Chip-ScalePackageFiberOptic TransceiverIntegrationforHarsh Environments. Chuck Tabbert (505)

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Transcription:

Chip-ScalePackageFiberOptic TransceiverIntegrationforHarsh Environments Chuck Tabbert ctabbert@ultracomm-inc.com (505) 823-1293

CorporateOverview Agenda Motivation BackgroundTechnology ChipScalePackageTechnology Summary 2

Ultra Communications Overview Ultra Communications(UltraComm) Founded 2006(spin-out of Peregrine Semiconductor) Annual Revenue: >$3M(restricted by R&D projects) Gov t/commercial Ratio: 78%(Government)/ 22%(Commercial) 16 employees Fiber optic communications for harsh environments Fiber optic component packaging, optical modeling and circuit design Moved from Development into Production- Low rate production(50 units/ month with planned capacity expansion) 12 active research contracts Business Sectors Military: Avionics, Missiles, Ship platforms & Unmanned systems Space Moving towards Embedded computing Data Center& Automotive Presently shipping evaluation boards and engineering units to customers worldwide(adjudicated non-itar by US Dept of State)

Motivation

Commercial Trend in Embedded Photonic Modules IBM/Avago 1x12Tx/RxMicroPODs 120Gbps 12ch@10Gbps/channel ParallelOptic VCSELbased 28Txand28RXunitsmountedonto server ASIC package 6.72 Tbps I/O 420,000 units per computer shipping 10 s of thousands per month IBM Bluewaters PERCS P7-IH 5

Addressing High Temperature& High Reliability Markets Military Aerospace Adapted embedded optical modules in 1999 Inflighttoday Attractive features Compact Light weight EMIfree Wide temperature environment:-55 to 100 C High performance computing Increased activity over past 5 years High temperatures near ASIC 100 W+ components Desire to raise the room temperature 2-5% energy savings per degree Celsius Desirelowcost/lowpower $/GBps&pJ/GBps aerospace network card fiber optic transceiver 6

BackgroundTechnology

X80- QFN 12.5 Gbps/channel Fury Class(50GBPS) 4Transmit+4receiveparalleloptic 10 Mbps to 12.5 Gbps per channel(850 mw) with most advanced Built-In-Test diagnostics in the world with embedded Fiber Fault Detection utilizing OTDR to 1cm Standard ASIC Package(quad flat-pack no-leads(qfn)) Lead-less offers reduce parasitics for high speed Reflow Solderable Sealed Optical Path -40C to 100C guaranteed operation Qualified as hybrid at cable interface Configurations actively designed into space& avionic applications Transceiver(uController implemented within CORE) Transceiver with non-volatile memory(space version) Transceiver with OTDR(uController on customer board) RVCON splitting optics transceiver VCSEL PIN CORE (7 mm x 7 mm) OTDR ASIC CORE (with OTDR option)

Ultra Comm Product Roadmap Low Rate Production 4+4 @ 10 Gbps / channel Harsh environment Qualification completes Q2 2015 CORE (optical engine) Prototype Development 2 On-going SBIR programs Status: Prototypes complete Q1 2015 under SBIR Phase II program SFP+ with integrated OTDR X80 QFN Transceiver CSP Single Channel @ 10Gbps CSP 4x4 @ 25Gbps/ch RVCON Fiber Termini 4 mm Status: Prototypes complete Q2 2015 under SBIR Phase II program 8 mm Status: Prototypes complete Q3 2015 under SBIR Phase II program

ChipScalePackagingTechnology

10Gpbs Chip Scale Packaged(CSP) Fiber Optic Transmitter/ Receiver Createsanewclassoffiberoptictransceiver components that includes: Standard Pick& Place tolerances Solder reflow board assembly Cost parity with electrical connector 12.5 Gbps data rate, with non-volatile memory(self contained cal data) Advanced ASIC Functionality Autonomous Built-In-Diagnostics Fiber Connector for CSP Key technology development- wafer scale integration Lensontop-side Copper-post solder and flip-chip footprints aligned on bottom side Low-cost Optical Chip Scale Package Status: Prototypes complete Q3 2015 under SBIR Phase II program 4/15/2015

Technology Transitions to 25Gbps CSPplatformbeingusedforDeptOfEnergy(DOE) demo for Exascale Program Linktestingat10GBPS 4/15/2015

NASA Wide Temperature Experiments Ultra Comm completed wide temperature excursion transceiver testing under SBIR contract Status Tasks Completed Transceiver Design(Phase I) and Fabrication(Ph II) 3 batches were assembled Fiber Cable Assembly- 1,000 Thermal Cycles -55 C to 125 C Completed performance measurements -120 to +180 C(see figure->) 4/15/2015

Summary of Module BIT Functions OTDR Measurements Single point measurement at specified delay Full map with specified range and sample spacing Average back-reflected optical power in situ health monitor with data running Sweep frequency for fiber bandwidth measurements Transceiver Status VCSEL bias/mod/pre-emphasis settings DC Measurements RSSI: receiver average optical power RMSI: receiver optical modulation amplitude TSSI: transmitter optical power TMSI: transmitter input amplitude VCSEL operating voltage VCSEL temperature Die temperature Case(MCU) temperature Supply voltages Register tests DACtests

Summary Ultra Comm is demonstrating a new packaging concept for high speed fiber optic connectivity Presently 10MBS 12.5GBPS devices operational from-40 to 100C with development of 25Gbps/Channel Demonstrated in high shock environment in free space optics board to board application Leverages developed high-precision flip chip capability and ruggedized connector technology Keytothistechnology Matching CTE materials Expanded Beam Optical Interface Efficient coupling for reduced laser drive currents Consistent coupling over temperature Low delta-t between laser and heatsink

Back-Up

EmbeddedOTDR

OTDR Example: Long Fiber Corse sweep 5.25 seconds Fine sweep 7.35 seconds Biggest impediment to implementation is platform CONOPS

WideTemperatureExperiments

VCSEL Reliability at Elevated Temperature VCSEL Acceleration Factor: Case study: Want:20yearlife, T CASE =105 C -> T SUBST =110 C 5Gb/sRequired 10Gb/sDesired VCSELmanufacturerlifetestingresults: 14Gb/s50yearlife,6mA@70 C 6mA@110 C, projectedlifetime<6years NOTACCEPTABLE De-rate operating current 4 ma@ 110 C, projected lifetime > 20 years MEETS REQUIREMENT But lower operating current means lower bandwidth and output power Doesitfunction?... 20

VCSEL Performance at Elevated Temperature Measurement results T CASE =105 C (T SUBST =110 C) 4 ma average current 5Gb/s & 10Gb/s Outputpower:-1.5dBmcoupledintofiberviaRVCON TM 5 Gb/s 10 Gb/s (No filter) 21