STPS8H100. High voltage power Schottky rectifier. Features. Description

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High voltage power Schottky rectifier Datasheet - production data TO-220AC A K A K K K A NC NC D 2 PAK A Features Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Insulated package: TO-220FPAC, insulating voltage = 2000 VRMS sine Avalanche capability specified ECOPACK 2 compliant component for D²PAK on demand TO-220FPAC A K Description Schottky barrier rectifier designed for high frequency compact switched mode power supplies such as adaptors and on-board DC-DC converters. Symbol IF(AV) VRRM Table 1: Device summary Value 8 A 100 V Tj (max) 175 C VF (typ) 0.56 V December 2015 DocID5387 Rev 12 1/14 This is information on a product in full production. www.st.com

Characteristics STPS8H100 1 Characteristics Table 2: Absolute ratings (limiting values, at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 30 A IF(AV) IFSM PARM Average forward current δ = 0.5, square wave Surge non repetitive forward current Repetitive peak avalanche power TO-220AC, D 2 PAK TC = 165 C TO-220FPAC TC = 150 C 8 A tp = 10 ms sinusoidal 250 A tp = 10 µs, Tj= 125 C 750 W Tstg Storage temperature range -65 to + 175 C Tj Maximum operating junction temperature (1) + 175 C Notes: (1) (dptot/dtj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter Value Unit Rth(j-c) TO-220AC, D 2 PAK 1.6 Junction to case C/W TO-220FPAC 4 Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (2) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 5 ms, δ < 2% (2) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 4.5 µa VR = VRRM Tj = 125 C - 2.0 6.0 ma Tj = 25 C - 0.71 IF = 8 A Tj = 125 C - 0.56 0.58 Tj = 25 C - 0.77 IF = 10 A V Tj = 125 C - 0.59 0.64 Tj = 25 C - 0.81 IF = 16 A Tj = 125 C - 0.65 0.68 To evaluate the conduction losses use the following equation: P = 0.48 x IF(AV) + 0.0125 IF 2 (RMS) 2/14 DocID5387 Rev 12

1.1 Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current P F(av) (W) 6.0 δ = 0.1 δ = 0.2 δ = 0.5 5.5 δ = 0.05 5.0 4.5 δ = 1 4.0 3.5 3.0 2.5 2.0 T 1.5 1.0 0.5 I F(av) (A) δ=tp/t tp 0.0 0 1 2 3 4 5 6 7 8 9 10 Characteristics Figure 2: Normalized avalanche power derating versus pulse duration (Tj= 125 C) 0.1 0.01 0.001 P ARM(tp) P ARM(10 µs) 1 t p(µs) 1 10 100 1000 Figure 3: Average forward current versus ambient temperature, δ = 0.5 (TO-220AC, D²PAK) IF(AV)(A) 10 8 6 4 Rth(j-a)=Rth(j-c) Rth(j-a)=15 C/W T 2 δ=tp/t tp Tamb ( C) 0 0 20 40 60 80 100 120 140 160 180 Figure 4: Average forward current versus ambient temperature, δ = 0.5 (TO-220FPAC) IF(AV)(A) 10 8 6 4 Rth(j-a)=Rth(j-c) Rth(j-a)=50 C/W T 2 δ=tp/t tp Tamb ( C) 0 0 20 40 60 80 100 120 140 160 180 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, D²PAK) Zth(j-c) /Rth(j-c) 1.0 0.8 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration (TO- 220FPAC) Zth(j-c) /Rth(j-c) 1.0 0.8 0.6 δ = 0.5 0.6 δ = 0.5 0.4 0.2 δ = 0.2 T δ = 0.1 Single pulse tp(s) δ=tp/t tp 0.0 1E-4 1E-3 1E-2 1E-1 1E+0 0.4 0.2 δ = 0.2 T δ = 0.1 Single pulse tp(s) δ=tp/t tp 0.0 1E-3 1E-2 1E-1 1E+0 1E+1 DocID5387 Rev 12 3/14

Characteristics Figure 7: Reverse leakage current versus reverse voltage applied (typical values) IR(µA) 5E+3 1E+3 1E+2 Tj=125 C STPS8H100 Figure 8: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 500 F=1MHz Tj=25 C 1E+1 1E+0 Tj=25 C 1E-1 VR(V) 1E-2 0 10 20 30 40 50 60 70 80 90 100 200 VR(V) 100 1 10 100 Figure 9: Forward voltage drop versus forward current (maximum values) Figure 10: Thermal resistance junction to ambient versus copper surface under tab 80 70 R th(j-a) ( C/W) D²PAK 60 50 40 30 20 10 Epoxy printed board FR4, e CU = 35 µm 0 0 5 10 15 20 25 30 35 40 SCu(cm²) 4/14 DocID5387 Rev 12

Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m (for TO-220AC and TO-220FPAC) Maximum torque value: 0.7 N m (for TO-220AC and TO-220FPAC) DocID5387 Rev 12 5/14

Package information 2.1 D²PAK package information Figure 11: D²PAK package outline STPS8H100 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/14 DocID5387 Rev 12

Package information Table 5: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. 0.015 V2 0 8 0 8 DocID5387 Rev 12 7/14

Package information Figure 12: D²PAK recommended footprint (dimensions in mm) STPS8H100 8/14 DocID5387 Rev 12

2.2 TO-220AC package information Figure 13: TO-220AC package outline Package information DocID5387 Rev 12 9/14

Package information STPS8H100 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M 2.6 typ. 0.102 typ. Diam 3.75 3.85 0.147 0.151 10/14 DocID5387 Rev 12

2.3 TO-220FPAC package information Figure 14: TO-220FPAC package outline Package information H B A Dia L6 L2 L7 L3 L5 F1 D L4 G1 F E G DocID5387 Rev 12 11/14

Package information STPS8H100 Table 7: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 typ. 0.63 typ. L3 28.6 30.6 0.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 12/14 DocID5387 Rev 12

Ordering information 3 Ordering information Table 8: Ordering information Order code Marking Package Weight Base qty Delivery mode STPS8H100D STPS8H100D TO-220AC 1.86g 50 Tube STPS8H100FP STPS8H100FP TO-220FPAC 1.90g 50 Tube STPS8H100G STPS8H100G D 2 PAK 1.48g 50 Tube STPS8H100G-TR STPS8H100G D 2 PAK 1.48g 1000 Tape and reel 4 Revision history Table 9: Document revision history Date Revision Changes Jul-2003 6D Last update. 01-Jun-2006 10 Reformatted to current standard. Added ECOPACK statement. Changed nf to pf in Figure 11. Revision number set to 10 to align with on-line versioning. 08-Apr-2014 11 Updated D 2 PAK package information and Figure 2. 14-Dec-2015 12 Updated features in cover page. Minor text changes in Section 1: "Characteristics". Updated Section 2: "Package information". DocID5387 Rev 12 13/14

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved 14/14 DocID5387 Rev 12