SGM8621/2/3/4 3MHz, Rail-to-Rail I/O PRODUCT DESCRIPTION The SGM8621 (single), SGM8622 (dual), SGM8623 (single with shutdown) and SGM8624 (quad) are low noise, low voltage, and low power operational amplifiers, that can be designed into a wide range of applications. The SGM8621/2/3/4 have a high gain-bandwidth product of 3MHz and a slew rate of 1.7V/μs. The SGM8623 has a power-down disable feature that reduces the supply current to less than 1μA. The SGM8621/2/3/4 are designed to provide optimal performance in low voltage and low noise systems. They provide rail-to-rail output swing into heavy loads. The input common mode voltage range includes ground, and the maximum input offset voltage is 3mV for SGM8621/2/3/4. They are specified over the extended industrial temperature range (-4 to +125 ). The operating supply range is from 2V to 5.5V. The single version, SGM8621 is available in Green SC7-5, SOT-23-5 and SOIC-8 packages. SGM8623 is available in Green SOT-23-6 and SOIC-8 packages. The dual version SGM8622 is available in Green SOIC-8 and MSOP-8 packages. The quad version SGM8624 is available in Green SOIC-14 and TSSOP-14 packages. FEATURES Rail-to-Rail Input and Output 3mV Maximum V OS High Gain-Bandwidth Product: 3MHz High Slew Rate: 1.7V/μs Settling Time to.1% with 2V Step:.5μs Overload Recovery Time: 2.3μs Low Noise: 17.5nV/ Hz at 1kHz Supply Voltage Range: 2V to 5.5V Input Voltage Range: -.1V to +5.6V with V S = 5.5V Low Supply Current SGM8621/3: 27μA (TYP) SGM8622/4: 21μA/Amplifier (TYP) Less than 1μA Shutdown Current for SGM8623 Small Packaging SGM8621 Available in Green SC7-5, SOT-23-5 and SOIC-8 SGM8622 Available in Green MSOP-8 and SOIC-8 SGM8623 Available in Green SOT-23-6 and SOIC-8 SGM8624 Available in Green TSSOP-14 and SOIC-14 APPLICATIONS Sensors Audio Active Filters A/D Converters Communications Test Equipment Cellular and Cordless Phones Laptops and PDAs Photodiode Amplification Battery-Powered Instrumentation REV. C
SGM8621/2/3/4 PACKAGE/ORDERING INFORMATION 3MHz, Rail-to-Rail I/O MODEL SGM8621 PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKING OPTION SC7-5 -4 to +125 SGM8621XC5/TR 8621 Tape and Reel, 3 SOT-23-5 -4 to +125 SGM8621XN5/TR 8621 Tape and Reel, 3 SGM8622 SOIC-8-4 to +125 SGM8621XS/TR MSOP-8-4 to +125 SGM8622XMS/TR SOIC-8-4 to +125 SGM8622XS/TR SGM8621XS XXXXX SGM8622 XMS XXXXX SGM8622XS XXXXX Tape and Reel, 25 Tape and Reel, 3 Tape and Reel, 25 SGM8623 SGM8624 SOT-23-6 -4 to +125 SGM8623XN6/TR 8623 Tape and Reel, 3 SOIC-8-4 to +125 SGM8623XS/TR SOIC-14-4 to +125 SGM8624XS14/TR TSSOP-14-4 to +125 SGM8624XTS14/TR SGM8623XS XXXXX SGM8624XS14 XXXXX SGM8624 XTS14 XXXXX Tape and Reel, 25 Tape and Reel, 25 Tape and Reel, 3 NOTE: XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Supply Voltage, +V S to -V S... 6V Input Common Mode Voltage Range... (-V S ) -.3V to (+V S ) +.3V Storage Temperature Range... -65 to +15 Junction Temperature... +15 Package Thermal Resistance @ T A = +25 SC7-5, θ JA... 333 /W SOT-23-5, θ JA... 19 /W SOT-23-6, θ JA... 19 /W SOIC-8, θ JA... 125 /W MSOP-8, θ JA... 216 /W Lead Temperature (Soldering 1sec)... +26 ESD Susceptibility HBM (SGM8621/2/4)... 8V HBM (SGM8623)... 4V MM... 4V CDM... 1V RECOMMENDED OPERATING CONDITIONS Operating Temperature Range... -4 to +125 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. 2
SGM8621/2/3/4 PIN CONFIGURATIONS SGM8621 (TOP VIEW) 3MHz, Rail-to-Rail I/O SGM8621/8623 (TOP VIEW) OUT 1 5 +V S NC 1 8 DISABLE (SGM8623 ONLY) -IN 2 7 +V S -V S 2 +IN 3 6 OUT +IN 3 4 -IN -V S 4 NC = NO CONNECT 5 NC SC7-5/SOT-23-5 SOIC-8 SGM8623 (TOP VIEW) SGM8622 (TOP VIEW) OUTA 1 8 +V S OUT 1 6 +V S -INA 2 7 OUTB -V S 2 5 DISABLE 3 6 -INB +IN 3 4 -IN -V S 4 5 +INB SOT-23-6 SOIC-8/MSOP-8 SGM8624 (TOP VIEW) OUTA 1 14 OUTD -INA 2 13 -IND +INA 3 12 +IND +V S 4 11 -V S +INB 5 1 +INC -INB 6 9 -INC OUTB 7 8 OUTC TSSOP-14/SOIC-14 3
SGM8621/2/3/4 ELECTRICAL CHARACTERISTICS (At T A = +25, V S = +5V, V CM = V S /2, R L = 6Ω, unless otherwise noted.) 3MHz, Rail-to-Rail I/O PARAMETER INPUT CHARACTERISTICS CONDITIONS TYP +25 +25 SGM8621/2/3/4 MIN/MAX OVER TEMPERATURE -4 to 85-4 to Input Offset Voltage (V OS ).9 3 3.2 3.4 mv MAX Input Bias Current (I B ) 1 pa TYP Input Offset Current (I OS ) 1 pa TYP Input Common Mode Voltage Range (V CM ) V S = 5.5V -.1 to +5.6 V TYP Common Mode Rejection Ratio (CMRR) Open-Loop Voltage Gain (A OL ) 125 UNITS MIN/ MAX V S = 5.5V, V CM = -.1V to 4V 82 65 64 63 db MIN V S = 5.5V, V CM = -.1V to 5.6V 71 62 61 6 db MIN R L = 6Ω, V O =.15V to 4.85V 9 8 75 68 db MIN R L = 1kΩ, V O =.5V to 4.95V 1 89 85 83 db MIN Input Offset Voltage Drift (ΔV OS /ΔT) 2.7 μv/ TYP OUTPUT CHARACTERISTICS Output Voltage Swing from Rail R L = 6Ω.81 V TYP R L = 1kΩ.7 V TYP Output Current (I OUT ) 52 38 28 24 ma MIN Closed-Loop Output Impedance f = 1kHz, 1.8 Ω TYP POWER-DOWN DISABLE (SGM8623 ONLY) Turn-On Time 1.3 μs TYP Turn-Off Time.3 μs TYP DISABLE Voltage-Off.8 V MAX DISABLE Voltage-On 2 V MIN POWER SUPPLY Operating Voltage Range Power Supply Rejection Ratio (PSRR) Quiescent Current/ Amplifier (I Q ) Supply Current when Disabled (SGM8623 only) DYNAMIC PERFORMANCE 2 2 2 2 V MIN 5.5 5.5 5.5 5.5 V MAX V S = +2V to +5.5V, V CM = (-V S ) +.5V 85 68 66 65 db MIN SGM8622/4 I OUT = 21 3 34 36 μa MAX SGM8621/3 I OUT = 27 37 42 45 μa MAX.47 8 9 1 μa MAX Gain-Bandwidth Product (GBP) 3 MHz TYP Phase Margin (φ O ) 73 TYP Full Power Bandwidth (BW P ) <1% distortion 5 khz TYP Slew Rate (SR) G= 1,2V output step 1.7 V/μs TYP Settling Time to.1% (t S ) G= 1,2V output step.5 μs TYP Overload Recovery Time V IN Gain = V S 2.3 μs TYP NOISE PERFORMANCE Voltage Noise Density (e n ) f = 1kHz 17.5 nv/ Hz TYP 4
3MHz, Rail-to-Rail I/O SGM8621/2/3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. CMRR (db) 12 1 8 6 4 CMRR vs. Frequency PSRR (db) 1 8 6 4 PSRR vs. Frequency PSRR+ PSRR- 2 2.1.1 1 1 1 1 Frequency (khz) 1 1 1 1 Frequency (khz) 15 Channel Separation vs. Frequency 15 Channel Separation vs. Frequency Channel Separation (db) 12 9 6 3 R L = 62Ω T A = +25 Channel B to A Channel A to B.1 1 1 1 1 Frequency (khz) Channel Separation (db) 12 9 6 3 R L = 62Ω T A = +25 Channel B to A Channel A to B.1 1 1 1 1 Frequency (khz) 2.5 Closed-Loop Output Voltage Swing 6 Closed-Loop Output Voltage Swing 2. 5 Output Voltage (V P-P ) 1.5 1..5. V IN = 2V P-P T A = +25 R L = 1kΩ 1 1 1 1 Frequency (khz) Output Voltage (V P-P ) 4 3 2 1 V IN = 4.9V P-P T A = +25 R L = 1kΩ 1 1 1 1 Frequency (khz) 5
3MHz, Rail-to-Rail I/O SGM8621/2/3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Small-Signal Overshoot (%) 6 5 4 3 2 1 Small-Signal Overshoot vs. Load Capacitance R L = 1kΩ T A = +25 Small-Signal Overshoot (%) 6 5 4 3 2 1 Small-Signal Overshoot vs. Load Capacitance R L = 1kΩ T A = +25 1 1 1 1 Load Capacitance (pf) 1 1 1 1 Load Capacitance (pf) 1 8 Output Impedance vs. Frequency 1 8 Output Impedance vs. Frequency Output Impedance (Ω) 6 4 2 Output Impedance (Ω) 6 4 2 1 1 1 1 1 Frequency (khz) 1 1 1 1 1 Frequency (khz) Large-Signal Step Response Large-Signal Step Response Voltage (1V/div) C L = 1pF R L = 62Ω Voltage (1V/div) C L = 1pF R L = 62Ω Time (1μs/div) Time (1μs/div) 6
3MHz, Rail-to-Rail I/O SGM8621/2/3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Small-Signal Step Response Small-Signal Step Response Voltage (5mV/div) C L = 1pF R L = 62Ω Voltage (5mV/div) C L = 1pF R L = 62Ω Time (1μs/div) Time (1μs/div) Positive Overload Recovery Negative Overload Recovery V V IN V OUT V V IN = 5mV R L = 62Ω G = -1 5mV/div 1V/div V IN V V V OUT V IN = 5mV R L = 62Ω G = -1 5mV/div 1V/div Time (2μs/div) Time (2μs/div).3 Supply Current vs. Temperature 75 Shutdown Current vs. Temperature Supply Current (ma).27.24.21.18 V S = 3V Shutdown Current (na) 6 45 3 15 V S = 3V.15-5 -25 25 5 75 1 125 Temperature ( ) -5-25 25 5 75 1 125 Temperature ( ) 7
3MHz, Rail-to-Rail I/O SGM8621/2/3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. 11 V S = 5.5V CMRR vs. Temperature 12 to 5.5V PSRR vs. Temperature 1 11 9 V CM = -.1V to 4V 1 CMRR (db) 8 7 PSRR (db) 9 8 6 V CM = -.1V to 5.6V 7 5-5 -25 25 5 75 1 125 Temperature ( ) 6-5 -25 25 5 75 1 125 Temperature ( ) 12 Open-Loop Voltage Gain vs. Temperature R L = 1kΩ 11 Open-Loop Voltage Gain vs. Temperature R L = 6Ω Open Loop Voltage Gain (db) 11 1 9 8 Open Loop Voltage Gain (db) 1 9 8 7 7-5 -25 25 5 75 1 125 Temperature ( ) 6-5 -25 25 5 75 1 125 Temperature ( ) 5 Output Voltage Swing vs. Output Current Sourcing Current 2 Output Voltage Swing vs. Output Current Sourcing Current Output Voltage (V) 4 3 2 1 +125 +25-4 Output Voltage (V) 1.5 1.5 +125 +25-4 Sinking Current Sinking Current 1 2 3 4 5 6 7 Output Current (ma) 5 1 15 2 25 3 35 Output Current (ma) 8
3MHz, Rail-to-Rail I/O SGM8621/2/3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, V CM = V S /2, R L = 6Ω, unless otherwise noted. Voltage Noise (nv/ Hz) Input Voltage Noise Spectral Density vs. Frequency 1 1 1 Percentage of Amplifiers (%) 4 35 3 25 2 15 1 5 Offset Voltage Production Distribution 258 Samples 1 Production Lot 1 1 1 1 1 Frequency (Hz) -4-3 -2-1 1 2 3 4 Offset Voltage (mv) 9
SGM8621/2/3/4 APPLICATION NOTES Driving Capacitive Loads The SGM8621/2/3/4 can directly drive 1pF in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive driving capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure 1. The isolation resistor R ISO and the load capacitor C L form a zero to increase stability. The bigger the R ISO resistor value, the more stable V OUT will be. Note that this method results in a loss of gain accuracy because R ISO forms a voltage divider with the R LOAD. V IN SGM8621 R ISO C L V OUT Figure 1. Indirectly Driving Heavy Capacitive Load 3MHz, Rail-to-Rail I/O Power-Supply Bypassing and Layout The SGM8621/2/3/4 operate from either a single +2V to +5.5V supply or dual ±1V to ±2.75V supplies. For single-supply operation, bypass the power supply +V S with a.1µf ceramic capacitor which should be placed close to the +V S pin. For dual-supply operation, both the +V S and the -V S supplies should be bypassed to ground with separate.1µf ceramic capacitors. 2.2µF tantalum capacitor can be added for better performance. Good PC board layout techniques optimize performance by decreasing the amount of stray capacitance at the op amp s inputs and output. To decrease stray capacitance, minimize trace lengths and widths by placing external components as close to the device as possible. Use surface-mount components whenever possible. For the operational amplifier, soldering the part to the board directly is strongly recommended. Try to keep the high frequency current loop area small to minimize the EMI (electromagnetic interfacing). An improved circuit is shown in Figure 2. It provides DC accuracy as well as AC stability. R F provides the DC accuracy by connecting the inverting input with the output. C F and R Iso serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier s inverting input, thereby preserving phase margin in the overall feedback loop. C F V n V p +V S 1µF.1µF SGM8621 V OUT V n V p +V S 1µF.1µF SGM8621 1µF V OUT R F SGM8621 R ISO V OUT -V S (GND).1µF V IN C L R L -V S Figure 2. Indirectly Driving Heavy Capacitive Load with DC Accuracy For non-buffer configuration, there are two other ways to increase the phase margin: (a) by increasing the amplifier s closed-loop gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node. Figure 3. Amplifier with Bypass Capacitors Grounding A ground plane layer is important for SGM8621/2/3/4 circuit design. The length of the current path in an inductive ground return will create an unwanted voltage noise. Broad ground plane areas will reduce the parasitic inductance. Input-to-Output Coupling To minimize capacitive coupling, the input and output signal traces should not be in parallel. This helps reduce unwanted positive feedback. 1
SGM8621/2/3/4 TYPICAL APPLICATION CIRCUITS Differential Amplifier The circuit shown in Figure 4 performs the difference function. If the resistor ratios are equal (R 4 /R 3 = R 2 /R 1 ), then V OUT = (V p - V n ) R 2 /R 1 + V REF. V n V p R 1 R 3 R 2 SGM8621 V OUT 3MHz, Rail-to-Rail I/O Low-Pass Active Filter The low-pass filter shown in Figure 6 has a DC gain of (-R 2 /R 1 ) and the -3dB corner frequency is 1/2πR 2 C. Make sure the filter bandwidth is within the bandwidth of the amplifier. The large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistor values as low as possible and consistent with output loading consideration. C V REF R 4 V IN R 1 R 2 Figure 4. Differential Amplifier Instrumentation Amplifier The circuit in Figure 5 performs the same function as that in Figure 4 but with a high input impedance. SGM8621 R 3=R 1//R 2 V OUT SGM8621 R1 R2 Figure 6. Low-Pass Active Filter Vn SGM8621 VOUT Vp SGM8621 R3 R4 VREF Figure 5. Instrumentation Amplifier 11
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SC7-5 D e e1.65 E1 E 1.9 b.75.4 1.3 RECOMMENDED LAND PATTERN (Unit: mm) L L1 A A1 A2 θ.2 c Symbol In Millimeters In Inches MIN MAX MIN MAX A.9 1.1.35.43 A1..1..4 A2.9 1..35.39 b.15.35.6.14 c.8.15.3.6 D 2. 2.2.79.87 E 1.15 1.35.45.53 E1 2.15 2.45.85.96 e.65 TYP.26 TYP e1 1.3 BSC.51 BSC L.525 REF.21 REF L1.26.46.1.18 θ 8 8 TX43.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23-5 D 1.9 e1 E1 E 2.59.99 b e.69.95 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ.2 c In Millimeters In Inches Symbol MIN MAX MIN MAX A 1.5 1.25.41.49 A1..1..4 A2 1.5 1.15.41.45 b.3.5.12.2 c.1.2.4.8 D 2.82 3.2.111.119 E 1.5 1.7.59.67 E1 2.65 2.95.14.116 e.95 BSC.37 BSC e1 1.9 BSC.75 BSC L.3.6.12.24 θ 8 8 TX33.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-8 D e.6 2.2 E1 E 5.2 b 1.27 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 θ c A2 In Millimeters In Inches Symbol MIN MAX MIN MAX A 1.35 1.75.53.69 A1.1.25.4.1 A2 1.35 1.55.53.61 b.33.51.13.2 c.17.25.6.1 D 4.7 5.1.185.2 E 3.8 4..15.157 E1 5.8 6.2.228.244 e 1.27 BSC.5 BSC L.4 1.27.16.5 θ 8 8 TX1.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS MSOP-8 b E1 E 4.8 e 1.2.41.65 RECOMMENDED LAND PATTERN (Unit: mm) D L A A1 A2 c θ Symbol In Millimeters In Inches MIN MAX MIN MAX A.82 1.1.32.43 A1.2.15.1.6 A2.75.95.3.37 b.25.38.1.15 c.9.23.4.9 D 2.9 3.1.114.122 E 2.9 3.1.114.122 E1 4.75 5.5.187.199 e.65 BSC.26 BSC L.4.8.16.31 θ 6 6 TX14.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOT-23-6 D e1 e E1 E 2.59.99 b.69.95 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ.2 c Symbol In Millimeters In Inches MIN MAX MIN MAX A 1.5 1.25.41.49 A1..1..4 A2 1.5 1.15.41.45 b.3.5.12.2 c.1.2.4.8 D 2.82 3.2.111.119 E 1.5 1.7.59.67 E1 2.65 2.95.14.116 e.95 BSC.37 BSC e1 1.9 BSC.75 BSC L.3.6.12.24 θ 8 8 TX34.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TSSOP-14 D E1 E 5.94 1.78 b e.42.65 RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ H c In Millimeters In Inches Symbol MIN MAX MIN MAX A 1.2.47 A1.5.15.2.6 A2.8 1.5.31.41 b.19.3.7.12 c.9.2.4.8 D 4.86 5.1.191.21 E 4.3 4.5.169.177 E1 6.25 6.55.246.258 e.65 BSC.26 BSC L.5.7.2.28 H.25 TYP.1 TYP θ 1 7 1 7 TX19.1
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-14 D E E1 5.2 2.2 e b 1.27.6 RECOMMENDED LAND PATTERN (Unit: mm) A A2 A3 R1 R L L1 h h A1 θ L2 In Millimeters In Inches Symbol MIN MAX MIN MAX A 1.35 1.75.53.69 A1.1.25.4.1 A2 1.25 1.65.49.65 A3.55.75.22.3 b.36.49.14.19 D 8.53 8.73.336.344 E 5.8 6.2.228.244 E1 3.8 4..15.157 e 1.27 BSC.5 BSC L.45.8.18.32 L1 1.4 REF.4 REF L2.25 BSC.1 BSC R.7.3 R1.7.3 h.3.5.12.2 θ 8 8 TX11.1
PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 P W Q1 Q2 Q1 Q2 Q1 Q2 B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P1 A K Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 A B K P P1 P2 W Pin1 Quadrant SC7-5 7 9.5 2.25 2.55 1.2 4. 4. 2. 8. Q3 SOT-23-5 7 9.5 3.2 3.2 1.4 4. 4. 2. 8. Q3 SOT-23-6 7 9.5 3.17 3.23 1.37 4. 4. 2. 8. Q3 SOIC-8 13 12.4 6.4 5.4 2.1 4. 8. 2. 12. Q1 MSOP-8 13 12.4 5.2 3.3 1.5 4. 8. 2. 12. Q1 TSSOP-14 13 12.4 6.95 5.6 1.2 4. 8. 2. 12. Q1 SOIC-14 13 16.4 6.6 9.3 2.1 4. 8. 2. 16. Q1 DD1 TX1.
PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option) 368 227 224 8 7 442 41 224 18 13 386 28 37 5 DD2 TX2.