Lithography in our Connected World SEMI Austin Spring Forum TOP PAN P R INTING CO., LTD MATER IAL SOLUTIONS DIVISION
Toppan Printing Co., LTD A Broad-Based Global Printing Company Foundation: January 17, 1900 Headquarters: Tokyo, Japan President & CEO: Shingo Kaneko Employees: 47,872 Net Sales: $18.7B 2 Toppan Photomasks, Inc. - Company Confidential and Proprietary
Why are we here? Large Hadron Collider CMS detector 12,500 tons; 300 feet below ground Giant tools reveal tiny things BUT Giant tools are VERY EXPENSIVE Source: CERN
How long will we be here? Should we assume: Gordon didn t think we d be here? After 2011 the party s over? Photons are out of energy? EUV will save the day? What do we know: Gordon was RIGHT! Intel XEON - 2.6B transistors Made its debut in 2011 The past was a blast! The future is bright! Source: Gordon Moore, circa 1965
Lithography Innovation Projection system s resolution l RB OPC R=k 1 NA PSM 365nm SMO Multiple Patterning MB OPC OAI 248nm 193nm ILT 13.5nm Immersion 1990 1995 2000 2005 2010 2015 2020 5
The Future is BRIGHT!!! Yeah, BRIGHT but, for who for me??? 6
Semiconductor Content Electronic System Semiconductor Content 30% 25% 20% 15% 10% 5% 0% 1980-1984 1985-1989 1995-1999 2000-2004 2005-2009 2010-2014 2014-2019 Source: ST, TI, IC Insights Year 7
Semiconductor Content? Hey, where s my semi-conductor content? The telephone circa 1969 Call home from Woodstock? The telephone circa 1985 New Coke? Bad idea! The sleek mobile circa 2013 Lots of semiconductor content! Why call? Just text or e-mail. Photos courtesy of Bing/Getty Images and are property of their respective owners
Electronic Systems: Look at all this stuff!!! Semiconductor Business Display Business LSI Image Sensor Liquid Crystal Display LSI Design Photomasks On Chip Color Filters Color Filters Anti-reflection Films Printed Wiring Boards FC-BGA Substrates Lead Frames Touch Panel Touch Sensors Functional Product and Energy Related Business Lithium-ion battery packaging materials Transparent Barrier Film: GL Film Solar Cell Back Sheet Source: Toppan Material Solutions Division
Design Cost Scaling, Cost Recovery Design costs increase every node: Fewer can afford these costs Each node fewer designs are likely What makes economic sense? Who can afford/recover these costs? What applications will be supported? Source: IBS
Traditional cost reduction efforts will be repeated in future nodes Early adopters will pay a higher price, enabling a few more to follow
Process Development Cost, Sharing Needed! As fewer can afford the costs more will join together to keep driving Moore s Law
TOPPAN service examples Project TOPPAN service Business Impact Multi-project wafer for R&D group Thin film resistor for analog customers OPC for Leading Edge Digital CMOS Variable Edge Profiles for photonics TOPPAN tape-out services Reduced placement error TOPPAN mask optimization Improve CD Uniformity Refine mask characterization TOPPAN opc services OPC model creation Illumination optimization TOPPAN mask customization Grey scale masks Lowered overall cost Increased learning cycles and reduced time to market Reduced process complexity Reduced cycle time Improved bin yield Improved ASP Reduced product cycle time Reduced overall cost to manufacture Simplified process / Eliminated steps Improved yield Not everyone is busy developing 22nm and beyond Many are pushing existing lithography & process equipment as far as it will go Newer techniques applied to 365nm/248nm platforms provide significant advances One can re-engineer to get the most bang from the bucks already spent 13
Lithography-Enabled Technologies
Display Technology The digital micro-mirror device originally invented at Texas Instruments - 1987 Hyper Amorphous Si Technology 458 pixels per inch, Full 4K (HD) Photos courtesy of Bing/Getty Images and are property of their respective owners CRT s are a thing of the past!
On Chip Color Filters (CFA) On-chip color filter is indispensable for CCD and CMOS image sensors for small size display devices to provide color images. Color filter of red, green and blue (RGB) is directly formed on each of the phototransistors generated on a silicon wafer. Toppan's OCF has won a high reputation for its own color reproduction and fine fabrication technologies developed by printing technology. Toppan is a pioneer in CFA & MLA fields - 16 -
Flip Chip BGA (Ball Grid Array) Semiconductor package-related products play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards. Packaging substrates for flip chip (FC) with multi-pin, high-density functions required in ASICs, CPUs, and GPUs. Supports lead- and halogen-free mounted packaging substrates. Console Game Substrates Embedded Capacitor Embedded EWLP Coreless Substrates - 17 -
Enabled Technologies Also include: Touch Sensors (Cu- Film / ITO) Silicon PV MEMS: accelerometers, gyro s Anti-Reflection (AR) films the list goes on and on
In Conclusion The Semi-Conductor Lithography Roadmap Continues The future is BRIGHT! Industry experts forecast revenue growth / industry expansion in coming years Semiconductor content in Electronic Systems will continue to grow Progress at the leading edge spawns economically viable technologies that solve other, novel problems Display CRT s are virtually gone, DLP/TFT etc will continue to improve and grow (and shrink) On-Chip Color Filter Digital Imaging and Image Sensors have replaced traditional photography/sensing Electronic Packaging wire bonding replaced by Flip Chip (FC-BGA), Wafer-Level Packaging (WLP) Touch Sensors How we interact with our Electronics Systems is changing We just might be here for many years to come!