.3W Fully Differential GENERAL DESCRIPTION The SGM4895 is a fully differential audio power amplifier that is designed for portable communication device applications and demanding applications in mobile phones. It is capable of delivering.3w of continuous average power into an 8Ω load with typically % distortion (THD+N) from a 5V battery voltage. It operates from 2.5V to 5.5V power supply. The SGM4895 features a low power consumption shutdown mode. To facilitate this, shutdown may be enabled by logic low. Additionally, the SGM4895 features an internal thermal shutdown protection mechanism. The SGM4895 contains advanced pop/click circuitry, with a minimal amount of external components. All these features make SGM4895 ideal for wireless handsets and other low voltage applications where minimal power consumption is a primary requirement. The SGM4895 is available in Green TDFN-3 3-8L and MSOP-8 (Exposed Pad) packages. It operates over an ambient temperature range of -4 to +85. FEATURES Fully Differential Amplifier Excellent PSRR: Direct Connection to Battery.3W into 8Ω Load from 5V Supply at THD+N = % (TYP).6W into 4Ω Load from 5V Supply at THD+N = % (TYP, SGM4895YDB8 Only) 2.5V to 5.5V Operation Low Shutdown Current Improved Pop/Click Circuitry Support Single-Ended or Differential Input Thermal Overload Protection Circuitry No Output Coupling Capacitors, Bootstrap Capacitors Required External Gain Configuration Capability -4 to +85 Operating Temperature Range Available in Green TDFN-3 3-8L and MSOP-8 (Exposed Pad) Packages APPLICATIONS Portable Systems Wireless Handsets Mobile Phone Handheld Computers PDAs GPS MARCH 27 REV. C. 2
.3W Fully Differential PACKAGE/ORDERING INFORMATION MODEL SGM4895 PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER TDFN-3 3-8L -4 to +85 SGM4895YDB8/TR MSOP-8 (Exposed Pad) NOTE: XXXXX = Date Code and Vendor Code. -4 to +85 SGM4895YPMS8/TR PACKAGE MARKING SGM 4895DB XXXXX SGM4895 YPMS8 XXXXX PACKING OPTION Tape and Reel, 3 Tape and Reel, 4 Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Supply Voltage... 6V Input Voltage Range... -.3V to (V +) +.3V Junction Temperature... +5 Storage Temperature Range... -65 to +5 Lead Temperature (Soldering, s)... +26 ESD Susceptibility HBM... 2V MM... 4V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range... 2.5V to 5.5V Operating Temperature Range... -4 to +85 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. PIN CONFIGURATIONS (TOP VIEW) (TOP VIEW) SHDN 8 VO2 SHDN 8 VO2 Bypass IN2 2 3 GND 7 6 GND V + Bypass IN2 2 3 GND 7 6 GND V + IN 4 5 VO IN 4 5 VO TDFN-3 3-8L MSOP-8 (Exposed Pad) MARCH 27 2
.3W Fully Differential ELECTRICAL CHARACTERISTICS (The following AC specifications apply for 8Ω load, A V = V/V, T A = +25, unless otherwise specified.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V + 2.5 5.5 V Shutdown Current I SD V IN = V, V SHDN = GND. μa Output Offset Voltage Quiescent Power Supply Current V OS I Q V IN = V, V SHDN = V + = 5.V - 2.5 V IN = V, V SHDN = V + = 3.3V - 2. V IN = V, V SHDN = V + = 2.6V 2. V IN = V, I O = A, V SHDN = V + V + = 5.V, No Load 4.7 7.5 V + = 5.V, 8Ω Load 4.75 8. V + = 3.3V, No Load 3.87 5.8 V + = 3.3V, 8Ω Load 3.9 6. V + = 2.6V, No Load 3.2 V + = 2.6V, 8Ω Load 3.22 Shutdown Voltage Input High V SDIH.2 Shutdown Voltage Input Low V SDIL.4 Output Power (8Ω) Output Power (4Ω) P O P O f = khz THD+N = % f = khz THD+N = % f = khz THD+N = % SGM4895YDB8 only f = khz THD+N = % SGM4895YDB8 only V + = 5.V.3 V + = 3.6V.65 V + = 3.V.45 V + = 2.6V.34 V + = 5.V.6 V + = 3.6V.82 V + = 3.V.55 V + = 2.6V.42 V + = 5.V.6 V + = 3.6V. V + = 3.V.65 V + = 2.6V.5 V + = 5.V 2.2 V + = 3.6V.25 V + = 3.V.85 V + = 2.6V.6 Total Harmonic Distortion + Noise THD+N P O =.6Wrms, f = khz, V + = 5.V.5 % () (2) Power Supply Rejection Ratio PSRR f = 27Hz f = khz V + = 5.V -83 V + = 3.6V -8 V + = 3.V -73 V + = 2.6V -65 V + = 5.V -83 V + = 3.6V -8 V + = 3.V -73 V + = 2.6V -65 Common Mode Rejection Ratio (2) CMRR f = 27Hz, V CM = 2mV P-P, V + = 5.V -76 db Wake-Up Time T WU C B = μf NOTES:. Ω terminated input. 2. PSRR and CMRR are affected by the matching between gain-setting resistor ratios. V + = 5.V 5 V + = 3.6V 42 V + = 3.V 37 V + = 2.6V 32 mv ma V W W db ms MARCH 27 3
.3W Fully Differential TYPICAL PERFORMANCE CHARACTERISTICS At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted. THD+N (%). V + = 5.V THD+N vs. Output Pow er THD+N (%). V + = 3.6V THD+N vs. Output Pow er........ THD+N (%). V + = 3.V THD+N vs. Output Pow er THD+N (%). V + = 2.6V THD+N vs. Output Pow er.........8 Pow er Dissipation vs. Output Pow er.4 Pow er Dissipation vs. Output Pow er Power Dissipation (W).6.4.2 THD+N %.2.4.6.8.2.4 V + = 5.V Power Dissipation (W).3.2 V + = 3.6V. THD+N %..2.3.4.5.6.7.8 MARCH 27 4
.3W Fully Differential TYPICAL PERFORMANCE CHARACTERISTICS (continued) At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted..3 Pow er Dissipation vs. Output Pow er.2 Pow er Dissipation vs. Output Pow er Power Dissipation (W).2 V. + = 3.V THD+N %..2.3.4.5.6 Power Dissipation (W).5. V + = 2.6V.5 THD+N %..2.3.4.5-4 Pow er Supply Rejection Ratio vs. Frequency -4 Pow er Supply Rejection Ratio vs. Frequency -6-6 PSRR (db) -8 PSRR (db) -8 - V + = 5.V, Input Ω Terminated 2mV P-P -2.. Frequency (khz) - V + = 3.V, Input Ω Terminated 2mV P-P -2.. Frequency (khz) -2 Common Mode Rejection Ratio vs. Frequency THD+N vs. Frequency -4 CMRR (db) -6-8 V + = 5.V, - Input Ω Terminated 2mV P-P -2.. Frequency (khz) THD+N (%).. V + = 5.V, P O = 6mW No filters... Frequency (khz) MARCH 27 5
.3W Fully Differential TYPICAL PERFORMANCE CHARACTERISTICS (continued) At T A = +25, A V =, f = khz, C B = µf, unless otherwise noted. Dropout Voltage (V).5.4.3.2. Clipping (Dropout) Voltage vs. Supply Voltage Top Bottom Output Power (W) 2.5 2.5.5 Output Pow er vs. Supply Voltage THD+N = % THD+N = % 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) Output Power (W) Output Pow er vs. Supply Voltage 2.5 R L = 4Ω 2 THD+N = %.5 THD+N = %.5 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) Power Dissipation (W).6.4.2 Pow er Dissipation vs. Output Pow er.8 V + = 5.V R L = 4Ω.6 THD+N %.4.5.5 2 MARCH 27 6
.3W Fully Differential TYPICAL APPLICATIONS R F To Battery C S µf V + Differential Audio Input C I.39µF V IH To External Power Supply or Control I/O VIL C I.39µF R I kω SHDN C Bypass B µf (Optional) R I IN IN 2 Bias Circuitry V + /2 _ + + _ V O V O2 GND R F NOTE: A kω resistor must be serially connected to SHDN pin. Figure. Typical Differential Input Application Schematic MARCH 27 7
.3W Fully Differential TYPICAL APPLICATIONS (continued) R F To Battery C S µf V + Audio Input C I.39µF To External Power V IH Supply or Control I/O VIL C I.39µF R I kω SHDN C Bypass B µf (Optional) R I IN IN 2 Bias Circuitry V + /2 _ + + _ V O V O2 GND R F NOTE: A kω resistor must be serially connected to SHDN pin. Figure 2. Single-Ended Input Application Schematic MARCH 27 8
.3W Fully Differential APPLICATION NOTES PCB Design Recommendations (Thermal Design Considerations) With proper thermal design considerations, SGM4895YDB8 is capable of delivering.6w of continuous average power into a 4Ω load at 5V power supply. Thermal Land The TDFN-3 3-8L thermal land is a metal (normally copper) region centrally located under the package and on top of the PCB. It has a rectangular or square shape and should match the dimensions of the exposed pad on the bottom of the package (: ratio). For certain high power applications, the PCB land may be modified to a "dog bone" shape that enhances thermal performance. The packages used with the "dog bone" lands will be a dual inline configuration (see Figure 3). Top View Figure 3. Dog Bone Thermal Vias Thermal vias are necessary. They conduct heat from the exposed pad of the package to the ground plane. The number of vias is application specific and is dependent upon electrical requirements and power dissipation. The via diameter should be.2mm to.33mm with oz. copper via barrel plating. It is important to plug the via to avoid any solder wicking inside the via during the soldering process. The thermal vias can be tented with solder mask on the top surface of the PCB. The solder mask diameter should be at least 75microns (or 3mils) larger than the via diameter. The solder mask thickness should be the same across the entire PCB. A package thermal performance may be improved by increasing the number of vias. MARCH 27 9
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-3 3-8L D e N8 k D E E L N4 b N TOP VIEW BOTTOM VIEW 2.3 A.5 2.725 A A2.675 SIDE VIEW.24.65 RECOMMENDED LAND PATTERN (Unit: mm) Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A.7.8.28.3 A..5..2 A2.23 REF.8 REF D 2.9 3..4.22 D 2.2 2.4.87.94 E 2.9 3..4.22 E.4.6.55.63 k.2 MIN.8 MIN b.8.3.7.2 e.65 TYP.26 TYP L.375.575.5.23 TX58.
PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS MSOP-8 (Exposed Pad) D.8 E E E2.55 4.8 b e.2.4.65 RECOMMENDED LAND PATTERN (Unit: mm) D L A A A2 c θ Symbol Dimensions In Millimeters Dimensions In Inches MIN MAX MIN MAX A.82..32.43 A.2.5..6 A2.75.95.3.37 b.25.38..5 c.9.23.4.9 D 2.9 3..4.22 D.7.9.67.75 e.65 BSC.26 BSC E 2.9 3..4.22 E 4.75 5.5.87.99 E2.45.65.57.65 L.4.8.6.3 θ 6 6 TX6.
PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 P W Q Q2 Q Q2 Q Q2 B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P A K Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W A B K P P P2 W Pin Quadrant TDFN-3 3-8L 3 2.4 3.35 3.35.3 4. 8. 2. 2. Q MSOP-8 (Exposed Pad) 3 2.4 5.2 3.3.5 4. 8. 2. 2. Q DD TX.
PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 3 386 28 37 5 DD2 TX2.