DTU DANCHIP an open access micro/nanofabrication facility bridging academic research and small scale production DTU Danchip National Center for Micro- and Nanofabrication
DTU Danchip DTU Danchip is Denmark s National Center for Micro- and Nanofabrication. 1350m 2 cleanroom class 100-10, 40 employees Copenhagen, owned by the Technical University of Denmark Mission: To provide Denmark with state of the art infrastructure, research facilities, technology and hands-on training within applied micro and nano fabrication technology. To constitute a direct link between applied university research and industrial applications. To facilitate the creation of new knowledge and enable Danish industry to exploit the existing and future benefits of nanotechnology.
Basic Concept Cost sharing: lowering the barrier of entry so all interested companies and research institutions have access to state of the art micro and nanotechnology without equipment investment. Critical mass of users assures: knowledge and expertise efficient operation and maintanence sharing of operation cost
DTU Danchip - academia as main customer - 20 % of activity in cleanroom comes from industry - from basic research to small scale production
academic - industrial full control complete freedom
Micro/nano fabrication facilities every facility has its own balance Flexibility Research minded University Lab Quality control Reliability Small scale production Wafer fab
What do we do? - facilitate reserach - offer access to state of the art equipment - offer know-how and expertise - do customer processing, consulting services - small-scale production - education and training in all aspects of practical micro and nanofabrication What do we not do? - large scale production - support/initiate new technologies without critical mass of users
Why all the way to small scale production at Danchip? the times are over where you can start a hardware company in a garage! fabless MEMS startups --- cannot survive without open access cleanrooms open access facilities enable technology entrepreneurship small businesses are the engine of global economy hardware is hard easy money is in software Transfer from development to fab too cost intensive for niche products
Why all the way to small scale production at Danchip? no investment money for tools and equipment fabless MEMS, semiconductor startups prototype to first product has to be fast and cost efficient
Small scale production at Danchip making the most of it - run batches - costumer controlles and verifies wafers after number of process steps - specifications based on process monitor characterization/data As opposed to: - running continous production (on std. Danchip equipment) - specifications on functionality
Challenged by academia- Cleanroom technology at DTU : 1992-2012 materials lithography etch 1 2 H He 11 5 6 7 8 9 Na B C N O 19 13 14 15 16 K Al Si P S 22 Ti 1992 F 18 Ar contact aligner (UV, ~1µm) wet etch reactiv ion etch 1 H 3 Li 5 B 13 Al 6 C 14 Si 7 N 15 P 8 O 16 S 9 F 17 Cl 2 He 18 Ar contact aligner (UV, ~1µm) wet etch 11 Na 19 K 12 Mg 38 Sr 22 Ti 40 Zr 72 E-beam lithography (~10 nm) reactiv ion etch Hf 23 V 41 Nb 73 Ta 24 Cr 42 Mo 74 W 25 Mn 68 26 Fe 44 Ru 27 Co 45 Rh 77 Ir 28 Ni 46 Pd 78 Pt 29 30 31 Cu 47 Ag 79 Zn 70 Ga 49 In Au Yb 32 Ge 50 Sn 82 Pb 33 As 51 Sb 35 Br 53 I Er 2012 NanoImprint (thermal/uv) DUV-Stepper, (<250 nm) ICP/DRIE IBE/CAIBE
flexibility 1 H 3 Li 11 Na 19 K 12 Mg 38 Sr 22 Ti 40 Zr 72 Hf 23 V 41 Nb 73 Ta 24 Cr 42 Mo 74 W 25 Mn 26 Fe 44 Ru 27 Co 45 Rh 77 Ir 28 Ni 46 Pd 78 Pt 29 Cu 47 Ag 79 Au 30 Zn 5 B 13 Al 31 Ga 49 In 6 C 14 Si 32 Ge 50 Sn 82 Pb 7 N 15 P 33 As 51 Sb 8 O 16 S 9 F 17 Cl 35 Br 53 I 2 He 18 Ar 68 Er 70 Yb 52 Te
Different material platforms - joined equipment platform silicon magnetic III-V metals equipment II-VI? others? polymer carbon 13 DTU Danchip, Technical University of Denmark
Flexibility at a price - ensuring reproducability by duplicating of equipment - 5 ICP dry etchers - metal - silicon - polymer - III-V - oxide - wafer size 2, 4, 6 and 8 State of the art equipment (examples): - JOEL 9500 E-beam (delivered may 2012) - ION Beam Etch - DUV Stepper - Graphene CVD tool
E- beam JOEL JBX 9500 technical data Min. spot size Min. line width Max. scan speed JBX9500 4nm 10nm 100MHz Max. writing field size 1000µm Min. step size Field stitch error Position accuracy within 6inch area 0.5nm 11nm 11nm min. line width ---- Writing conditions ---- Field size: 1000µm Current : 200pA Resist: ZEP520A Dose: 7580µC/cm^2 Shot pitch: 1nm Spec= 10nm or less Results = Max: 9nm, in X and Y
What are we good at? Access to advanced equipment for research and development within micro- and nanotechnology Low initial costs for new projects (cost sharing) Technological head start and rapid development of new areas through joint knowledgebase and sharing possibility to directly go from development to small scale production without cost and hassle to change facility
Summary DTU Danchip -Danchip facilitates research, does not conduct own research projects - Danchip offers a variety of services and consulting from concept to full small scale production - Danchip is ISO 9001 certified access to cleanroom equipment and in-sourcing of customer processes -Danchip has the necessary capacity for small scale production -Danchip has the capability to run small scale production
Examples of Applications (courtesy of DTU Nanotech) Commercial examples include: silicon microphones, optical waveguide circuitry, pressure sensors for wastewater, micro4pointprobes, etc
DTU Danchip Our balance Flexibility Process development Research Quality control Reliability Small scale production
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