.3W Mono Fully Differential GENERAL DESCRIPTION The SGM4995 is a fully differential audio power amplifier that is designed for portable communication device applications and demanding applications in mobile phones. It is capable of delivering.3w of continuous average power into an 8Ω load with typically % distortion (THD+N) from a 5V battery voltage. It operates from 2.5V to 5.5V power supply. The SGM4995 features a low power consumption shutdown mode. To facilitate this, shutdown may be enabled by logic low. Additionally, the SGM4995 features an internal thermal shutdown protection mechanism. The SGM4995 contains advanced pop/click circuitry, with a minimal amount of external components. All these features make SGM4995 ideal for wireless handsets and other low voltage applications where minimal power consumption is a primary requirement. The SGM4995 is available in Green TDFN-2 2-8L package. It operates over an ambient temperature range of -4 to +85. FEATURES Fully Differential Amplifier Excellent PSRR: Direct Connection to Battery.3W into 8Ω Load from 5V Supply at THD+N = % (TYP) 2.5V to 5.5V Operation Low Shutdown Current Improved Pop/Click Circuitry Support Single-Ended or Differential Input Thermal Overload Protection Circuitry No Output Coupling Capacitors, Bootstrap Capacitors Required External Gain Configuration Capability -4 to +85 Operating Temperature Range Available in Green TDFN-2 2-8L Package APPLICATIONS Portable Systems Wireless Handsets Mobile Phone Handheld Computers PDAs GPS REV. A. 2
PACKAGE/ORDERING INFORMATION.3W Mono Fully Differential MODEL ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM4995 SGM4995YDE8G/TR TDFN-2 2-8L Tape and Reel, 3 4995 ABSOLUTE MAXIMUM RATINGS Supply Voltage.. 6V Input Voltage. -.3V to (V CC) +.3V Storage Temperature Range.... -65 to +5 Junction Temperature....5 Operating Temperature Range.....-4 to +85 Lead Temperature Range (Soldering sec)..26 ESD Susceptibility HBM. 2V MM.. 4V NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact SGMICRO sales office to get the latest datasheet. PIN CONFIGURATION (TOP VIEW) SHDN SGM4995 8 VO- Bypass IN+ 2 3 GND 7 6 GND V CC IN- 4 5 VO+ TDFN-2 2-8L 2
ELECTRICAL CHARACTERISTICS (The following AC specifications apply for 8Ω load, A V = V/V, T A = +25, unless otherwise specified.).3w Mono Fully Differential PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V CC 2.5 5.5 V Shutdown Current I SD V IN = V, V SHDN = GND.2 2 μa Output Offset Voltage Quiescent Power Supply Current V OS I Q V IN = V, V SHDN = V CC = 5.V - 2.5 V IN = V, V SHDN = V CC = 3.3V - 2. V IN = V, V SHDN = V CC = 2.6V 2. V IN = V, I O = A, V SHDN = V CC V CC = 5.V, No Load 4.72 8 V CC = 5.V, 8Ω Load 4.75 8.2 V CC = 3.3V, No Load 3.7 6 V CC = 3.3V, 8Ω Load 3.72 V CC = 2.6V, No Load 2.9 V CC = 2.6V, 8Ω Load 3. Shutdown Voltage Input High V SDIH.2 Shutdown Voltage Input Low V SDIL.4 Output Power (8Ω) P O f = khz, THD+N = % f = khz, THD+N = % V CC = 5.V.3 V CC = 3.6V.65 V CC = 3.V.47 V CC = 2.6V.34 V CC = 5.V.6 V CC = 3.6V.84 V CC = 3.V.58 V CC = 2.6V.42 Total Harmonic Distortion + Noise THD+N P O =.6Wrms, f = khz, V CC = 5.V.42 % () (2) Power Supply Rejection Ratio PSRR f = 27Hz f = khz V CC = 5.V -62 V CC = 3.6V -6 V CC = 3.V -58 V CC = 2.6V -57 V CC = 5.V -73 V CC = 3.6V -7 V CC = 3.V -7 V CC = 2.6V -63 Common Mode Rejection Ratio (2) CMRR f = 27Hz, V CM = 2mV P-P, V CC = 5.V -74 db Wake-Up Time T WU C B = μf V CC = 5.V 5 V CC = 3.6V 42 V CC = 3.V 37 V CC = 2.6V 32 mv ma V W db ms NOTES:. Ω terminated input. 2. PSRR and CMRR are affected by the matching between gain-setting resistor ratios. 3
.3W Mono Fully Differential SGM4995 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted. V CC = 5V BW < 8kHz THD+N vs. Output Power V CC = 3.6V BW < 8kHz THD+N vs. Output Power THD+N (%). THD+N (%)..... V CC = 3V BW < 8kHz THD+N vs. Output Power V CC = 2.6V BW < 8kHz THD+N vs. Output Power THD+N (%). THD+N (%)..... Power Dissipation vs. Output Power.5 Power Dissipation vs. Output Power Power Dissipation (W).8.6.4.2 V CC = 5V f = khz THD+N %.2.4.6.8.2.4 Power Dissipation (W).4.3.2 V CC = 3.6V f = khz THD+N %.2.4.6.8 4
.3W Mono Fully Differential SGM4995 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted..4 Power Dissipation vs. Output Power.3 Power Dissipation vs. Output Power Power Dissipation (W).3.2 V CC = 3V f = khz THD+N %.2.3.4.5.6 Power Dissipation (W).2 V CC = 2.6V f = khz THD+N %.2.3.4.5-2 Power Supply Rejection Ratio vs. Frequency V CC = 5V, Input Ω Terminated 2mV P-P -2 Power Supply Rejection Ratio vs. Frequency V CC = 3V, Input Ω Terminated 2mV P-P PSRR (db) -4-6 PSRR (db) -4-6 -8-8 -. Frequency (khz) -. Frequency (khz) THD+N (%). THD+N vs. Frequency V CC = 5V P O = 6mW No filters.. Frequency (khz) Output Power vs. Supply Voltage 2.5 2 THD+N = %.5 THD+N = %.5 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 5
.3W Mono Fully Differential SGM4995 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted. Dropout Voltage (V).5.4.3.2 Clipping (Dropout) Voltage vs. Supply Voltage Top Bottom 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 6
APPLICATION CIRCUITS R F 2kΩ.3W Mono Fully Differential To Battery C S μf V CC Differential Audio Input C I.39μF V IH C I.39μF To External Power Supply or Control I/O VIL R I 2kΩ kω SHDN C Bypass B μf (Optional) R I 2kΩ VO- IN- IN+ Bias Circuitry VCC /2 _ + + _ VO+ GND R F 2kΩ Figure. Typical Differential Input Application Schematic R F 2kΩ To Battery C S μf V CC V IH Audio Input VIL C I.39μF C I.39μF R I 2kΩ To External Power kω SHDN Supply or Control I/O C B Bypass μf (Optional) R I 2kΩ VO- IN- IN+ Bias Circuitry VCC /2 _ + + _ VO+ GND R F 2kΩ Figure 2. Single-Ended Input Application Schematic NOTE:. A kω resistor must be serially connected to SHDN pin. 7
APPLICATION NOTES.3W Mono Fully Differential PCB Design Recommendations (Thermal Design Considerations) Thermal Land The TDFN-2 2-8L thermal land is a metal (normally copper) region centrally located under the package and on top of the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the bottom of the package (: ratio). For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal performance. The packages used with the "dog bone" lands will be a dual inline configuration (see Figure 3). Top View Figure 3. Dog Bone Thermal Vias Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The number of vias is application specific and is dependent upon electrical requirements and power dissipation. The via diameter should be.2mm to.33mm with oz. copper via barrel plating. It is important to plug the via to avoid any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than the via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal performance may be improved by increasing the number of vias. 8
PACKAGE OUTLINE DIMENSIONS.3W Mono Fully Differential TDFN-2 2-8L D e N8 E L D E TOP VIEW k N4 N b BOTTOM VIEW.2.65 A.6.95 A A2 SIDE VIEW.24.5 RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A.7.8.28.3 A..5..2 A2.23 REF.8 REF D.9 2..75.83 D..3.43.5 E.9 2..75.83 E.5.7.2.28 k.2 MIN.8 MIN b 8.3.7.2 e.5 TYP.2 TYP L.25.45..8 9
TAPE AND REEL INFORMATION.3W Mono Fully Differential REEL DIMENSIONS TAPE DIMENSIONS P2 P W Q Q2 Q Q2 Q Q2 B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P A K Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W A B K P P P2 W Pin Quadrant TDFN-2 2-8L 7 9.5 2.3 2.3. 4. 4. 2. 8. Q
.3W Mono Fully Differential CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option) 368 227 224 8 7 442 4 224 8