STPS345DJF Power Schottky rectifier Datasheet - production data Description Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Its low profile was especially designed to be used in applications with space-saving constraints. Table 1. Device summary Symbol Value I F(AV) 3 A V RRM T j (max) V F (typ) 45 V 175 C (up to 2 C forward mode only for PowerFLAT 5x6).5 V Features Low forward voltage drop Very small conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche capability specified Thin package: 1 mm ECOPACK 2 compliant component TM: PowerFLAT is a trademark of STMicroelectronics August 215 DocID16758 Rev 4 1/7 This is information on a product in full production. www.st.com
Characteristics STPS345DJF 1 Characteristics Table 2. Absolute ratings (limiting values, at 25 C unless otherwise specified, anode terminals short-circuited) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 45 V I F(RMS) Forward rms current 45 A I F(AV) Average forward current T c = 12 C, δ =.5 3 A I FSM Surge non repetitive forward current t p = 1 ms sinusoidal T c = 25 C 38 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 125 C 9 W T stg Storage temperature range -65 to + 175 C T j Maximum operating junction temperature (1) PowerFLAT 5x6 175 C PowerFLAT 5x6 (DC forward current without a reverse bias, t= 1 hour) dptot 1 1. < condition to avoid thermal runaway for a diode on its own heatsink dtj Rth(j-a) Table 3. Thermal resistance 2 C Symbol Parameter Value Unit R th(j-c) Junction to case 2.5 C/W Table 4. Static electrical characteristics (anode terminals short circuited) Symbol Parameter Test Conditions Min. Typ. Max. Unit I R (1) V F (1) Reverse leakage current Forward voltage drop - - 3 µa VR = V RRM T j = 125 C - 2 8 ma - -.56 IF = 15 A T j = 125 C -.41.46 V - -.64 IF = 3 A T j = 125 C -.5.56 1. Pulse test: t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.43 x I F(AV) +.433 I F 2 (RMS) 2/7 DocID16758 Rev 4
STPS345DJF Characteristics 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current P F(AV) (W) 24 2 16 12 8 4 δ =.5 δ =.1 δ =.2 δ =.5 δ = 1 δ = t / T p I F(AV) (A) 5 1 15 2 25 3 35 4 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 C) T t p 35 3 25 2 15 1 5 1..9.8.7.6.5.4.3 Figure 2. Average forward current versus ambient temperature (δ =.5) I F(AV) (A) δ=tp/t T tp R th(j - a)=r th(j-c) Tamb( C) 25 5 75 1 125 15 175 Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration Z th(j-c) /Rth(j-c).2 Single pulse.1 t(s) p. 1.E-5 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E+2 1.E+1 I (ma) R T j = 15 C T j = 125 C Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1 F = 1 MHz V osc = 3 mv T = 25 C j RMS 1.E+ 1.E-1 1.E-2 T j = 1 C T j = 75 C T j = 5 C 1 V(V) R 1.E-3 5 1 15 2 25 3 35 4 45 V R(V) 1 1 1 1 DocID16758 Rev 4 3/7 7
Characteristics STPS345DJF Figure 7. Forward voltage drop versus forward current I FM(A) 6 55 5 45 4 35 3 25 2 15 1 5 T j = 125 C (Maximum values) T j = 125 C (Typical values) (Maximum values)..1.2.3.4.5.6.7.8 V FM (V) Figure 8. Thermal resistance, junction to ambient, versus copper surface under tab (typical values, epoxy printed board FR4, e CU = 35µm R th(j-a) ( C/W) 175 15 125 1 75 5 25 PowerFLAT 5x6 SCu(cm²) 1 2 3 4 5 6 7 8 9 1 4/7 DocID16758 Rev 4
STPS345DJF Package information 2 Package information Epoxy meets UL94,V Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 5. PowerFLAT 5x6 dimensions Dimensions Ref. Millimeters Inches D2 Min. Typ. Max. Min. Typ. Max. E2 A.8 1..31.39 K A1.2.5.1.2 A A1 e D b L A2 A2.25.1 b.3.5.12.2 D 5.2.25 D2 4.11 4.31.162.17 E e 1.27.5 E 6.15.242 E2 3.5 3.7.138.146 L.5.8.2.31 K 1.275 1.575.5.62 Figure 9. Footprint (dimensions in mm) 5.35 4.41 3.86 4.33 6.29.98.95 1.27.62 DocID16758 Rev 4 5/7 7
Ordering information STPS345DJF Figure 1. Tape and reel specifications Dot identifying Pin A1 location 2. 4. Ø 1.55.3 1.75.2 Ø 1.5 5.3 12. 5.5 R.5 6.3 1.2 8. All dimensions are typical values in mm User direction of unreeling 3 Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode STPS345DJF-TR PS3 45 PowerFLAT 5x6 95 mg 3 Tape and reel 4 Revision history Table 7. Document revision history Date Revision Changes 9-Nov-29 1 First issue. 5-Jul-21 2 Replace Power QFN with PowerFLAT. 2-May-211 3 12-Aug-215 4 Updated package graphics and marking in Table 6. Added Figure 1. Updated cover image and Table 1 on cover page. Updated Table 2 and Section 1.1: Characteristics (curves). 6/7 DocID16758 Rev 4
STPS345DJF IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 215 STMicroelectronics All rights reserved DocID16758 Rev 4 7/7 7