22B 2.23 g 5 Tube STPS3H6CR STPS3H6CR I 2 PK 1.49 g 5 Tube STPS3H6CG STPS3H6CG D 2 PK 1.48 g 5 Tube STPS3H6CG-TR STPS3H6CG-TR D 2 PK 1.48 g 1 Tape and reel STPS3H6CW STPS3H6W TO-247 4.46 g 3 Tube STPS3H6CFP STPS3H6CFP 2. g 5 Tube 4 Revision history Table 11. Document revision history Date Revision Changes 27-Feb-26 1 First issue. 31-Mar-27 2 8-Jul-211 3 Updated Table 2. dded package. Updated thermal parameters in Table 2. 1/11 Doc ID 12123 Rev 3
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