Base part number Package Type IRFP4137PbF TO-247AC Tube 25 IRFP4137PbF

Similar documents
Base part number Package Type Standard Pack Orderable Part Number. IRFP7530PbF TO-247 Tube 25 IRFP7530PbF I D, T J = 25 C 50

StrongIRFET IRFB7546PbF

Orderable Part Number IRFP4768PbF TO-247AC Tube 25 IRFP4768PbF

StrongIRFET IRL40B215

StrongIRFET IRFB7740PbF

Base Part Number Package Type Standard Pack Orderable Part Number. IRFP3006PbF TO-247 Tube 25 IRFP3006PbF

StrongIRFET IRL60B216

Ordering Information Base part number Package Type Standard Pack Complete Part Form Quantity Number IRFB7437PbF TO-220 Tube 50 IRFB7437PbF

IR MOSFET StrongIRFET IRFP7718PbF

Base Part Number Package Type Standard Pack Orderable Part Number

FASTIRFET IRFHE4250DPbF

Easier Manufacturing RoHS Compliant Containing no Lead, no Bromide and no Halogen

100% Rg tested Increased Reliability. Easier Manufacturing RoHS Compliant Containing no Lead, no Bromide and no Halogen

SMPS MOSFET. V DSS R DS(on) typ. Trr typ. I D. 600V 385mΩ 130ns 15A

Ordering Information Base Part Number Package Type Standard Pack Complete Part Number 500 I D = 100A T J = 125 C 200 I D,

IR MOSFET StrongIRFET IRF60R217

IR MOSFET StrongIRFET IRL40SC228

Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IR MOSFET StrongIRFET IRF60B217

P C = 100 C Power Dissipation Linear Derating Factor

V DSS R DS(on) max Qg (typ.) 30V GS = 10V 57nC

Absolute Maximum Ratings

V DSS. 40V 1.5mΩ 2.0mΩ 250Ac 195A. R DS(on) typ. max. I D (Silicon Limited) I D (Package Limited) HEXFET Power MOSFET

SMPS MOSFET HEXFET Power MOSFET. V DSS R DS(on) max I D. 320 P C = 25 C Power Dissipation 260 Linear Derating Factor.

AUTOMOTIVE GRADE. Tube 50 AUIRFS3004-7P Tape and Reel Left 800 AUIRFS3004-7PTRL

IRFR3806PbF IRFU3806PbF

TO-220AB IRFB4410. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 19

IRFR1018EPbF IRFU1018EPbF

IRLS3034PbF IRLSL3034PbF

SMPS MOSFET. V DSS R DS(on) max I D

AUIRLS3034-7P AUTOMOTIVE GRADE. HEXFET Power MOSFET

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 5.3

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 23. V/ns T J. mj I AR

Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

Lower Conduction Losses Low Thermal Resistance to PCB ( 0.5 C/W)

IRFB3507PbF IRFS3507PbF IRFSL3507PbF

AUTOMOTIVE GRADE. Tube 50 AUIRFS4115-7P Tape and Reel Left 800 AUIRFS4115-7TRL

SMPS MOSFET. V DSS R DS(on) max I D

IRF6215PbF HEXFET Power MOSFET

AUIRF1324S-7P AUTOMOTIVE GRADE

IRFS4127PbF IRFSL4127PbF

IRLR8726PbF IRLU8726PbF

IRLR8729PbF IRLU8729PbF HEXFET Power MOSFET

V DSS R DS(on) max Qg. 30V 4.8m: 15nC

T J = 25 C (unless otherwise specified) Symbol Parameter Min. Typ. Max. Units V (BR)DSS DraintoSource Breakdown Voltage 24 V V (BR)DSS / T J

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

Approved (Not Released) V DSS R DS(on) max Qg. 30V 3.5mΩ 36nC

IRLB8721PbF. V DSS R DS(on) max Qg (typ.) 30V GS = 10V 7.6nC. HEXFET Power MOSFET. Applications. Benefits. Absolute Maximum Ratings

TO-220AB IRFB3307. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 11. V/ns T J Operating Junction and -55 to

IRLS3036PbF IRLSL3036PbF HEXFET Power MOSFET

40V V DSS. R DS(on) typ. I D (Silicon Limited) I D (Package Limited) 409Ac 195A. HEXFET Power MOSFET

IRFS3004-7PPbF HEXFET Power MOSFET

V DSS. W/ C V GS Gate-to-Source Voltage ±30 E AS (Thermally limited) mj T J Operating Junction and -55 to + 175

SMPS MOSFET. V DSS R DS(on) typ. Trr typ. I D. 500V 0.125Ω 170ns 34A

IRF6668PbF IRF6668TRPbF

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 27

TO-220AB IRFB4610. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 7.6

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 13

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery e 26

1412 P C = 25 C Maximum Power Dissipation 300 Linear Derating Factor. V/ns T J. Thermal Resistance Symbol Parameter Typ. Max.

IRFP450LC PD HEXFET Power MOSFET V DSS = 500V. R DS(on) = 0.40Ω I D = 14A

IRFP2907PbF. HEXFET Power MOSFET V DSS = 75V. R DS(on) = 4.5mΩ I D = 209A. Typical Applications. Benefits

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

120 P C = 25 C Power Dissipation 360 P C = 100 C Power Dissipation Linear Derating Factor

D 2 Pak TO

AUIRLS3034 AUTOMOTIVE GRADE. HEXFET Power MOSFET

W/ C V GS Gate-to-Source Voltage ± 30 dv/dt Peak Diode Recovery e 57

SMPS MOSFET. V DSS R DS(on) max I D

IRF6641TRPbF DIGITAL AUDIO MOSFET. Key Parameters V DS 200 V R DS(ON) V GS = 10V 51 m Qg typ. 34 nc R G(int) typ. 1.0

Lower Conduction Losses

V DSS R DS(on) max Qg 30V GS = 10V 5.4nC

SMPS MOSFET. V DSS Rds(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D

W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 14. V/ns T J. mj I AR. Thermal Resistance Symbol Parameter Typ. Max.

IRF7341. HEXFET Power MOSFET V DSS = 55V. R DS(on) = 0.050Ω

V DSS. 40V R DS(on) typ. 1.4mΩ max. 1.8mΩ 250Ac. I D (Silicon Limited) I D (Package Limited) 195A. HEXFET Power MOSFET.

PRELIMINARY. C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

SMPS MOSFET. V DSS R DS(on) max I D

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

IRFB260NPbF HEXFET Power MOSFET

IRF530N PD HEXFET Power MOSFET V DSS = 100V. R DS(on) = 0.11Ω I D = 15A PRELIMINARY

Description Absolute Maximum Ratings Parameter Max. Units Thermal Resistance Parameter Typ. Max. Units

AUTOMOTIVE GRADE. Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 2.2 R JA Junction-to-Ambient ( PCB Mount) 50 C/W

W/ C V GS Gate-to-Source Voltage ±20 dv/dt Peak Diode Recovery f 4.6. V/ns T J. mj I AR. Avalanche Current d A See Fig. 14, 15, 22a, 22b, E AR

IRFR24N15DPbF IRFU24N15DPbF

SMPS MOSFET. V DSS R DS(on) max I D

SMPS MOSFET. V DSS R DS(on) max I D

IRFI4212H-117P. Description. Key Parameters g V DS 100 V R DS(ON) 10V 58 m: Q g typ. 12 nc Q sw typ. 6.9 nc R G(int) typ. 3.

TO-220AB IRFB4310. W/ C V GS Gate-to-Source Voltage ± 20 dv/dt Peak Diode Recovery f 14

IRFB4020PbF. Key Parameters V DS 200 V R DS(ON) 10V 80 m: Q g typ. 18 nc Q sw typ. 6.7 nc R G(int) typ. 3.2 Ω T J max 175 C

SMPS MOSFET. V DS 200 V V DS (Avalanche) min. 260 V R DS(ON) 10V 54 m: T J max 175 C TO-220AB. IRFB38N20DPbF

W/ C V GS Gate-to-Source Voltage ±16 dv/dt Peak Diode Recovery f 8.0. V/ns T J. mj I AR. Avalanche Current d A See Fig. 14, 15, 22a, 22b E AR

V DSS R DS(on) max I D

C Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Mounting Torque, 6-32 or M3 screw 1.1 (10) N m (lbf in)

IRFS3107PbF IRFSL3107PbF HEXFET Power MOSFET

AUTOMOTIVE GRADE. Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 1.32 R JA Junction-to-Ambient ( PCB Mount) 50 C/W

C Soldering Temperature, for 10 seconds 300 (1.6mm from case )

IRFR3709ZPbF IRFU3709ZPbF

AUTOMOTIVE GRADE. Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case) 300

Transcription:

IRFP437PbF pplication High Efficiency Synchronous Rectification in SMPS Uninterruptible Power Supply High Speed Power Switching Hard Switched and High Frequency Circuits G D HEXFET Power MOSFET V DSS R DS(on) typ. max 300V 56m 69m S I D 38 Benefits Improved Gate, valanche and Dynamic dv/dt Ruggedness Fully Characterized Capacitance and valanche SO Enhanced body diode dv/dt and di/dt Capability Lead-Free, RoHS Compliant S D G TO-247C G D S Gate Drain Source Standard Pack Orderable Part Number Base part number Package Type Form Quantity IRFP437PbF TO-247C Tube 25 IRFP437PbF Parameter Max. Units I D @ T C = 25 C Continuous Drain Current, V GS @ V 38 I D @ T C = 0 C Continuous Drain Current, V GS @ V 27 I DM Pulsed Drain Current 52 P D @T C = 25 C Maximum Power Dissipation 34 W Linear Derating Factor 2.3 W/ C V GS Gate-to-Source Voltage ± 20 V dv/dt Peak Diode Recovery dv/dt 8.9 V/ns T J Operating Junction and -55 to + 75 T STG Storage Temperature Range C Soldering Temperature, for seconds 300 (.6mm from case) Mounting Torque, 6-32 or M3 Screw lbf in (. N m) valanche Characteristics E S (Thermally limited) Single Pulse valanche Energy 54 mj Thermal Resistance Parameter Typ. Max. Units R JC Junction-to-Case 0.44 R CS Case-to-Sink, Flat Greased Surface 0.24 C/W R J Junction-to-mbient 40 www.irf.com 202 International Rectifier October 30, 202

IRFP437PbF Static @ (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions V (BR)DSS Drain-to-Source Breakdown Voltage 300 V V GS = 0V, I D = 250µ V (BR)DSS / T J Breakdown Voltage Temp. Coefficient 0.24 V/ C Reference to 25 C, I D = 3.5m R DS(on) Static Drain-to-Source On-Resistance 56 69 m V GS = V, I D = 24 V GS(th) Gate Threshold Voltage 3.0 5.0 V V DS = V GS, I D = 250µ I DSS Drain-to-Source Leakage Current 20 V DS =300 V, V GS = 0V µ 250 V DS =300V,V GS = 0V,T J =25 C Gate-to-Source Forward Leakage 0 V GS = 20V I GSS n Gate-to-Source Reverse Leakage -0 V GS = -20V R G Gate Resistance.3 Dynamic Electrical Characteristics @ (unless otherwise specified) gfs Forward Transconductance 45 S V DS = 50V, I D =24 Q g Total Gate Charge 83 25 I D = 24 Q gs Gate-to-Source Charge 28 42 nc V DS = 50V Q gd Gate-to-Drain Charge 26 39 V GS = V t d(on) Turn-On Delay Time 8 V DD = 95V t r Rise Time 23 I D = 24 ns t d(off) Turn-Off Delay Time 34 R G = 2.2 t f Fall Time 20 V GS = V C iss Input Capacitance 568 V GS = 0V C oss Output Capacitance 300 V DS = 50V C rss Reverse Transfer Capacitance 77 ƒ =.0MHz pf V C oss eff.(er) Effective Output Capacitance (Energy Related) 96 GS = 0V, VDS = 0V to 240V See Fig. C oss eff.(tr) Output Capacitance (Time Related) 265 V GS = 0V, VDS = 0V to 240V Diode Characteristics I S I SM Parameter Min. Typ. Max. Units Conditions Continuous Source Current MOSFET symbol 40 (Body Diode) showing the G Pulsed Source Current integral reverse 60 (Body Diode) p-n junction diode. V SD Diode Forward Voltage.3 V,I S = 24,V GS = 0V t rr Reverse Recovery Time 302 V DD = 255V ns 379 I F = 24, Q rr Reverse Recovery Charge 739 di/dt = 0/µs nc 2497 I RRM Reverse Recovery Current 3 D S Notes: Repetitive rating; pulse width limited by max. junction temperature. Recommended max ES limit, starting, L = 2.05mH, R G = 50, I S = 24, V GS =V. I SD 24, di/dt 77/µs, V DD V (BR)DSS, T J 75 C. Pulse width 400µs; duty cycle 2%. C oss eff. (TR) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 to 80% V DSS. C oss eff. (ER) is a fixed capacitance that gives the same energy as C oss while V DS is rising from 0 to 80% V DSS. When mounted on " square PCB (FR-4 or G- Material). For recommended footprint and soldering techniques refer to application note #N-994 R is measured at T J approximately 90 C 2 www.irf.com 202 International Rectifier October 30, 202

C, Capacitance (pf) V GS, Gate-to-Source Voltage (V) I D, Drain-to-Source Current () (Normalized) I D, Drain-to-Source Current () I D, Drain-to-Source Current () IRFP437PbF 0 VGS TOP 5V V 8.0V 7.0V 6.5V 6.0V 5.5V BOTTOM 5.0V 0 VGS TOP 5V V 8.0V 7.0V 6.5V 6.0V 5.5V BOTTOM 5.0V 5.0V 5.0V 60µs PULSE WIDTH Tj = 25 C 0.0 0 V DS, Drain-to-Source Voltage (V) Fig. Typical Output Characteristics 60µs PULSE WIDTH Tj = 75 C 0 V DS, Drain-to-Source Voltage (V) Fig 2. Typical Output Characteristics 0 T J = 75 C R DS(on), Drain-to-Source On Resistance 3.5 3.0 I D = 24 V GS = V 2.5 2.0.5 V DS = 50V 60µs PULSE WIDTH 2 4 6 8 2 4 V GS, Gate-to-Source Voltage (V).0 0.5-60 -20 20 60 0 40 80 T J, Junction Temperature ( C) Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance vs. Temperature 00 0 V GS = 0V, f = MHZ C iss = C gs + C gd, C ds SHORTED C rss = C gd C oss = C ds + C gd C iss 4.0 2.0.0 I D = 24 V DS = 240V V DS = 50V VDS= 60V C oss 8.0 6.0 0 C rss 4.0 2.0 0 0.0 0 20 40 60 80 0 20 V DS, Drain-to-Source Voltage (V) Q G, Total Gate Charge (nc) Fig 5. Typical Capacitance vs. Drain-to-Source Voltage Fig 6. Typical Gate Charge vs. Gate-to-Source Voltage 3 www.irf.com 202 International Rectifier October 30, 202

V GS(th), Energy (µj) Gate threshold Voltage (V) V (BR)DSS, I D, Drain Current () I SD, Reverse Drain Current () I D, Drain-to-Source Current () IRFP437PbF OPERTION IN THIS RE LIMITED BY R DS (on) 0 T J = 75 C 0 0µsec msec V GS = 0V 0.2 0.4 0.6 0.8.0.2.4.6 V SD, Source-to-Drain Voltage (V) Tc = 25 C Tj = 75 C Single Pulse DC msec 0 V DS, Drain-to-Source Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 42 35 Drain-to-Source Breakdown Voltage (V) Fig 8. Maximum Safe Operating rea 370 Id = 3.5m 360 350 28 2 4 340 330 320 3 300 7 0 25 50 75 0 25 50 75 T C, Case Temperature ( C) 290 280 270-60 -20 20 60 0 40 80 T J, Temperature ( C ) Fig 9. Maximum Drain Current vs. Case Temperature 9.0 8.0 7.0 6.0 5.0 Fig. Drain-to Source Breakdown Voltage 6.0 5.0 4.0 4.0 3.0 2.0 3.0 2.0 ID = 250µ ID =.0m ID =.0.0 0.0-50 0 50 0 50 200 250 300 350 V DS, Drain-to-Source Voltage (V) Fig. Typical C oss Stored Energy.0-75 -25 25 75 25 75 225 T J, Temperature ( C ) Fig 2. Threshold Voltage vs. Temperature 4 www.irf.com 202 International Rectifier October 30, 202

Q RR (nc) Q RR (nc) I RRM () I RRM () IRFP437PbF Thermal Response ( Z thjc ) C/W 0.0 D = 0.50 0.20 0. 0.05 0.02 0.0 SINGLE PULSE 0.00 ( THERML RESPONSE ) Notes:. Duty Factor D = t/t2 2. Peak Tj = P dm x Zthjc + Tc 0.000 E-006 E-005 0.000 0.00 0.0 t, Rectangular Pulse Duration (sec) Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case 50 40 I F = 6 V R = 255V 60 50 I F = 24 V R = 255V 40 30 30 20 20 0 200 400 600 800 di F /dt (/µs) Fig 4. Typical Recovery Current vs. dif/dt 3500 I F = 6 V R = 255V 3000 2500 2000 500 0 200 400 600 800 di F /dt (/µs) Fig 5. Typical Recovery Current vs. dif/dt 5000 I F = 24 4500 V R = 255V 4000 3500 3000 2500 2000 500 0 200 400 600 800 0 200 400 600 800 di F /dt (/µs) di F /dt (/µs) Fig 6. Typical Stored Charge vs. dif/dt Fig 7. Typical Stored Charge vs. dif/dt 5 www.irf.com 202 International Rectifier October 30, 202

IRFP437PbF Fig 8. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET Power MOSFETs V (BR)DSS 5V tp V DS L DRIVER R G 20V tp D.U.T I S 0.0 + - V DD I S Fig 9a. Unclamped Inductive Test Circuit Fig 9b. Unclamped Inductive Waveforms Fig 20a. Switching Time Test Circuit Fig 20b. Switching Time Waveforms Vds Id Vgs Vgs(th) Qgs Qgs2 Qgd Qgodr Fig 2a. Gate Charge Test Circuit Fig 2b. Gate Charge Waveform 6 www.irf.com 202 International Rectifier October 30, 202

IRFP437PbF TO-247C Package Outline Dimensions are shown in millimeters (inches) E2/2 E 2 "" Q E2 2X D B L "" L SEE VIEW "B" 2x b2 b4 e 3x b Ø.0 2x LED TIP B c Ø P Ø.0 B -- S D THERML PD VIEW: "B" PLTING BSE METL Ø.0 E B (c) VIEW: "" - "" (b, b2, b4) SECTION: C-C, D-D, E-E TO-247C Part Marking Information Notes: This part marking information applies to devices produced after 02/26/200 EXMPLE: THIS IS N IRFPE30 WITH SSEMBLY LOT CODE 5657 SSEMBLED ON WW 35, 200 IN THE SSEMBLY LINE "H" Note: "P" in assembly line position indicates "Lead-Free" INTERNTIONL RECTIFIER LOGO SSEMBLY LOT CODE IRFPE30 35H 56 57 PRT NUMBER DTE CODE YER = 200 WEEK 35 LINE H TO-247C package is not recommended for Surface Mount pplication. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 7 www.irf.com 202 International Rectifier October 30, 202

IRFP437PbF Qualification Information Industrial Qualification Level (per JEDEC JESD47F) Moisture Sensitivity Level TO-247C N/ RoHS Compliant Yes Qualification standards can be found at International Rectifier s web site: http://www.irf.com/product-info/reliability/ pplicable version of JEDEC standard at the time of product release. Data and specifications subject to change without notice. IR WORLD HEDQURTERS: N Sepulveda., El Segundo, California 90245, US Tel: (3) 252-75 TC Fax: (3) 252-7903 Visit us at www.irf.com for sales contact information. 8 www.irf.com 202 International Rectifier October 30, 202