MC0, MC0 Single Supply Quad Operational Amplifiers The MC0 is a low cost, quad operational amplifier with true differential inputs. The device has electrical characteristics similar to the popular MC7C. However, the MC0 has several distinct advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as low as.0 V or as high as 6 V with quiescent currents about one third of those associated with the MC7C (on a per amplifier basis). The common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many applications. The output voltage range also includes the negative power supply voltage. Features Short Circuit Protected Outputs Class AB Output Stage for Minimal Crossover Distortion True Differential Input Stage Single Supply Operation:.0 V to 6 V Split Supply Operation: ±.5 V to ±8 V Low Input Bias Currents: 500 na Max Four Amplifiers Per Package Internally Compensated Similar Performance to Popular MC7C Industry Standard Pinouts ESD Diodes Added for Increased Ruggedness PbFree Packages are Available SOIC D SUFFIX CASE 75A PDIP P SUFFIX CASE 66 x = or A = Assembly Location WL = Wafer Lot YY, Y = Year WW = Work Week G = PbFree Package MARKING DIAGRAMS MCx0DG AWLYWW MCx0P AWLYYWWG PIN CONNECTIONS Single Supply.0 V to 6 V V EE, GND Split Supplies.5 V to 8 V.5 V to 8 V V EE Out Inputs Inputs 5 6 0 9 Out Inputs V EE /GND Inputs Out 7 8 Out (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Semiconductor Components Industries, LLC, 006 Publication Order Number: MC0/D
MC0, MC0 ORDERING INFORMATION MC0D MC0DG Device Package Shipping SOIC SOIC (PbFree) 55 Units / Rail MC0DR MC0DRG MC0P MC0PG MC0D MC0DG MC0DR MC0DRG SOIC SOIC (PbFree) PDIP PDIP (PbFree) SOIC SOIC (PbFree) SOIC SOIC (PbFree) 500 Tape & Reel 5 Units / Rail 55 Units / Rail 500 Tape & Reel MC0P MC0PG PDIP PDIP (PbFree) 5 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. MAXIMUM RATINGS Power Supply Voltages Single Supply Split Supplies Rating Symbol Value Unit 6, V EE ±8 Input Differential Voltage Range (Note ) V IDR ±6 Vdc Input Common Mode Voltage Range (Notes and ) V ICR ±8 Vdc Storage Temperature Range T stg 55 to 5 C Operating Ambient Temperature Range MC0 MC0 T A 0 to 85 0 to 70 Junction Temperature T J 50 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Split power supplies.. For supply voltages less than ±8 V, the absolute maximum input voltage is equal to the supply voltage. Vdc C
MC0, MC0 ELECTRICAL CHARACTERISTICS ( = 5 V, V EE = 5 V for MC0; = V, V EE = GND for MC0 T A = 5 C, unless otherwise noted.) MC0 MC0 Characteristic Symbol Min Typ Max Min Typ Max Unit Input Offset Voltage (Note ) V IO.0 0.0 8.0 0 mv Input Offset Current I IO 0 50 00 0 75 50 na Large Signal Open Loop Voltage Gain V O = ±0 V, R L =.0 k A VOL 0 5 00 0 5 00 V/mV Input Bias Current I IB 00 500 800 00 500 000 na Output Impedance f = 0 Hz z o 75 75 Input Impedance f = 0 Hz z i 0..0 0..0 M Output Voltage Range R L = 0 k R L =.0 k R L =.0 k, V O ± ±0 ±0 Input Common Mode Voltage Range V ICR V V EE ±.5 ± 0 0 V V V EE V EE.5 V.5 V V V EE Common Mode Rejection R S 0 k CMR 70 90 70 90 db Power Supply Current (V O = 0) R L = I CC, I EE.8 7.0.8 7.0 ma Individual Output ShortCircuit Current (Note ) I SC ±0 ±0 ±5 ±0 ±0 ±5 ma Positive Power Supply Rejection Ratio PSRR 0 50 0 50 V/V Negative Power Supply Rejection Ratio PSRR 0 50 0 50 V/V Average Temperature Coefficient of Input Offset Current Average Temperature Coefficient of Input Offset Voltage Power Bandwidth A V =, R L = 0 k V O = 0 V(pp), THD = 5% SmallSignal Bandwidth A V =, R L = 0 k V O = 50 mv I IO / T 50 50 pa/ C V IO / T 0 0 V/ C BWp 9.0 9.0 khz BW.0.0 MHz Slew Rate A V =, V i = 0 V to 0 V SR 0.6 0.6 V/ s Rise Time A V =, R L = 0 k V O = 50 mv t TLH 0.5 0.5 s Fall Time A V =, R L = 0 k V O = 50 mv t TLH 0.5 0.5 s Overshoot A V =, R L = 0 k V O = 50 mv os 0 0 % Phase Margin A V =, R L =.0 k, V O = 00 pf m 60 60 Crossover Distortion (V in = 0 mvpp,v out =.0 Vpp, f = 0 khz). MC0: T low = 0 C, T high = 85 C, MC0: T low = 0 C, T high = 70 C. Not to exceed maximum package power dissipation..0.0 %
MC0, MC0 ELECTRICAL CHARACTERISTICS ( = 5.0 V, V EE = GND, T A = 5 C, unless otherwise noted.) Characteristic Symbol MC0 MC0 Min Typ Max Min Typ Max Input Offset Voltage V IO.0 0 0 mv Input Offset Current I IO 0 50 75 na Input Bias Current I IB 00 500 500 na Large Signal Open Loop Voltage Gain R L =.0 k Unit A VOL 0 00 0 00 V/mV Power Supply Rejection Ratio PSRR 50 50 V/V Output Voltage Range (Note 5) V OR V pp R L = 0 k, = 5.0 V..5..5 R L = 0 k, 5.0 0 V.0.7.0.7 Power Supply Current I CC.5 7.0.5 7.0 ma Channel Separation f =.0 khz to 0 khz (Input Referenced) 5. Output will swing to ground with a 0 k pull down resistor. CS 0 0 db Q0 Q9 Q8 Q7 Q6 Output Bias Circuitry Common to Four Amplifiers Q7 Q 5.0 pf k 0 k Q8 Q9 Q Q5 Inputs Q Q Q Q5 Q6.0 k Q9 7 k Q Q 5 Q Q0 Q Q Q Q5 60 k Q7 Q8 Q0. k V EE (GND) Figure. Representative Schematic Diagram (/ of Circuit Shown)
MC0, MC0 PACKAGE DIMENSIONS SOIC CASE 75A0 ISSUE H T SEATING PLANE A 8 G 7 B P 7 PL 0.5 (0.00) M B M NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.5M, 98.. CONTROLLING DIMENSION: MILLIMETER.. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.. MAXIMUM MOLD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.7 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS INCHES C R X 5 F DIM MIN MAX MIN MAX A 8.55 8.75 0.7 0. B.80.00 0.50 0.57 C.5.75 0.05 0.068 D 0.5 0.9 0.0 0.09 D PL K M J F 0.0.5 0.06 0.09 G.7 BSC 0.050 BSC 0.5 (0.00) M T B S A S J 0.9 0.5 0.008 0.009 K 0.0 0.5 0.00 0.009 M 0 7 0 7 P 5.80 6.0 0.8 0. R 0.5 0.50 0.00 0.09 SOLDERING FOOTPRINT* X 0.58 7X 7.0 X.5.7 PITCH DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 8