SP40 Series.5pF, 5A Discrete TVS Diode RoHS Pb GREEN Description The SP40 components integrate low capacitance steering diodes with one or two avalanche breakdown diodes for unidirectional or bidirectional protection, respectively, to protect against ESD and lightning induced surge events. These devices can safely absorb up to 5A per IEC 6000-4-5 (tp=8/0μs without performance degradation and a minimum ±30kV ESD per IEC 6000-4- International Standard. The low loading capacitance and high surge capability make it ideal for protecting telecommunication ports such as Ethernet and other high speed data interfaces. Pinout Features ESD, IEC 6000-4-, ±30kV contact, ±30kV air Small SOD33 package fits 0805 footprints EFT, IEC 6000-4-4, 40A (5/50ns Moisture Sensitivity Level (MSL- Lightning, IEC 6000-4-5, nd edition 5A (t P =8/0μs Low capacitance of.5pf (@ V R =0V AEC-Q0 Qualified Halogen free, Lead free, and RoHS compliant Low leakage current Unidirectional and Bidirectional configuration Functional Block Diagram Applications 0/00/000 Ethernet Computers and Peripherals T/E/T3/E3 Instrumentation USB./.0 Medical Equipment Power Ports USB 3.0 and 3. Additional Information Unidirectional Bidirectional SP40-0FTG SP40-0FTG-C Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
Absolute Maximum Ratings Symbol Parameter Value Units Peak Current (t p =8/0μs 5 A P Pk Peak Pulse Power (t p =8/0μs 600 W T OP Operating Temperature -40 to 5 C T STOR Storage Temperature -55 to 50 C Note: CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. SP40 Electrical Characteristics (T OP =5ºC Parameter Symbol Test Conditions Min Typ Max Units Breakdown Voltage V BD I R =ua 6.3 V Reverse Standoff Voltage V RWM I R μa 5.0 V Leakage Current I LEAK V R =5.0V 0.5 μa Clamp Voltage V C =0A, t p =8/0µs, Fwd 4.0 V I =A, t PP =8/0µs, Fwd p 9.3 V =4A, t P =8/0μs, Fwd 9.6 V Dynamic Resistance R DYN TLP, t P =00ns, I/O to GND 0.35 Ω ESD Withstand Voltage V ESD IEC 6000-4- (Contact Discharge ±30 kv IEC 6000-4- (Air Discharge ±30 kv Diode Capacitance C D Reverse Bias=0V, f=mhz.5 pf Note:. Parameter is guaranteed by design and/or component characterization.. Transmission Line Pulse (TLP with 00ns width and 00ps rise time. Normalized Capacitance vs. Bias Voltage Non-Repetitive Peak Pulse Power vs. Pulse Time 3.5 0 Normalized Capacitance 3.0.5.0.5.0 0.5 SP40-0FTG SP40-0FTG-C Peak Pulse Power - P pk (kw 0. 0.0 0.0 0.5.0.5.0.5 3.0 3.5 4.0 4.5 5.0 Bias Voltage (V 0.0 0. 0 00 000 Pulse Duration - t p (µs
Positive Transmission Line Pulsing (TLP Plot Negative Transmission Line Pulsing (TLP Plot Clamping Voltage vs. Pulse Waveform 4.0 0.0 0% 00% 90% Clamp Voltage (V C 6.0.0 8.0 4.0 Percent of 80% 70% 60% 50% 40% 30% 0% 0.0 0%.0 5.0 0.0 5.0 0.0 Peak Pulse Current- (A 5.0 0% 0.0 5.0 0.0 5.0 0.0 5.0 30.0 Time (μs
Temperature TVS Diode Arrays (SPA Diodes Soldering Parameters Reflow Condition - Temperature Min (T s(min 50 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max 00 C - Time (min to max (t s 60 80 secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max T S(min t S Preheat t L Ramp-down SP40 Reflow - Temperature (T L (Liquidus 7 C - Temperature (t L 60 50 seconds 5 time to peak temperature Time Peak Temperature (T P 60 +0/-5 C Time within 5 C of actual peak Temperature (t p 0 40 seconds Ramp-down Rate 6 C/second max Time 5 C to peak Temperature (T P 8 minutes Max. Do not exceed 60 C Product Characteristics Lead Plating Lead Material Lead Coplanarity Substrate Material Body Material Flammability Matte Tin Copper Alloy 0.0004 inches (0.0mm Silicon Molded Compound UL Recognized compound meeting flammability rating V-0 Notes :. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI -3.
c 0. D b TVS Diode Arrays (SPA Diodes Part Marking System SP40-0FTG 05 SP40-0FTG-C 5C Part Numbering System TVS Diode Arrays (SPA Diodes Series Number of Channels SP40 0 F T G C Ordering Information T= Tape & Reel Package F: SOD33 Blank= Unidirectional C= Bidirectional G= Green Part Number Package Marking Min. Order Qty. SP40-0FTG SOD33 05 3000 SP40-0FTG-C SOD33 5C 3000 Package Dimensions -SOD33 L E E L L 0.45 A A A Recommended Solder Pad 0.49.79.4.8.77 SOD33 Symbol Millimeters Inches Min Max Min Max A 0.8.4 0.03 0.045 A 0.00 0.0 0.000 0.004 A 0.80.04 0.03 0.04 b 0.5 0.35 0.00 0.04 c 0.08 0.5 0.003 0.006 D.5.45 0.045 0.057 E.60.90 0.063 0.075 E.44.75 0.096 0.08 L 0. 0.45 0.009 0.08 Unit: mm Embossed Carrier Tape & Reel Specification SOD33 Symbol Dimensions (mm A0.46 +/ 0. B0.90 +/ 0. W 8.0 +0.3/ 0.0 D0.50 +0. D 0.45~.5 E.75 +/ 0.0 E F 3.50 +/ 0.0 P0 4.0 +/ 0.0 P 4.0 +/ 0.0 P.0 +/ 0.05 K0.4 +/ 0. T 0.54 +/ 0.0