From Possible to Practical The Evolution of Nanoimprint for Patterned Media Paul Hofemann March 13, 2009
HDD Areal Density Industry Roadmap 10,000 Media Technology Roadmap Today Areal Density (Gbit/in 2 ) 1,000 100 10 N S Discrete Track Bit Patterned Perpendicular Recording Bit Patterned S BPM- 25nm half pitch 1 S N N N S 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2
HDD Industry Is Now Leading the ITRS Lithography Resolution Roadmap 200 HDD TFH Today Resolution (nm) 100 80 60 40 30 NAND FLASH Patt. Media 20 02 03 04 05 06 07 08 09 10 11 12 13 14 and must accomplish this at a fraction of the cost! 3 Sources: ITRS Roadmap (FLASH) ; Tom Coughlin Assoc. May 08 (TFH)
What is Different About This Transition? Requires lithography beyond the most aggressive International Technology for Semiconductors (ITRS) roadmap Introduces processes (e.g., litho and etch) that are not currently in the disk media production fabs Requires equipment innovations, process integration during actual HDD device development. Tool specification requirements are evolving. 4
Disk Media Manufacturing Process Flow Wash Sputter COC Lube Burnish Flight Test Manufacturing Flow Wash Planarization Imprint Coating Resist Strip Imprint Etch Today s Unpatterned Media: $4 to $6/disk Patterned Media Added Cost: $1 to $2/disk 5
Nanoimprint Lithography Entering New Phase In Preparation for High Volume Manufacturing 2005-2008 Technical Feasibility Sub-20nm resolution demonstrated Discrete Track and Bit Patterned Supports areal densities beyond 1 Tb/in 2 2009-2010 Manufacturing Readiness Process stability (repeatability, reproducibility) NIL system production robustness Cost of Ownership requirements Throughput, footprint, consumables, defects Pilot-Line learning Process Integration (coaters, cleaners, NIL, etch, other) Yield learning and control Patterned Media fab layout, efficiency, automation Cover Picture: Molecular Imprints Imprio HD2200 2010-2011 Begin Manufacturing Adoption 6
OEM Roadmaps Must Align With Industry Transition Patterned Media Adoption versus Capital Equipment 7
Nanoimprint S-FIL Aligned to HDD Industry s Patterned Media Adoption Timeline Patterned Media Adoption versus Capital Equipment Imprio 1100 10 Tools Sold To HDD Industry Imprio HD2200 Future HVM 8
S-FIL Technology Inkjet Dispense 9
S-FIL Technology Template Contacts Resist 10
S-FIL Technology Capillary Forces Fill Template 11
S-FIL Technology Resist Exposure 12
S-FIL Technology Template Separation 13
14 Drop-on-Demand Enables Pattern Transfer Fidelity
Pattern Transfer for DTM and BPM Discrete Track Structures Imprint CD: 36.2 ± 1.1 nm LWR (3σ): 2.9 nm Descum 34.6 ± 1.4 nm 2.5 nm Oxide Etch 34.7 ± 1.0 nm 2.8 nm Clean 36.7 ± 1.4 nm 2.9 nm Bit Patterned Structures 25 nm half pitch Imprinted Pillars 15
Patterned Media Imprint Examples DTR - 50nm half pitch Servo Patterns BPM - 25nm half pitch Resist Pillars 16
Nanoimprint Demonstrated Technical Ability to 2.5nm Imprint lithography resolution is ultimately determined by the resolution on the template Current emphasis on developing a Manufacturing Solution 2.4nm carbon nanotube is adhered to a template Imprint clearly shows the replication of the CNT feature 17 Source J. A. Rogers F. Hua, Y. Sun, A. Gaur, M. A. Meitl, L. Bilhaut, L. Rotkina, J. Wang, P. Geil, M. Shim, and, Nanoletters, Vol. 4, No. 12, 2467-2471, 2004
Transitioning from R&D to Pilot-lines 2 nd Generation S-FIL Nanoimprint 2009-2010 Process stability Repeatability and reproducability NIL system production robustness Cost of Ownership requirements Throughput, footprint, consumables, defects Pilot-Line learning HD2200 Double-Sided 180 disks/hour Process Integration (ie., coaters,cleaners,nil,etch) Yield learning and control Fab layout, efficiency, automation 18
High Throughput Double-Sided Patterning Robot Cassettes Templates GUI HD2200 19 Note: Timing and sequencing is an illustration only
Video of 2 nd Generation HDD Nanoimprint System HD2200
Pilot-Lines Require a Focus on Tool Robustness Early Imprio 1100 Failure Pareto Early Imprio HD2200 IRONMAN # Failures # Jobs Requested (each job is ~12hr run) Imprio HD2200 Alpha System Week MII has implemented re-design and/or OEM solutions to address these reliability issues IRONMAN testing expanded to include some installed base tools. 21
Defect Learning Is A Major Focus of Pilot Lines Large Effort Underway To Fully Understand Nanoimprint Defectivity Defect Class Observation Examples Wafer Template Repeater Disk 22 Examples Only
Some Particles on the Template Get Removed During Normal Imprint 1 st st Imprint 2 nd Imprint 3 rd rd Imprint 30um 5 um Particles on template cause repeating defects, but often not permanent 4 th th Imprint 23
24 If Required to Remove Stubborn Particles, Cleaning Does Not Appear to Harm the Template
3 rd Generation Tool Will Focus on Cost of Ownership and Clean Room Footprint 300dph-400dph Disks Per Hour (Double-Sided) 1x HVM = 2x HD2200 = 11x Imprio 1100 3 rd Gen 1 st Gen HVM I-1100 2 nd Gen HD2200 25 Productivity Increase With Each Generation
Lower CoO Roadmap with Each Generation MII HDD Platform Total CoO ($ s/disk) $2.63 1 st Gen (I-1100) $0.84 2 nd Gen (HD2200) <$0.35 3 rd Gen (HVM) CoO Includes: Tool Capital Footprint Uptime Yield Consumables $0.49 Resist Gases Light Source Adhesion Deposition 26 Note: Provided as estimates only
Master and Working Replicate Templates Standard 6-inch round fused silica substrate Rotary e-beam generates master patterned template Imprint lithography transfers pattern to working replicates Fully Patterned DTR Template (Before metal layer Strip) Commercial mask shops ideally suited for this role 27
Master and Working Replicate Templates One Master 10,000 Template Replicates 100 million disks Rotary E-beam Writer NIL - Template Replicator NIL - Disks HD2200 TR1100 One master by rotary-stage e- beam writer Replicate master into working replicas Each working replica template imprints 10,000 disks 28
Supply Chain Coordination and Collaboration is Required Template Supply Other Materials Supplier Interaction Yield Mgmt New chemicals Std cassettes Std SMIF pods Automation protocol Coupled processes: Imprint coating Imprint lithography Etch Defect detection & classification gaps Implementation strategy (i.e., binning, process monitoring) 29
2009-2010 Pilot Lines Will Be Busy! Process refinement and integration will require close collaboration with OEM/HDD Manufacturers Increased focus on integration, cost of ownership and yield More manufacturing personnel are getting involved good sign! HDD manufacturers picking areal density points for first pattern media products New litho/etch talent will be appearing in media fabs 30
Hard Disk Drive Industry Driving Areal Density and Lithography! Global demand for digital storage will continue to motivate the HDD industry s areal density progress Patterned media provides technical roadmap beyond 1 Tb/in 2 Imprint lithography enables remarkable sub-20nm resolution at extraordinary low cost Nanoimprint Lithography is evolving from Possible to Practical with it s 3 rd generation tool 31