STD12NF06LT4. N-channel 60 V, 70 mω typ., 12 A, StripFET II Power MOSFET in a DPAK package. Datasheet. Features. Applications.

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Transcription:

Datasheet N-channel 60 V, 70 mω typ., 12 A, StripFET II Power MOSFET in a DPAK package Features TAB Order code V DS R DS(on) max. I D DPAK D(2, TAB) 2 1 3 STD12NF06LT4 60 V 90 mω 12 A Exceptional dv/dt capability 100% avalanche tested Low gate charge Applications Switching applications G(1) S(3) AM01475v1_noZen Description This Power MOSFET series has been developed using STMicroelectronics' unique STripFET process, which is specifically designed to minimize input capacitance and gate charge. This renders the device suitable for use as primary switch in advanced high-efficiency isolated DC-DC converters for telecom and computer applications, and applications with low gate charge driving requirements. Product status link STD12NF06LT4 Product summary Order code Marking Package Packing STD12NF06LT4 D12NF06L DPAK Tape and reel DS10434 - Rev 3 - August 2018 For further information contact your local STMicroelectronics sales office. www.st.com

Electrical ratings 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit V DS Drain-source voltage 60 V V GS Gate-source voltage ±16 V I Drain current (continuous) at T case = 25 C 12 D Drain current (continuous) at T case = 100 C 8.5 A I (1) DM Drain current (pulsed) 48 A P TOT Total dissipation at T case = 25 C 30 W dv/dt (2) Peak diode recovery voltage slope 15 V/ns E (3) AS Single pulse avalanche energy 100 mj T stg T J Storage temperature range Operating junction temperature range -55 to 175 C 1. Pulse width is limited by safe operating area. 2. I SD 12 A, di/dt 200 A/μs, V DS 40 V, T J T JMAX 3. Starting T j = 25 C, I D = 6 A, V DD = 30 V Table 2. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case 5 R thj-pcb (1) Thermal resistance junction-pcb 50 C/W 1. When mounted on a 1-inch² FR-4, 2 Oz copper board. DS10434 - Rev 3 page 2/19

Electrical characteristics 2 Electrical characteristics (T case = 25 C unless otherwise specified) Table 3. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS Drain-source breakdown voltage V GS = 0 V, I D = 250 µa 60 V V GS = 0 V, V DS = 60 V 1 I DSS Zero gate voltage drain current V GS = 0 V, V DS = 60 V, T case = 125 C (1) 10 µa I GSS Gate-body leakage current V DS = 0 V, V GS = ±16 V ±100 na V GS(th) Gate threshold voltage V DS = V GS, I D = 250 µa 1 2 V R DS(on) Static drain-source on-resistance V GS = 10 V, I D = 6 A 70 90 V GS = 5 V, I D = 6 A 80 100 mω 1. Defined by design, not subject to production test. Table 4. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 350 C oss Output capacitance V DS = 25 V, f = 1 MHz, V GS = 0 V - 75 pf C rss Reverse transfer capacitance - 30 Q g Total gate charge V DD = 48 V, I D = 12 A, - 7.5 10 Q gs Gate-source charge V GS = 0 to 5 V - 2.5 Q gd Gate-drain charge (see Figure 13. Test circuit for gate charge behavior) - 3.0 nc Table 5. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) t r t d(off) t f Turn-on delay time Rise time Turn-off delay time Fall time V DD = 30 V, I D = 6 A, R G = 4.7 Ω, V GS = 4.5 V (see Figure 12. Test circuit for resistive load switching times and Figure 17. Switching time waveform) - - - - 10 35 20 13 - - - - ns Table 6. Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 12 A I (1) SDM Source-drain current (pulsed) - 48 A DS10434 - Rev 3 page 3/19

Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V (2) SD Forward on voltage V GS = 0 V, I SD = 12 A - 1.5 V t rr Reverse recovery time I SD = 12 A, di/dt = 100 A/µs, - 50 ns Q rr Reverse recovery charge V DD = 16 V, T J = 150 C - 65 nc I RRM Reverse recovery current (see Figure 14. Test circuit for inductive load switching and diode recovery times) - 2.5 A 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%. DS10434 - Rev 3 page 4/19

Electrical characteristics (curves) 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Thermal impedance Tj=175 C Tc=25 C Single Pulse Figure 3. Output characteristics Figure 4. Transfer characteristics Figure 5. Normalized V (BR)DSS vs temperature Figure 6. Static drain-source on-resistance V (BR)DSS ID=250 µa 0.80-100 DS10434 - Rev 3 page 5/19

Electrical characteristics (curves) Figure 7. Gate charge vs gate-source voltage Figure 8. Capacitance variations Figure 9. Normalized gate threshold vs temperature Figure 10. Normalized on-resistance vs temperature V DS = V GS I D = 250 µa V GS =10 V I D = 6 A Figure 11. Source-drain diode forward characteristics DS10434 - Rev 3 page 6/19

Test circuits 3 Test circuits Figure 12. Test circuit for resistive load switching times Figure 13. Test circuit for gate charge behavior VDD VD RL + 2200 μf 3.3 μf VDD VGS 12 V IG= CONST 47 kω 100 Ω 100 nf D.U.T. 1 kω VGS pulse width RG D.U.T. pulse width 2200 μf + 2.7 kω 47 kω VG 1 kω AM01468v1 AM01469v1 Figure 14. Test circuit for inductive load switching and diode recovery times Figure 15. Unclamped inductive load test circuit G 25 Ω A D D.U.T. S B A fast diode B A B G 100 µh 3.3 1000 D µf + µf VDD D.U.T. VD ID L + 2200 µf 3.3 µf VDD + _ RG S Vi pulse width D.U.T. AM01471v1 AM01470v1 Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform V(BR)DSS t on t off VD t d(on) t r t d(off) t f 90% 90% IDM ID 0 10% V DS 10% VDD VDD V GS 90% AM01472v1 0 10% AM01473v1 DS10434 - Rev 3 page 7/19

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS10434 - Rev 3 page 8/19

DPAK (TO-252) type A package information 4.1 DPAK (TO-252) type A package information Figure 18. DPAK (TO-252) type A package outline 0068772_A_25 DS10434 - Rev 3 page 9/19

DPAK (TO-252) type A package information Table 7. DPAK (TO-252) type A mechanical data Dim. mm Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 4.95 5.10 5.25 E 6.40 6.60 E1 4.60 4.70 4.80 e 2.159 2.286 2.413 e1 4.445 4.572 4.699 H 9.35 10.10 L 1.00 1.50 (L1) 2.60 2.80 3.00 L2 0.65 0.80 0.95 L4 0.60 1.00 R 0.20 V2 0 8 DS10434 - Rev 3 page 10/19

DPAK (TO-252) type C package information 4.2 DPAK (TO-252) type C package information Figure 19. DPAK (TO-252) type C package outline 0068772_C_25 DS10434 - Rev 3 page 11/19

DPAK (TO-252) type C package information Table 8. DPAK (TO-252) type C mechanical data Dim. mm Min. Typ. Max. A 2.20 2.30 2.38 A1 0.90 1.01 1.10 A2 0.00 0.10 b 0.72 0.85 b4 5.13 5.33 5.46 c 0.47 0.60 c2 0.47 0.60 D 6.00 6.10 6.20 D1 5.25 E 6.50 6.60 6.70 E1 4.70 e 2.186 2.286 2.386 H 9.80 10.10 10.40 L 1.40 1.50 1.70 L1 2.90 REF L2 0.90 1.25 L3 0.51 BSC L4 0.60 0.80 1.00 L6 1.80 BSC θ1 5 7 9 θ2 5 7 9 V2 0 8 DS10434 - Rev 3 page 12/19

DPAK (TO-252) type E package information 4.3 DPAK (TO-252) type E package information Figure 20. DPAK (TO-252) type E package outline 0068772_type-E_rev.25 DS10434 - Rev 3 page 13/19

DPAK (TO-252) type E package information Table 9. DPAK (TO-252) type E mechanical data Dim. mm Min. Typ. Max. A 2.18 2.39 A2 0.13 b 0.65 0.884 b4 4.95 5.46 c 0.46 0.61 c2 0.46 0.60 D 5.97 6.22 D1 5.21 E 6.35 6.73 E1 4.32 e 2.286 e1 4.572 H 9.94 10.34 L 1.50 1.78 L1 2.74 L2 0.89 1.27 L4 1.02 Figure 21. DPAK (TO-252) recommended footprint (dimensions are in mm) FP_0068772_25 DS10434 - Rev 3 page 14/19

DPAK (TO-252) packing information 4.4 DPAK (TO-252) packing information Figure 22. DPAK (TO-252) tape outline 10 pitches cumulative tolerance on tape +/- 0.2 mm T Top cover tape P0 D P2 E B1 K0 B0 F W For machine ref. only including draft and radii concentric around B0 A0 P1 D1 User direction of feed R User direction of feed Bending radius AM08852v1 DS10434 - Rev 3 page 15/19

DPAK (TO-252) packing information Figure 23. DPAK (TO-252) reel outline T 40mm min. access hole at slot location B D C A N Full radius Tape slot in core for tape start 2.5mm min.width G measured at hub AM06038v1 Table 10. DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 DS10434 - Rev 3 page 16/19

Revision history Table 11. Document revision history Date Version Changes 26-Jun-2014 1 First release. 14-Nov-2014 2 09-Aug-2018 3 Updated title and features in cover page Updated Table 3: Thermal data, Table 4: On/off states and Table 5:Dynamic. Updated Figure 2: Safe operating area,figure 3: Thermal impedance,figure 6: Normalized V(BR)DSS vs. temperature, Figure 10, Figure 11: Normalized on-resistance vs. temperature and Section 4: Package mechanical data. Removed maturity status indication from cover page. The document status is production data. Updated title and features on cover page. Updated Section 4 Package information. Minor text changes DS10434 - Rev 3 page 17/19

Contents Contents 1 Electrical ratings...2 2 Electrical characteristics...3 2.1 Electrical characteristics (curves)... 5 3 Test circuits...7 4 Package information...8 4.1 DPAK (TO-252) type A package information... 8 4.2 DPAK (TO-252) type C package information... 10 4.3 DPAK (TO-252) type E package information... 12 4.4 DPAK (TO-252) packing information... 14 Revision history...17 DS10434 - Rev 3 page 18/19

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2018 STMicroelectronics All rights reserved DS10434 - Rev 3 page 19/19