STTH1003S. High efficiency rectifier. Description. Features

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High efficiency rectifier Datasheet - production data Description The STTH1003S is an ultrafast recovery power rectifier dedicated to energy recovery in PDP applications. It is especially designed for clamping function in energy recovery block. The compromise between forward voltage drop and recovery time offers optimized performances. Table 1. Device summary Symbol Value Features Ultrafast recovery Low power losses High surge capability Low leakage current High junction temperature ECOPACK 2 compliant component for DPAK on demand I F(AV) 10 A V RRM 300 V t rr (typ) 13 ns T j (max) 175 C V F (typ) 0.9 V November 2016 DocID11604 Rev 6 1/9 This is information on a product in full production. www.st.com

Characteristics STTH1003S 1 Characteristics Table 2. Absolute ratings (limiting values, at 25 C, unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 300 V I F(RMS) Forward rms current 20 A I F(AV) Average forward current = 0.5, square wave T c = 150 C 10 A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal 100 A I RSM Non repetitive peak reverse current t p = 20 µs square 4 A T stg Storage temperature range -65 to +175 C T j Maximum operating junction temperature 175 C Table 3. Thermal resistance Symbol Parameter Package Max. value Unit R th(j-c) Junction to case DPAK 4 C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) Reverse leakage current T j = 25 C - - 10 V R = V RRM T j = 125 C - 10 100 µa V F (2) Forward voltage drop T j = 25 C - - 1.30 I F = 10 A T j = 125 C - 0.90 1.10 V 1. Pulse test: t p = 5 ms, < 2% 2. Pulse test: t p = 380 µs, < 2% To evaluate the conduction losses, use the following equation: 2 P = 0.86 x I F(AV) + 0.024 x I F (RMS)) 2/9 DocID11604 Rev 6

Characteristics Table 5. Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit t rr t fr V FP Reverse recovery time Forward recovery time Peak forward voltage T j = 25 C I F = 0.5 A I rr = 0.25 A I R = 1 A I F = 1 A V R = 30 V di F /dt = -50 A/µs I F = 10 A V FR = 1.1 x V Fmax di F /dt = 100 A/µs I F = 10 A di F /dt = 100 A/µs - 13 17-28 35 ns - - 200 ns - 2.5 3.5 V I RM Reverse recovery current I F = 10 A - 5.7 7.5 A S factor Softness factor T j = 125 C V R = 200 V di F /dt = 200 A/µs - 0.3 - - DocID11604 Rev 6 3/9 9

Characteristics STTH1003S Figure 1. Forward voltage drop versus forward current (maximum values) Figure 2. Peak reverse recovery current versus di F /dt (typical values) 16 14 12 10 8 I RM(A) V R=200V T j=125 C I F = 0.5xIF(AV) I F = IF(AV) I F = 2xIF(AV) 6 4 2 0 di /dt(a/µs) F 0 50 100 150 200 250 300 350 400 450 500 Figure 3. Reverse recovery time versus di F /dt (typical values) Figure 4. Softness factor versus di F /dt (typical values) 100 90 80 70 60 50 40 30 20 10 0 t (ns) rr I F = 0.5xIF(AV) I F = 2xIF(AV) I F = IF(AV) di /dt(a/µs) F V R=200V T j=125 C 0 50 100 150 200 250 300 350 400 450 500 Figure 5. Relative variations of dynamic parameters versus junction temperature (reference: T j = 125 C) Figure 6. Transient peak forward voltage versus di F /dt (typical values) 8 7 6 5 4 3 2 V FP(V) I=I F F(AV) T j=125 C 1 di F/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 4/9 DocID11604 Rev 6

Characteristics Figure 7. Forward recovery time versus di F /dt (typical values) 300 250 t (ns) fr I=I F F(AV) V FR=1.1 x VF max. T j=125 C 200 150 100 50 0 di /dt(a/µs) F 0 50 100 150 200 250 300 350 400 450 500 DocID11604 Rev 6 5/9 9

Package Information STTH1003S 2 Package Information Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information Figure 8. DPAK package outline Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/9 DocID11604 Rev 6

Package Information Table 6. DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2-8 +8-8 8 Figure 9. DPAK footprint dimensions (in mm) DocID11604 Rev 6 7/9 9

Ordering Information STTH1003S 3 Ordering Information Table 7. Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH1003SB-TR STTH1 003S DPAK 0.32 g 2500 Tape and reel 4 Revision history Table 8. Document revision history Date Revision Description of changes 24-Aug-2005 1 First issue. 18-May-2009 2 01-Apr-2014 3 01-Aug-2014 4 Reformatted to current standards. Modified configuration diagram on front page. Updated dimensions F1 and F2 in TO-220FPAB package dimensions. Updated DPAK package information and removed D²PAK and TO-220FPAB package and characteristics. 17-Sep-2014 5 Updated Figure 8 and Figure 9. 14-Nov-2016 6 Updated DPAK package information and reformatted to current standard. 8/9 DocID11604 Rev 6

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID11604 Rev 6 9/9 9