STPS20L45C. Low drop power Schottky rectifier

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Low drop power Schottky rectifier Datasheet - production data K A1 A2 K Description Dual center tap Schottky rectifiers designed for high frequency switched mode power supplies and DC to DC converters. A2 K A1 K A1 A2 These devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Table 1: Device summary TO-220AB TO-220FPAB Symbol Value K K IF(AV) VRRM 2 x 10 A 45 V VF (typ.) 0.44 V A2 A1 D²PAK A2 A1 Tj (max.) 150 C Features Low forward voltage drop meaning very small conduction losses Low switching losses allowing high frequency operation Insulated package: TO-220FPAB Insulating voltage = 2000 VRMS sine Avalanche capability specified ECOPACK 2 compliant component for D²PAK on demand October 2016 DocID8001 Rev 5 1/15 This is information on a product in full production. www.st.com

Characteristics STPS20L45C 1 Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A IF(AV) IFSM PARM Average forward current δ = 0.5, square wave TO-220AB / D²PAK TO-220FPAB Surge non repetitive forward current Repetitive peak avalanche power TC = 135 C Per diode 10 TC = 130 C Per device 20 TC = 115 C Per diode 10 TC = 100 C Per device 20 tp = 10 ms sinusoidal tp = 10 µs, Tj = 125 C A 180 A 285 W Tstg Storage temperature range -65 to +150 Tj Maximum operating junction temperature (1) 150 Notes: (1) (dptot/dtj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. C Table 3: Thermal parameters Symbol Parameter Max. value Unit Rth(j-c) Rth(c) Junction to case Coupling TO-220FPAB TO-220AB D²PAK Per diode 4.5 Total 3.5 Per diode 2.2 Total 1.3 TO-220FPAB 2.5 TO-220AB D²PAK 0.3 C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/15 DocID8001 Rev 5

Characteristics Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (1) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 0.2 VR = VRRM Tj = 125 C - 65 130 Tj = 25 C - 0.55 IF = 10 A Tj = 125 C 0.44 0.5 Tj = 25 C - 0.73 IF = 20 A Tj = 125 C - 0.62 0.72 ma V To evaluate the conduction losses, use the following equation: P = 0.28 x IF(AV) + 0.022 x IF 2 (RMS) DocID8001 Rev 5 3/15

Characteristics 1.1 Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current (per diode) STPS20L45C Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) P F(AV) (W) 8 δ = 0.1 7 δ = 0.05 6 5 4 3 2 1 0 δ = 0.2 δ = 0.5 δ = 1 T I δ = tp/t tp F(AV) (A) 0 2 4 6 8 10 12 14 12 11 10 9 8 7 6 5 4 3 2 1 0 I F(AV) (A) T δ = tp/t tp R th(j-a) = 15 C/W R th(j-a) = R th(j-c) T amb ( C) TO-220FPAB TO-220AB 0 2 5 5 0 7 5 100 125 150 Figure 3: Normalized avalanche power deratings versus pulse duration (Tj = 125 C) P ARM(tp) P ARM(10 µs) 1 Figure 4: Reverse leakage current versus reverse voltage applied (typical values, per diode) I R (ma) 2E+2 1E+2 T j = 150 C 0.1 1E+1 1E+0 T j = 125 C T j = 75 C 0.01 1E-1 T j = 25 C 0.001 t p(µs) 1 10 100 1000 1E-2 1E-3 V R (V) 0 5 10 15 20 25 30 35 40 45 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D²PAK) Z th(j-c) /R th(j-c) 1.0 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Z th(j-c) /R th(j-c) 1.0 0.8 0.8 0.6 δ = 0.5 0.6 δ = 0.5 0.4 0.2 0.0 δ = 0.2 δ = 0.1 Single pulse t (s ) p 1E-3 1E-2 1E-1 1E+0 T δ = tp/t tp 0.4 0.2 δ = 0.2 δ = 0.1 t (s ) Single pulse p 0.0 1E-3 1E-2 1E-1 T δ = tp/t tp 1E+0 1E+1 4/15 DocID8001 Rev 5

2000 1000 Figure 7: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) F = 1 MHz V OSC = 30 mv RMS T j = 25 C Characteristics Figure 8: Forward voltage drop versus forward current (maximum values, per diode) 100 V R (V) 1 2 5 10 20 50 Figure 9: Thermal resistance junction to ambient versus copper surface under tab 80 R th(j-a) ( C/W) 70 60 50 40 30 20 Epoxy printed board FR4, e CU = 35 µm 10 S Cu(cm²) 0 0 5 10 15 20 25 30 35 40 DocID8001 Rev 5 5/15

Package information STPS20L45C 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m for TO-220AB Maximum torque value: 0.7 N m for TO-220AB 6/15 DocID8001 Rev 5

2.1 TO-220AB package information Figure 10: TO-220AB package outline Package information DocID8001 Rev 5 7/15

Package information STPS20L45C Table 5: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θp 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 8/15 DocID8001 Rev 5

2.2 TO-220FPAB package information Figure 11: TO-220FPAB package outline Package information DocID8001 Rev 5 9/15

Package information STPS20L45C Table 6: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.028 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.2 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.394 0.409 L2 16 typ. 0.63 typ. L3 28.60 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9 9.3 0.354 0.366 Dia 3 3.2 0.118 0.126 10/15 DocID8001 Rev 5

2.3 D²PAK package information Figure 12: D²PAK package outline Package information This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID8001 Rev 5 11/15

Package information STPS20L45C Table 7: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0 8 0 8 12/15 DocID8001 Rev 5

Figure 13: D²PAK recommended footprint (dimensions in mm) Package information DocID8001 Rev 5 13/15

Ordering information STPS20L45C 3 Ordering information Table 8: Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS20L45CT STPS20L45CT TO-220AB 1.95 g 50 Tube STPS20L45CFP STPS20L45CFP TO-220FPAB 1.7 g 50 Tube STPS20L45CG-TR STPS20L45CG D²PAK 1.38 g 1000 Tape and reel 4 Revision history Table 9: Document revision history Date Revision Changes Jul-2003 3C Last release. 22-Mar-2007 4 Removed ISOWATT and TO-247 packages. 06-Oct-2016 5 Updated cover page. Updated Section 3: "Characteristics" and Section 3.1: "Characteristics (curves)" and Section 5: "Ordering information" and Section 4.4: "D²PAK package information". 14/15 DocID8001 Rev 5

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID8001 Rev 5 15/15