600 / 50 Molded Package Features Small molded package Low power loss Soft switching with low switching surge and noise High reliability, high ruggedness (RBSO, SCSO etc.) Comprehensive line-up pplications Inverter for Motor drive C and DC Servo drive amplifier Uninterruptible power supply Maximum ratings and characteristics bsolute maximum ratings (Tc=25 C) Item Symbol Collector-Emitter voltage CES Gate-Emitter voltaga GES Collector DC Tc=25 C IC25 current Tc=100 C IC100 1ms Tc=25 C Icp Max. power dissipation (IGBT) PC Max. power dissipation (FWD) PC Operating temperature Tj Storage temperature Tstg Screw torque - Rating 600 ±20 65 50 150 200 130 +150-40 to +150 39.2 to 58.8 Unit W W C C N m Equivalent Circuit Schematic IGBT + FWD C:Collector G:Gate E:Emitter Electrical characteristics (at Tc=25 C unless otherwise specified) Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Turn-on time Turn-off time Switching Time Turn-on time Turn-off time FWD forward on voltage Reverse recovery time Symbol Conditions Unit Min. Typ. Max. ICES 1.0 GE=0, CE=600 m IGES 10 CE=0, GE=±20 µ GE(th) 4.0 5.0 6.0 CE=20, IC=50m CE(sat) 2.4 2.9 GE=15, IC=50 Cies 2500 GE=0 pf Coes 240 CE=25 Cres 130 f=1mhz ton * 0.15 CC=300, IC=50 tr * 0.09 GE=±15 trr2 0.03 RG=33 ohm toff 0.50 0.62 (Half Bridge) tf 0.10 0.17 Inductance Load ton * 0.15 CC=300, IC=50 tr * 0.09 GE=+15 trr2 0.03 RG=8 ohm toff 0.50 0.62 (Half Bridge) tf 0.10 0.17 Inductance Load F 2.0 2.5 IF=50, GE=0 trr 0.06 0.10 IF=50, GE=-10, R=300, di/dt=100/ *Turn-on characteristics include trr2. See a figure in next page. Thermal resistance characteristics Item Symbol Conditions Unit Min. Typ. Max. Thermal resistance Rth(j-c) 0.63 IGBT C/W Rth(j-c) 0.96 FWD C/W
Outline drawings, mm TO-247 Gate Collector Emitter Switching waveform (Inductance load) Mesurement circuit
Collector current vs. Collector-Emitter voltage Collector current vs. Collector-Emitter voltage Tj=125 C Collector Current : IC () Collector Current : IC () Collector-Emitter oltage : CE () Collector-Emitter oltage : CE () Collector-Emitter voltage vs. Gate-Emitter voltage Collector-Emitter voltage vs. Gate-Emitter voltage Tj=125 C Collector-Emitter oltage : CE () Collector-Emitter oltage : CE () Gate-Emitter oltage : GE () vs. Collector current CC=300, RG=8Ω, GE=+15, Tj=125 C Gate-Emitter oltage : GE () vs. Collector current CC=300, RG=33Ω, GE=±15, Tj=125 C
IGBT Module vs. RG CC=300, IC=50, GE=+15, Tj=125 C vs. RG CC=300, IC=50, GE=±15, Tj=125 C Gate resistance : RG (Ω) Gate resistance : RG (Ω) Dynamic input characteristics Capacitance vs. Collector-Emitter voltage Collector-Emitter voltage : CE () Capacitance : Cies, Coes, Cres (nf) Collector-Emitter oltage : CE () Gate charge : Qg (nc) Reverse Biased Safe Operating rea RG=8Ω, +GE =< 20, -GE=15, Tj =< 125 C Gate-Emitter voltage : GE () Forward Bias Safe Operating rea Collector-Emitter voltage : CE () Collector-Emitter voltage : CE ()
IGBT Module Reverse recovery time vs. Forward current R=300, -di/dt=100/ec Reverse recovery current vs. Forward current R=300, -di/dt=100/ec Reverse recovery time : trr [nsec] Reverse recovery current : Irr [] Forward current : IF () Forward current : IF () Forward voltage vs. Forward current Reverse recovery chracteristics vs. -di/dt R=300, IF=50, Tj=125 C Forward Current : IF [] Reverse recovery time : trr [nsec] Reverse recovery current : Irr [] Forward oltage : F () -di/dt [/ec] Transient thermal resistance Thermal resistance : Rth(j-c) [ C/W] Pulse width : PW (sec)