Enhancement Mode N-Channel Power MOSFET

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Transcription:

SFG130NxF_Datasheet Enhancement Mode N-Channel Power MOSFET Features Low RDS(on) & FOM Extremely low switching loss Excellent stability and uniformity Fast switching and soft recovery Applications Consumer electronic power supply Motor control Synchronous-rectification Isolated DC/DC convertor Invertors

General Description SFG130NxF use advanced SFGMOS TM technology to provide low R DS(ON), low gate charge, fast switching and excellent avalanche characteristics. This device is specially designed to get better ruggedness and suitable to use in motor control applications. V DS, min I D, pulse R DS(ON), max @ VGS= V Q g V 390 A 5 mω 1.6 nc Schematic and Package Information SCHEMATIC DIAGRAM PIN ASSIGNMENT TOP VIEW TO220 TO263 TO220F SFG130NPF SFG130NKF SFG130NFF Absolute Maximum Ratings at T j=25 unless otherwise noted Parameter Symbol Value Unit Drain source voltage V DS V Gate source voltage V GS ±20 V Continuous drain current 1), T C=25 I D 130 A Pulsed drain current 2), T C=25 I D, pulse 390 A Power dissipation 3) for TO220, TO252 T C=25 Power dissipation 3) for TO220F, T C=25 34 P D 192 W Single pulsed avalanche energy 5) E AS 400 mj Operation and storage temperature T stg,t j -55 to 150 Oriental Semiconductor Copyright reserved 2017 2 / 11

Thermal Characteristics Parameter Symbol TO252/TO22O Value TO220F Unit Thermal resistance, junction-case R θjc 0.65 3.68 /W Thermal resistance, junction-ambient 4) R θja 62 62.5 /W Electrical Characteristics at T j=25 unless otherwise specified Parameter Symbol Min. Typ. Max. Unit Test condition Drain-source breakdown voltage BV DSS V V GS=0 V, I D=250 μa Gate threshold voltage V GS(th) 2.0 4.0 V V DS=V GS, I D=250 μa Drain-source on-state resistance R DS(ON) 4.0 5.0 mω V GS= V, I D=20 A Gate-source leakage current I GSS V GS=20 V na - V GS=-20 V Drain-source leakage current I DSS 1 μa V DS= V, V GS=0 V Dynamic Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Input capacitance C iss 6124.6 pf Output capacitance C oss 792.3 pf Reverse transfer capacitance C rss 15.1 pf Turn-on delay time t d(on) 28.2 ns Rise time t r 7.5 ns Turn-off delay time t d(off) 81.9 ns Fall time t f 20.1 ns V GS=0 V, V DS=50 V, ƒ=1 MHz V GS= V, V DS=50 V, R G=2.2 Ω, I D=22 A Oriental Semiconductor Copyright reserved 2017 3 / 11

Gate Charge Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Total gate charge Q g 1.6 nc Gate-source charge Q gs 20.6 nc Gate-drain charge Q gd 28.7 nc Gate plateau voltage V plateau 4.2 V I D=22 A, V DS=50 V, V GS= V Body Diode Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Diode forward current I S 130 Pulsed source current I SP 390 A V GS<V th Diode forward voltage V SD 1.3 V I S=20 A, V GS=0 V Reverse recovery time t rr 82.1 ns Reverse recovery charge Q rr 248.4 nc Peak reverse recovery current I rrm 4.9 A I S= A, di/dt= A/μs Note 1) Calculated continuous current based on maximum allowable junction temperature. 2) Repetitive rating; pulse width limited by max. junction temperature. 3) Pd is based on max. junction temperature, using junction-case thermal resistance. 4) The value of R θja is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T a=25. 5) V DD=50 V, R G=25 Ω, L=0.5 mh, starting T j=25. Oriental Semiconductor Copyright reserved 2017 4 / 11

Electrical Characteristics Diagrams 40 5 V V DS = V I D, Drain current (A) 30 20 V 4V 4.5 V I D, Drain current(a) 25 V GS = 3 V 0 0 2 4 6 8 V DS, Drain-source voltage (V) 1-1 0 1 2 3 4 5 6 7 8 9 V GS, Gate-source voltage(v) Figure 1, Typ. output characteristics Figure 2, Typ. transfer characteristics 4 C, Capacitance(pF) 3 2 C iss C oss V GS, Gate-source voltage(v) 8 6 4 2 C rss 1 0 20 40 60 80 V DS, Drain-source voltage (V) 0 0 20 30 40 50 60 70 80 90 1 Q g, Gate charge(nc) Figure 3, Typ. capacitances Figure 4, Typ. gate charge 118 8 BV Dss, Drain-source voltage (V) 116 114 112 1 8 6 4 2 R DS(on), On resistance (mω ) 6 4-60 -40-20 0 20 40 60 80 120 140 160 T j, Juntion temperature ( ) 2-60 -40-20 0 20 40 60 80 120 140 160 T j, Juntion temperature ( ) Figure 5, Drain-source breakdown voltage Figure 6, Drain-source on-state resistance Oriental Semiconductor Copyright reserved 2017 5 / 11

150 Is, Source current(a) 25 I D, Drain-source current(a) 125 75 50 25 1 0.4 0.6 0.8 1.0 1.2 V SD, Source-drain voltage(v) 0 25 50 75 125 150 T j, Juntion temperature ( ) Figure 7, Forward characteristic of body diode Figure 8, Drain current 0 0 I D, Drain current(a) 1 R DS(ON) Limited μs μs 1 ms ms DC I D, Drain current(a) 1 R DS(ON) Limited μs μs 1 ms ms DC 0.1 0.1 1 V DS, Drain-source voltage(v) 0.1 0.1 1 V DS, Drain-source voltage(v) Figure 9, Safe operation area for TO220/TO263 T C=25 Figure, Safe operation area for TO220F T C=25 Oriental Semiconductor Copyright reserved 2017 6 / 11

Test circuits and waveforms Figure 1, Gate charge test circuit & waveform Figure 2, Switching time test circuit & waveforms Figure 3, Unclamped inductive switching (UIS) test circuit & waveforms Figure 4, Diode reverse recovery test circuit & waveforms Oriental Semiconductor Copyright reserved 2017 7 / 11

Package Information Figure1, TO220 package outline dimension SYMBOL mm MIN NOM MAX A 4.37 4.57 4.70 A1 1.25 1.30 1.40 A2 2.20 2.40 2.60 b 0.70 0.80 0.95 b2 1.17 1.27 1.47 c 0.45 0.50 0.60 D 15. 15.60 16. D1 8.80 9. 9.40 D2 5.50 - - E 9.70.00.30 E3 7.00 - - e e1 H1 6.25 2.54 BSC 5.08 BSC 6.50 6.85 L 12.75 13.50 13.80 L1-3. 3.40 ΦP 3.40 3.60 3.80 Q 2.60 2.80 3.00 Oriental Semiconductor Copyright reserved 2017 8 / 11

Package Information Figure2, TO263 package outline dimension SYMBOL mm MIN NOM MAX A 4.37 4.57 4.77 A1 1.22 1.27 1.42 A2 2.49 2.69 2.89 A3 0.00 0.13 0.25 b 0.70 0.81 0.96 b1 1.17 1.27 1.47 c 0.30 0.38 0.53 D1 8.50 8.70 8.90 D4 6.60 - - E 9.86.16.36 E5 7.06 - - e H 14.70 2.54 BSC 15. 15.50 H2 1.07 1.27 1.47 L 2.00 2.30 2.60 L1 1.40 1.55 1.70 L4 0.25 BSC Oriental Semiconductor Copyright reserved 2017 9 / 11

Package Information Figure3, TO220F package outline dimension SYMBOL mm MIN NOM MAX E 9.96.16.36 A 4.50 4.70 4.90 A1 2.34 2.54 2.74 A4 2.56 2.76 2.96 c 0.40 0.50 0.65 D 15.57 15.87 16.17 H1 e L 12.68 6.70REF 2.54BSC 12.98 13.28 L1 2.88 3.03 3.18 ФP 3.03 3.18 3.38 ФP3 3.15 3.45 3.65 F3 3.15 3.30 3.45 G3 1.25 1.35 1.55 b1 1.18 1.28 1.43 b2 0.70 0.80 0.95 Oriental Semiconductor Copyright reserved 2017 / 11

Ordering Information Package Units/Tube Tubes/Inner Box Units/Inner Box Inner Box/Carton Box Units/Carton Box TO220 50 20 0 6 6000 TO263 50 20 0 6 6000 TO220F 50 20 0 6 6000 Product Information Product Package Pb Free RoHS Halogen Free SFG130NPF TO220 yes yes yes SFG130NKF TO263 yes yes yes SFG130NFF TO220F yes yes yes Oriental Semiconductor Copyright reserved 2017 11 / 11