C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

Similar documents
C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

E n-channel. Parameter Min. Typ. Max. Units

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

INSULATED GATE BIPOLAR TRANSISTOR. E n-channel

PD IRG4PC30UPbF. UltraFast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC. 1

IRGBC30M Short Circuit Rated Fast IGBT

IRGPC40S PD TO-247AC. Features V CES = 600V. V CE(sat) 1.8V. Description. Absolute Maximum Ratings. Thermal Resistance

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

W T J Operating Junction and -55 to +150 T STG Storage Temperature Range C

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

IRG4PC50FD. Fast CoPack IGBT. INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE Features. n-channel V CES = 600V

IRGPC20MD2 Short Circuit Rated Fast CoPack IGBT

PD A IRG4PC60F. Fast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC. 1

IRGBC20KD2-S PD Short Circuit Rated UltraFast CoPack IGBT INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

Features. n-channel TO-247AC. 1

Features. n-channel TO-247AC. 1

PD IRG4PC40KPbF INSULATED GATE BIPOLAR TRANSISTOR. Features. n-channel TO-247AC

IRG4PC40K Short Circuit Rated UltraFast IGBT

IRGPH50FD2 Fast CoPack IGBT

IRG4PH30K PD A. Short Circuit Rated UltraFast IGBT INSULATED GATE BIPOLAR TRANSISTOR. n-channel. Features V CES = 1200V. V CE(on) typ. = 3.

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

P C = 100 C Power Dissipation Linear Derating Factor

PD IRG4PC50WPbF. INSULATED GATE BIPOLAR TRANSISTOR Features. n-channel TO-247AC. 1

PD IRG4PC30WPbF. INSULATED GATE BIPOLAR TRANSISTOR Features. n-channel TO-247AC. 1

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Features. n-channel TO-220AB. 1

Absolute Maximum Ratings Parameter Max. Units

T J Operating Junction and -55 to +150 T STG Storage Temperature Range C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.

33 A I CM. 114 Gate-to-Emitter Voltage. mj P T C =25 Maximum Power Dissipation. Operating Junction and -55 to T STG

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

IRGMC50F. Fast Speed IGBT INSULATED GATE BIPOLAR TRANSISTOR. n-channel. Features V CES = 600V. V CE(on) max = 1.7V

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

Maximum Power Dissipation W C

n-channel TO-220AB 1

Features. n-channel TO-247AC. 1

Absolute Maximum Ratings

TO-247AC Absolute Maximum Ratings

n-channel D 2 Pak 1

IRG4PC50KD PD B INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. Short Circuit Rated UltraFast IGBT.

Features. n-channel TO-220AB. 1

Features. n-channel TO-247AC. 1

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm from case )

IRG4BH20K-S PD Short Circuit Rated UltraFast IGBT INSULATED GATE BIPOLAR TRANSISTOR. Features V CES = 1200V. V CE(on) typ. = 3.17V.

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

GA200TD120U PD D. Ultra-Fast TM Speed IGBT "HALF-BRIDGE" IGBT DUAL INT-A-PAK. Features V CES = 1200V. V CE(on) typ. = 2.3V.

n-channel Features 1 TO-247AD Pulse Collector CurrentÃc 82 I LM

IRG4BC20SD. Standard Speed IGBT

IRF6215PbF HEXFET Power MOSFET

IRG4BC20KD. Short Circuit Rated UltraFast IGBT V CES = 600V. V CE(on) typ. = 2.27V. Thermal Resistance. GE = 15V, I C = 9.

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

C Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

V DSS R DS(on) max (mω)

Insulated Gate Bipolar Transistor (Ultrafast Speed IGBT), 100 A

TO-247AC Absolute Maximum Ratings

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

IRG4BC30FD-SPbF. Fast CoPack IGBT. n-channel. Absolute Maximum Ratings Parameter Max. Units INSULATED GATE BIPOLAR TRANSISTOR WITH HYPERFAST DIODE

IRF530N PD HEXFET Power MOSFET V DSS = 100V. R DS(on) = 0.11Ω I D = 15A PRELIMINARY

IRG4BC10SD-SPbF IRG4BC10SD-LPbF

IRG4IBC10UD INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. UltraFast Co-Pack IGBT V CES = 600V. Features. V CE(on) typ. = 2.

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

I, Drain-to-Source Current (A) V GS, Gate-to-Source Voltage (V) I D, Drain-to-Source Current (A) I, Drain-to-Source Current (A)

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Min. Typ. Max. Units

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

PRELIMINARY Features Benefits SUPER Absolute Maximum Ratings Parameter Max. Units

Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

P C = 100 C Power Dissipation Linear Derating Factor

Base part number Package Type IRFP4137PbF TO-247AC Tube 25 IRFP4137PbF

IRGB4086PbF IRGS4086PbF

IRG7R313UPbF. Key Parameters V CE min 330 V V CE(ON) I C = 20A 1.35 V I RP T C = 25 C 160 A T J max 150 C

IGBT SIP Module (Short Circuit Rated Ultrafast IGBT)

IRF7341. HEXFET Power MOSFET V DSS = 55V. R DS(on) = 0.050Ω

SMPS MOSFET HEXFET Power MOSFET. V DSS R DS(on) max I D. 320 P C = 25 C Power Dissipation 260 Linear Derating Factor.

IRFP450LC PD HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.40Ω I D = 14A

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Ratings Parameter Min. Typ. Max Units

IRL3102. HEXFET Power MOSFET V DSS = 20V. R DS(on) = 0.013Ω I D = 61A PRELIMINARY

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

TO-220AB low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

D 2 Pak TO

120 P C = 25 C Power Dissipation 360 P C = 100 C Power Dissipation Linear Derating Factor

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRF1010E. HEXFET Power MOSFET V DSS = 60V. R DS(on) = 0.012Ω I D = 81A

Insulated Gate Bipolar Transistor Ultralow V CE(on), 250 A

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

IRG4BC20FPbF Fast Speed IGBT

IRLI620G PD HEXFET Power MOSFET V DSS = 200V. R DS(on) = 0.80Ω I D = 4.0A

APT50GT120B2R(G) APT50GT120LR(G)

Watts T J,T STG. CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

IRG7PH28UD1PbF IRG7PH28UD1MPbF

SMPS MOSFET. V DSS R DS(on) max I D

Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )

IRFB260NPbF HEXFET Power MOSFET

Transcription:

PD 9470F IRG4P50U INSULTED GTE BIPOLR TRNSISTOR UltraFast Speed IGBT Features UltraFast: Optimized for high operating frequencies 8-40 khz in hard switching, >200 khz in resonant mode Generation 4 IGBT design provides tighter parameter distribution and higher efficiency than Generation 3 Industry standard TO-247 package G E n-channel V ES = 600V V E(on) typ. =.65V @V GE = 5V, I = 27 Benefits Generation 4 IGBT's offer highest efficiency available IGBT's optimized for specified application conditions Designed to be a "drop-in" replacement for equivalent industry-standard Generation 3 IR IGBT's bsolute Maximum Ratings Thermal Resistance TO-247 Parameter Max. Units V ES ollector-to-emitter Breakdown Voltage 600 V I @ T = 25 ontinuous ollector urrent 55 I @ T = 00 ontinuous ollector urrent 27 I M Pulsed ollector urrent 220 I LM lamped Inductive Load urrent 220 V GE Gate-to-Emitter Voltage ± 20 V E RV Reverse Voltage valanche Energy ƒ 20 mj P D @ T = 25 Maximum Power Dissipation 200 P D @ T = 00 Maximum Power Dissipation 78 W T J Operating Junction and -55 to + 50 T STG Storage Temperature Range Soldering Temperature, for 0 seconds 300 (0.063 in. (.6mm from case ) Mounting torque, 6-32 or M3 screw. 0 lbf in (.N m) Parameter Typ. Max. Units R θj Junction-to-ase ---- 0.64 R θs ase-to-sink, Flat, Greased Surface 0.24 ---- /W R θj Junction-to-mbient, typical socket mount ---- 40 Wt Weight 6 (0.2) ---- g (oz) www.irf.com 2/30/00

IRG4P50U Electrical haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions V (BR)ES ollector-to-emitter Breakdown Voltage 600 ---- ---- V V GE = 0V, I = 250µ V (BR)ES Emitter-to-ollector Breakdown Voltage 8 ---- ---- V V GE = 0V, I =.0 V (BR)ES / T J Temperature oeff. of Breakdown Voltage ---- 0.60 ---- V/ V GE = 0V, I =.0m ----.65 2.0 I = 27 V GE = 5V V E(ON) ollector-to-emitter Saturation Voltage ---- 2.0 ---- I = 55 See Fig.2, 5 V ----.6 ---- I = 27, T J = 50 V GE(th) Gate Threshold Voltage 3.0 ---- 6.0 V E = V GE, I = 250µ V GE(th) / T J Temperature oeff. of Threshold Voltage ---- -3 ---- mv/ V E = V GE, I = 250µ g fe Forward Transconductance 6 24 ---- S V E 5V, I = 27 I ES Zero Gate Voltage ollector urrent ---- ---- 250 µ V GE = 0V, V E = 600V ---- ---- 2.0 V GE = 0V, V E = 0V, T J = 25 ---- ---- 5000 V GE = 0V, V E = 600V, T J = 50 I GES Gate-to-Emitter Leakage urrent ---- ---- ±00 n V GE = ±20V Switching haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions Q g Total Gate harge (turn-on) ---- 80 270 I = 27 Q ge Gate - Emitter harge (turn-on) ---- 25 38 n V = 400V See Fig. 8 Q gc Gate - ollector harge (turn-on) ---- 6 90 V GE = 5V t d(on) Turn-On Delay Time ---- 32 ---- t r Rise Time ---- 20 ---- T J = 25 ns t d(off) Turn-Off Delay Time ---- 70 260 I = 27, V = 480V t f Fall Time ---- 88 30 V GE = 5V, R G = 5.0Ω E on Turn-On Switching Loss ---- 0.2 ---- Energy losses include "tail" E off Turn-Off Switching Loss ---- 0.54 ---- mj See Fig. 0,, 3, 4 E ts Total Switching Loss ---- 0.66 0.9 t d(on) Turn-On Delay Time ---- 3 ---- T J = 50, t r Rise Time ---- 23 ---- I = 27, V = 480V ns t d(off) Turn-Off Delay Time ---- 230 ---- V GE = 5V, R G = 5.0Ω t f Fall Time ---- 20 ---- Energy losses include "tail" E ts Total Switching Loss ----.6 ---- mj See Fig. 3, 4 L E Internal Emitter Inductance ---- 3 ---- nh Measured 5mm from package ies Input apacitance ---- 4000 ---- V GE = 0V oes Output apacitance ---- 250 ---- pf V = 30V See Fig. 7 res Reverse Transfer apacitance ---- 52 ---- ƒ =.0MHz Notes: Repetitive rating; V GE = 20V, pulse width limited by max. junction temperature. ( See fig. 3b ) V = 80%(V ES ), V GE = 20V, L = 0µH, R G = 5.0Ω, (See fig. 3a) ƒ Repetitive rating; pulse width limited by maximum junction temperature. Pulse width 80µs; duty factor 0.%. Pulse width 5.0µs, single shot. 2 www.irf.com

IRG4P50U 80 Load urrent () 60 40 Square wave: 60% of rated voltage For both: Duty cycle: 50% T J = 25 T sink = 90 Gate drive as specified Power Dissipation = 40W Triangular wave: lamp voltage: 80% of rated 20 Ideal diodes 0 0. 0 00 f, Frequency (khz) Fig. - Typical Load urrent vs. Frequency (For square wave, I=I RMS of fundamental; for triangular wave, I=I PK ) I, ollector-to-emitter urrent () 000 00 0 T J = 50 T J = 25 V GE = 5V 20µ s PULSE W IDTH 0. 0 0 V E, ollector-to-emitter Voltag e (V ) I, ollector-to-emitter urrent () 000 00 0 T J = 50 T J = 25 V = 0V 5µs PULSE WIDTH 4 6 8 0 2 V GE, Gate-to-Emitter Voltage (V ) Fig. 2 - Typical Output haracteristics Fig. 3 - Typical Transfer haracteristics www.irf.com 3

IRG4P50U Maximum D ollector urrent () 60 50 40 30 20 0 V GE = 5V V E, ollector-to-emitter Voltage (V) 2.5 2.0.5 V GE = 5V 80µs PULSE WIDTH I I I = 54 = 27 = 4 0 25 50 75 00 25 50 T, ase Temperature ( ) Fig. 4 - Maximum ollector urrent vs. ase Temperature.0-60 -40-20 0 20 40 60 80 00 20 40 60 T, Junction Temperature ( ) J Fig. 5 - ollector-to-emitter Voltage vs. Junction Temperature Thermal Response (Z thj ) 0. D = 0.50 0.20 0.0 0.05 0.02 0.0 SIN GLE PU LS E (THERML RESPONSE) 2. Peak T J = P DM x Z thj + T 0.0 0.0000 0.000 0.00 0.0 0. 0 t, Rectangular Pulse Duration (sec) Notes:. Duty factor D = t / t 2 P DM t t 2 Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-ase 4 www.irf.com

IRG4P50U, apacitance (pf) 8000 6000 4000 2000 V GE = 0V, f = M Hz ies = ge + gc, ce SH ORTED res = gc oes = c e + gc ie s oes res V GE, Gate-to-Emitter Voltage (V) 20 6 2 8 4 V E I = 400V = 27 0 0 00 V E, ollector-to-emitter Voltage (V ) 0 0 40 80 20 60 200 Q g, Total Gate harge (n) Fig. 7 - Typical apacitance vs. ollector-to-emitter Voltage Fig. 8 - Typical Gate harge vs. Gate-to-Emitter Voltage Total Switching Losses (mj) 2.2 2.0.8.6.4.2.0 V = 480V V GE = 5V T J = 25 I = 27 Total Switching Losses (mj) 0 R V V G GE = 5.0 Ω = 5V = 480V I I I = 54 = 27 = 4 0.8 0.6 0 0 20 30 40 50 60 R G, Gate Resistance ( Ω) 0. -60-40 -20 0 20 40 60 80 00 20 40 60 T, Junction Temperature ( ) J Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. 0 - Typical Switching Losses vs. Junction Temperature www.irf.com 5

IRG4P50U Total Switching Losses (mj) 3.0 2.0.0 R G = 5.0Ω T J = 50 V = 480V V GE = 5V I, ollector-to-emitter urrent () 000 00 0 V GE = 20V T = 25 J SFE OPERTING RE 0.0 0 0 20 30 40 50 I, ollector-to-emitter urrent ( ) 0 00 000 V E, ollector-to-emitter Voltage (V) Fig. - Typical Switching Losses vs. ollector-to-emitter urrent Fig. 2 - Turn-Off SO 6 www.irf.com

IRG4P50U 50V 000V L V * D.U.T. 0-480V 480µF 960V R L = 480V 4 X I @25 * Driver same ty pe as D.U.T.; Vc = 80% of Vce(max) * Note: Due to the 50V power supply, pulse width and inductor w ill increase to obtain rated Id. Fig. 3a - lamped Inductive Load Test ircuit Fig. 3b - Pulsed ollector urrent Test ircuit I 50V 000V L Driver* D.U.T. V ƒ Fig. 4a - Switching Loss Test ircuit * Driver same type as D.U.T., V = 480V 90% ƒ 0% V 90% t d(off) Fig. 4b - Switching Loss Waveforms I 5% 0% t d(on) t r E on E ts = (E on +E off ) www.irf.com 7 t f E off t=5µs

IRG4P50U ase Outline and Dimensions TO-247 * 20.30 (.800) 9.70 (.775) 4.80 (.583) 4.20 (.559) 2.40 (.094) 2.00 (.079) 2X 5.45 (.25) 2X 5.90 (.626) 5.30 (.602) - B - 2 3.40 (.056) 3X.00 (.039) 0.25 (.00) M S 3.40 (.33) 3.00 (.8) 3.65 (.43) 3.55 (.40) 0.25 (.00) M D - - 5.50 (.27) 2X - - 4.30 (.70) 3.70 (.45) 5.50 (.27) 4.50 (.77) B M - D - 5.30 (.209) 4.70 (.85) 2.50 (.089).50 (.059) 4 0.80 (.03) 3X 0.40 (.06) 2.60 (.02) 2.20 (.087) NOTES: DIMENSIONS & TOLERNING PER NSI Y4.5M, 982. 2 ONTROLLING DIMENSION : INH. 3 DIM ENSIONS RE SHO W N M ILLIM ETER S (INHES). 4 O NFO RM S TO JEDE O UTLINE TO-247. LED SSIGNMENTS - GTE 2 - OLLETO R 3 - EM ITTER 4 - OLLETO R * LONGER LEDED (20mm) VERSION VILBLE (TO-247D) TO ORDER DD "-E" SUFFIX TO PRT NUMBER ONFORMS TO JEDE OUTLINE TO-247 (TO-3P) Dimensions in Millimeters and (Inches) IR WORLD HEDQURTERS: 233 Kansas St., El Segundo, alifornia 90245, US Tel: (30) 252-705 T Fax: (30) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 2/00 8 www.irf.com

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/