STPS1545. Power Schottky rectifier

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STPS1545 Power Schottky rectifier Datasheet - production data K TO-220AC A K A K K K A NC NC A Description Single chip Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in TO-220AC, TO-220FPAC or D²PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. D 2 PAK Table 1: Device summary Symbol Value IF(AV) 15 A TO-220FPAC A K VRRM 45 V Tj (max.) 175 C VF (typ.) 0.5 V Features Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAC, insulating voltage = 2000 VRMS sine Avalanche capability specified ECOPACK 2 compliant component for D²PAK on demand October 2016 DocID3504 Rev 7 1/13 This is information on a product in full production. www.st.com

Characteristics STPS1545 1 Characteristics Table 2: Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A IF(AV) IFSM Average forward current δ = 0.5, square wave Surge non repetitive forward current TO-220AC, D 2 PAK TC = 155 C TO-220FPAC TC = 130 C 15 A tp = 10 ms sinusoidal 220 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 C 430 W Tstg Storage temperature range -65 to +175 C Tj Maximum operating junction temperature (1) 175 C Notes: (1) (dptot/dtj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Parameter Max. value Unit Rth(j-c) TO-220AC, D 2 PAK 1.6 Junction to case C/W TO-220FPAC 4.0 Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (1) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 200 µa VR = VRRM Tj = 125 C - 11 40 ma Tj = 125 C IF = 15 A - 0.5 0.57 Tj = 25 C - 0.84 V IF = 30 A Tj = 125 C - 0.65 0.72 To evaluate the conduction losses, use the following equation: P = 0.42 x IF(AV) + 0.01 x IF 2 (RMS) 2/13 DocID3504 Rev 7

STPS1545 1.1 Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current P 12 F(AV) (W) δ = 0.1 δ= 0.2 δ = 0.5 δ = 0.05 10 8 δ = 1 6 Characteristics Figure 2: Average forward current versus ambient temperature (δ = 0.5) I F(AV) (A) 18 16 R th(j-a) = R th(j-c) TO-220AC 14 TO-220FPAC 12 10 R = 15 C/W th(j-a) 8 4 T 2 I δ = tp/t tp F(AV) (A) 0 0 2 4 6 8 10 12 14 16 18 6 4 2 0 T δ = tp/t tp T amb ( C) 0 25 50 75 100 125 150 175 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 C) P ARM(tp) P ARM(10 µs) 1 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D²PAK) Z th(j-c) /R th(j-c) 1.0 0.8 0.1 0.6 δ = 0.5 0.01 0.001 t p(µs) 1 10 100 1000 0.4 0.2 δ = 0.2 δ = 0.1 t (s) p Single pulse δ = tp/t tp 0.0 1E-4 1E-3 1E-2 1E-1 1E+0 T Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Z th(j-c) /R th(j-c) 1.0 0.8 Figure 6: Reverse leakage current versus reverse voltage applied (typical values) I R (µa) 5E+4 1E+4 T j = 150 C T j = 125 C 0.6 δ = 0.5 1E+3 T j = 100 C T j = 75 C 0.4 0.2 δ = 0.2 δ = 0.1 t (s ) p Single pulse δ= tp/t tp 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 T 1E+2 1E+1 T j = 50 C T j = 25 C V R (V) 1E+0 0 5 10 15 20 25 30 35 40 45 DocID3504 Rev 7 3/13

Characteristics Figure 7: Junction capacitance versus reverse voltage applied (typical values) C(pF) 2000 1000 F = 1 MHz V OSC = 30 mv RMS T j = 25 C STPS1545 Figure 8: Forward voltage drop versus forward current (maximum values) 500 200 100 V R (V) 1 2 5 10 20 50 Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK (typical values) 80 R th(j-a) ( C/W) 70 60 50 40 30 20 Epoxy printed board FR4, e CU = 35 µm 10 S Cu(cm²) 0 0 5 10 15 20 25 30 35 40 4/13 DocID3504 Rev 7

STPS1545 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m (for TO-220AC and TO-220FPAC) Maximum torque value: 0.7 N m (for TO-220AC and TO-220FPAC) 2.1 TO-220FPAC package information Figure 10: TO-220FPAC package outline H B A Dia L6 L2 L7 L3 L5 F1 D L4 G1 F E G DocID3504 Rev 7 5/13

Package information STPS1545 Table 5: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.50 2.70 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.00 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 16.00 typ. 0.630 typ. L3 28.60 30.60 0.126 1.205 L4 9.80 10.60 0.386 0.417 L5 2.90 3.60 0.114 0.142 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 6/13 DocID3504 Rev 7

STPS1545 2.2 D²PAK package information Figure 11: D²PAK package outline Package information This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID3504 Rev 7 7/13

Package information STPS1545 Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0 8 0 8 8/13 DocID3504 Rev 7

STPS1545 Figure 12: D²PAK recommended footprint (dimensions in mm) Package information DocID3504 Rev 7 9/13

Package information 2.3 TO-220AC package information Figure 13: TO-220AC package outline STPS1545 10/13 DocID3504 Rev 7

STPS1545 Package information Table 7: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam 3.75 3.85 0.147 0.151 DocID3504 Rev 7 11/13

Ordering information STPS1545 3 Ordering information Table 8: Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS1545D STPS1545D TO-220AC 1.86g 50 Tube STPS1545FP STPS1545FP TO-220FPAC 1.9g 50 Tube STPS1545G-TR STPS1545G D 2 PAK 1.38g 1000 Tape and reel 4 Revision history Table 9: Document revision history Date Revision Changes Jul-2003 5F Last release. 21-Mar-2007 6 Removed ISOWATT and TO-220FPAB packages. 17-Oct-2016 7 Removed I 2 PAK package. Updated cover page. Updated Section 1: "Characteristics" and Section 1.1: "Characteristics (curves)". Updated Section 2.3: "D2PAK package information". Updated Section 3: "Ordering information". 12/13 DocID3504 Rev 7

STPS1545 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID3504 Rev 7 13/13

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