MICRO INDUCTORS Features 1. Very high Self-Resonant Frequencies 2. Ultra miniature size and light(0.6mm mm mm). No polarity 4. Terminal electrode has excellent solder heat resistance for soldering. 5. Elimination of lead throughout Applications 1. Bluetooth module 2. CDMA, TDMA, GSM, PCS Phone. RF module of telecommunication products. -Cellular phone, Cordless telephone, Pagers etc. 4. PAM (Power Amp Module) 5. Computer communications, Radar detectors. Ordering Information MI - I 060-220 J J T (1) (2) () (4) (5) (6) (7) (1) Series () Dimensions The first two : length(mm) The last two : width(mm) (5) Tolerance S : nh J : 5% (2) Material (4) Inductance The first two digits are significant. The last digit is the number of zeros following. N : a decimal point placed between first two digits. (5) Termination J : Nickel barrier (7) Packing B : Bulk pack T : Tape & Reel( 178mm [7inches]) L : Tape & Reel( 254mm [10inches]) Shape and Dimensions unit : mm[inches] Type L W T C(max.) MI-060-0.60.0 [.0201] 0.0 [.012.001] 0.0 [.012.001] [.008] MI-5-0.05 [.09.002] 0.50.05 [.020.002] 0.50.05 [.0.02] 0.40 [.016]
Specifications MI 060 Part No. MI-I060-10NS MI-I060-12NS MI-I060-15NS MI-I060-18NS MI-I060-22NS MI-I060-27NS MI-I060-NS MI-I060-9NS MI-I060-47NS MI-I060-56NS MI-I060-68NJ MI-I060-82NJ MI-I060-J MI-I060-120J MI-I060-J MI-I060-180J MI-I060-220J nh Tolerance MHz 1.2 1.5 1.8 2.2 2.7..9 4.7 5.6 6.8 8.2 10 12 15 18 22 Inductance (at MHz) nh 5% Q MIN.5.5.5.5 4 4 4 4 MHz.9 4.1 4.1 4.2.9 4. 4.7 4.7 4.9 4.5 5.1 4.9 800MHz 11.5 11.9 11.9 12.0 11.8 1 11.5 12.8 12.4 1. 12.5 11.8 1.0 11.8 1.0 1.0 12. Q(Typ) 0MHz 12.5 1.2 1. 1.4 1.2 11.5 12.9 14.9 14.2 15.4 1 1.4 14.6 1.5 14.7 14.6 1.4 1800MHz 16.5 17.9 17.8 18.1 18.5 17.2 18.2 21.5 20.0 2.1 20.1 19.7 20.6 19.7 2 19.1 22.2 SRF(MHz) min. 00 00 00 00 18000 00 1000 10 00 00 9000 9000 8000 8000 7000 6000 6000 max. 0.15 0.15 0.15 0.25 0 5 0.40 0.45 0.50 0.60 0.70 5 0.90 1.10 DCR( ) typ. 0.09 0.10 0.11 0.1 0.14 0.15 0.24 0.27 0 5 8 9 0.54 0.62 0.75 0.90 0.95 Rated current (ma) max. 170 170 170 170 Test Equipment & Fixture L, Q : RF Impedance Analyzer 4991A(Agilent), Test Fixture 16196C(Agilent) SRF : Network Analyzer 8722ES (Agilent), Rdc : TWA-161A, B Electrical Characteristics Inductance Characteristics Q Characteristics 4
5 MI-I5-10NS MI-I5-12NS MI-I5-15NS MI-I5-18NS MI-I5-22NS MI-I5-27NS MI-I5-NS MI-I5-9NS MI-I5-47NS MI-I5-56NS MI-I5-68NJ MI-I5-82NJ MI-I5-J MI-I5-120J MI-I5-J MI-I5-180J MI-I5-220J MI-I5-270J MI-I5-0J MI-I5-90J MI-I5-470J MI-I5-560J MI-I5-680J MI-I5-820J MI-I5-101J 1.2 1.5 1.8 2.2 2.7..9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 9 47 56 68 82 4.5 5.5 5.5 5.5 5.5 5.5 0.10 0.10 0.25 0.25 0 0 5 0.40 0.50 0.70 0 0.90 0 1.20 1.50 1.80 2.00 2.20 2.50 2.70 2.90.20 0.06 0.06 0.08 0.08 0.09 0.11 0.14 0.14 0.15 0.17 0.2 2 8 0.4 0.49 0.60 0.65 0.79 0.98 1.15 1.0 1.85 2.00 2.20 00 00 00 00 250 250 250 250 Part No. nh Tolerance MHz 8.0 8.4 8.4 9.2 8.6 8.4 9.0 9.2 9.6 8.8 8.5 9.1 8. 8.6 8.9 9. 8.7 9.0 8.6 9.1 8.7 9.0 10.1 1 9.2 MHz Q MIN min. SRF(MHz) Q(Typ) Inductance (at MHz) 20.5 21.2 21.2 21.5 22.2 22.8 22.2 2.1 2.2 2. 21. 22.7 22.5 24.1 22.4 24.6 2.4 26.5 24.8 24.1 24.6 24.5 25.5 24.5 2.2 800MHz 2.7 24.9 25.4 26.9 26.8 26.0 26.5 26.6 26.9 2 27.1 27.2 27.5 27.4 28.5 0.4 26.2 0.2 28.0 26.1 26.5 25.8 27.7 25.9 24.2 0MHz 27.5 28.6 28.2 0.2 29.7 5.8 7.9 9.5 4 40.0 41.5 42.1 42.8 42.9 41. 40.0 8.1 6.4 25.7 2.0 2.5 20.7 20.4 16.6 00 00 14000 1000 10 00 00 00 8000 7000 6500 5600 5400 4 4000 700 500 400 2500 2400 2 2 0 1800MHz MI 5 DCR( ) Rated current (ma) max. max. typ. Specifications Electrical Characteristics nh 5% Test Equipment & Fixture L, Q : RF Impedance Analyzer 4991A(Agilent), Test Fixture 1619C(Agilent) SRF : Network Analyzer 8722ES (Agilent), Rdc : TWA-161A, B Inductance Characteristics Q Characteristics
RELIABILITY AND TEST CONDITIONS MICRO INDUCTORS ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS -55 ~+125-40 Max. 70% RH Max. 1. No damage such as cracks should be caused in body element. 2. More than 75% of the terminal electrode shall be covered with new solder.. Inductance chage : within 5% 4. Quality factor change : within 0% 1. More than 90% of the terminal electrode shall be covered with new solder. 2. Inductance chage : within 5%. Quality factor change : within 0% 1. More than 50% of the terminal electrode shall be covered with new solder. at packing condition TEST CONDITION Preheat temperature : to Preheat time : 1 min. Solder temperature : 260 10 Dipping time : 10 0.5sec Preheat temperature : to Preheat time : 1 min. Solder temperature : 20 10 Dipping time : 1sec Preheat temperature : Preheat time : 1 min. Solder temperature : 20 Dipping time : 10sec. (Reflow soldering profile) Bending Test 1. No mechanical damage 79
MICRO INDUCTORS ITEM REQUIREMENTS TEST CONDITION Drop 1. No mechanical damage Drop 10 times on a concrete floor from a height of 91cm. Vibration Thermal shock (Temperature cycle) 1. No mechanical damage 1. No mechanical damage 2. Inductance change : within 5%. Quality factor change : within 0% Frequency : 10~55~10Hz Amplitude : 1.52 mm Direction and time : X,Y,Z directions for 2 hours Step1. -40 0 min. Step2. 85 0 min. Number of cycle : times Heat load resistance 1. No mechanical damage 2. Inductance change : within 5%. Quality factor change : within 0% Temperature : 85 2 Applied current : rated current Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Low temp. resistance 1. No mechanical damage 2. Inductance change : within 5%. Quality factor change : within 0% Temperature : -40 5 Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Humidity resistance 1. No mechanical damage 2. Inductance change : within 5%. Quality factor change : within 0% Temperature : 40 2 Humidity : 90~95% RH Time : 500 hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 2. Inductance change : within 5%. Quality factor change : within 0% Temperature : 40 2 Humidity : 90~95% RH Applied current : rated current Time : 500 hours Measured at room ambient temperature after placing for 24 hours 80
PACKING STANDARD QUANTITY Type Q flty(pcs) REMARKS 060 15,000 10,000 5 1608 50,000 BULK CASSETTE 10,000 4,000 4mm pitch 8,000 4516 452 5750,000 7,000,000 7,000,000 1,500 1,000 254mm 254mm REEL DIMENSION unit:mm R j178 2.0 j254 2.0 Type 060, 5, 1608,, Array 4516, 452, 5750 2.0 j1.0 0.5 j2 W W[mm] 9.0 1.0.] more than 50 less than 1.5 unit:mm TAPING DIMENSION / 8mm wide Embossing Tape unit:mm Sprocket hole j1.5 +0.1-0 Chip cavity 1.75 0.1 B A.5 0.05 8.0 P 2.0 0.05 0.1 T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP BEADS ARRAY CHIP FERRITE INDUCTOR CHIP EMI SUPPRESSION FILTER CHIP EMI FILTER ARRAY CHIP LC FILTER CHIP COMMON MODE FILTER CHIP FEEDTHRU CHIP VARISTOR CHIP VARISTOR ARRAY CHIP SURGE ABSORBER 1608 0 1.45 1.80 2.25 2.25.60.60 0.95 0.08 0 1.5 0 1.5 81
Paper Tape unit:mm Sprocket hole j1.5 +0.1-0 Chip cavity 1.75 0.1 B A.5 0.05 8.0 P 0.1 T 2.0 0.05 PRODUCT Type A 0.1 B 0.1 P 0.1 T(max.) MICRO INDUCTOR CHIP BEADS CHIP INDUCTOR CHIP VARISTOR CHIP SURGE ARRAY 060 5 1608 70.02 0.650.1 00.1 0.670.02 1..1 1.80.1 0.1 2.00.1 2.00.1 0.45 1.1 TAPING DIMENSION / 12mm wide Embossing Tape unit:mm Sprocket hole j1.5 +0.1-0 Chip cavity 1.75 0.1 B A 5.5 0.05 12.0 P 2.0 0.05 0.1 T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP FEEDTHRU 4516 4516 452 5750.60 5.20 4.90 4.90 4.90 6.10 8.0 8.0 0 1.5 1.40 2.05 82
5 BULK CASSETTE DIMENSION Unit:mm 12 0.1 Slider Shutter +0-0.1 2.0 +0.2-0.1 +0.1 1.5-0 Connecting Port +0 6-0.2 1.5 +0.2-0 6 +0-0.2 12.1 0.1 8.8 0.1 6.8 0.1 110 0.7 TOP TAPE STRENGTH The force for tearing off top tape is 20 to 70 grams in the arrow direction. Top tape 165 to 180 Embossing tape TAPING MATERIAL Embossed Tape Paper Tape Top tape Top tape Paper tape Plastic/thermally activated adhesive Embossment Bottom tape Sprocket hole Embossed carrier Chip cavity LEADER AND BLANK PORTION Blank Portions Chip Cavity Blank Portions Leader 10 to 20 pitches 20 to 40 pitches 210mm to 250mm Drawing direction The pitch holes shift within mm for cumulative 10 pitches. 8
LAND PATTERN DESIGN BEAD, INDUCTOR, VARISTOR, SURGE ABSORBER ARRAY SIZE a b c 060 5 1608 4516 452 5750 0.22 0.7 1.1 1.5 1.8 2.0 0.25 0.4 0.6 2.2.0.0 2 0.5 1.4 1.4.0 5.8 Land pattern Land pattern < array> <4 array> SIZE array a b c d array 4 array.0.0 0.5 0.4 EMI SUPPRESSION FILTER, LC FILTER, FEEDTHRU CAPACITOR e f Land pattern f Land pattern < size> <, 4516 size> SIZE a b c d e f 4516 1.1 1.5 1.4 1.4 0.4 0.6 2.0 2.4 2.4 0.1 - - 1.4 2.4.4 84
LAND PATTERN DESIGN COMMON MODE FILTER, VARISTOR ARRAY SIZE POLE(Array) a b c d 2 POLE 2 Array 2 POLE 2 Array 1.20 0.76 2.10 1.96 0.60 8 0 0.76 2.60 2.16.00 2.54 0.40 0.46 0.60 0.90 ÆEMI FILTER ARRAY Land pattern e SIZE POLE(Array) a b c d e 4 Array.0 0.4 2.4 85
SOLDERING PROFILE REFLOW SOLERING PROFILE preheating sec. max. soldering 10 sec. max. cooling 60 sec. min. 20 20 sec. max. 60 sec. min. FLOW SOLDERING PROFILE preheating sec. max. dipping 10 sec. max. cooling 60 sec. min. 250 60 sec. min. MANUAL SOLDERING 00 solder iron max. 0W T /0.5 sec. Tc soldering 2 sec. max. Diameter of solder iron 1.2 mm max. 86