High Data Rate Characterization Report

Similar documents
High Speed Characterization Report

High Data Rate Characterization Report

High Data Rate Characterization Report

High Data Rate Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Competitive Comparison Report. Samtec MMCX-J-P-H-ST-TH1 Mated With MMCX-P-P-H-ST-TH1 Competitor A (Mated Set) Competitor B (Mated Set)

High Speed Characterization Report

SPICE Model Validation Report

High Speed Characterization Report

High Speed Characterization Report

EQCD High Speed Characterization Summary

High Speed Characterization Report. Contact Plating Effects on Signal Integrity Gold on Post / Gold on Tail vs. Gold on Post / Matte Tin on Tail

High Speed Characterization Report

High Speed Characterization Report

RF Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

High Speed Characterization Report

Tektronix Inc. DisplayPort Standard. Revision Tektronix MOI for Cable Tests (DSA8200 based sampling instrument with IConnect software)

Validation Report Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS

VHDM & VHDM-L Series. High Speed. Electrical Characterization

Line Impedance Analyzer TDR 3000

Shielding Effectiveness Report

Aries QFP microstrip socket

Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch

Aries Kapton CSP socket

Test ID 5-15 Utility Line Impedance Test Procedures Guide

Improving TDR/TDT Measurements Using Normalization Application Note

Characterization Methodology for High Density Microwave Fixtures. Dr. Brock J. LaMeres, Montana State University

3M Shielded Controlled Impedance (SCI) Latch/Eject Header 2 mm Development Kit Instructions

Design and experimental realization of the chirped microstrip line

Samtec MODS-LJ Series (LIFEJACK ) Category 5/5e Qualification

Shielding Effectiveness Report HQDP

Shielding Effectiveness Report HQCD

Report. Description: High Phone: Samtec Inc. New Albany. IN USA. All Rights Reserved

Aries Center probe CSP socket Cycling test

Aries Kapton CSP socket Cycling test

Keysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)

Agilent E2695A SMA Probe Head for InfiniiMax 1130 Series Active Oscilloscope Probes. User s Guide

Procedures Guide. Tektronix. HDMI Sink Instruments Differential Impedance Measurement

Keysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)

Electrical Performance Report 85 ohm Reference Impedance

EE290C - Spring 2004 Advanced Topics in Circuit Design

Aries CSP microstrip socket Cycling test

LVDS Flow Through Evaluation Boards. LVDS47/48EVK Revision 1.0

Serial ATA International Organization

Measuring PCB, Cable and Interconnect Impedance, Dielectric Constants, Velocity Factor, and Lengths

High Speed Characterization Report MEC8-1XX-02-X-DV-A

Application Note AN-13 Copyright October, 2002

Application Note. Signal Integrity Modeling. SCSI Connector and Cable Modeling from TDR Measurements

Keysight Technologies High Precision Time Domain Reflectometry (TDR) Application Note

Measurement Notes. Note 53. Design and Fabrication of an Ultra-Wideband High-Power Zipper Balun and Antenna. Everett G. Farr Farr Research, Inc.

ABSTRACT. List of Figures

Keysight Technologies Using the Time-Domain Reflectometer. Application Note S-Parameter Series

A Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs

QPairs QTE-DP/QSE-DP Final Inch Designs in Serial ATA Generation 1 Applications 5mm Stack Height. REVISION DATE: January 12, 2005

Logic Analyzer Probing Techniques for High-Speed Digital Systems

Signal Integrity Testing with a Vector Network Analyzer. Neil Jarvis Applications Engineer

TileCal Analogue Cable Measurement Report

High Speed Characterization Report

SPECIFICATION AND PERFORMANCE CHARACTERISTICS SERIAL ATA CABLE ASSEMBLIES

Signal Integrity Tips and Techniques Using TDR, VNA and Modeling. Russ Kramer O.J. Danzy

PicoSource PG900 Series

High Speed Characterization Report

Time Domain Reflectometry (TDR) and Time Domain Transmission (TDT) Measurement Fundamentals

CERTIFICATE OF CALIBRATION

Measuring Hot TDR and Eye Diagrams with an Vector Network Analyzer?

PRODUCT SPECIFICATION

Characterization and Measurement Based Modeling

772D coaxial dual-directional coupler 773D coaxial directional coupler. 775D coaxial dual-directional coupler 776D coaxial dual-directional coupler

Probing Techniques for Signal Performance Measurements in High Data Rate Testing

High Speed Characterization Report

TDR Primer. Introduction. Single-ended TDR measurements. Application Note

Electronic Package Failure Analysis Using TDR

3.003 Lab 3 Part A. Measurement of Speed of Light

The data rates of today s highspeed

Supplement. TDS5032 and TDS5034 Digital Phosphor Oscilloscopes

MODEL GB/S BROADBAND AMPLIFIER

Keysight Technologies Signal Integrity Tips and Techniques Using TDR, VNA and Modeling

Agilent 81133A/81134A

DM74ALS14 Hex Inverter with Schmitt Trigger Inputs

High Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug

DesignCon Design of Gb/s Interconnect for High-bandwidth FPGAs. Sherri Azgomi, Altera Corporation

Specification. CTR 2 ESD calibration target

Limitations And Accuracies Of Time And Frequency Domain Analysis Of Physical Layer Devices

PicoSource PG900 Series USB differential pulse generators

Advanced Signal Integrity Measurements of High- Speed Differential Channels

MICTOR. High-Speed Stacking Connector

SIGNAL INTEGRITY ANALYSIS AND MODELING

Student Research & Creative Works

TDR Impedance Measurements: A Foundation for Signal Integrity

HP 16533A 1-GSa/s and HP 16534A 2-GSa/s Digitizing Oscilloscope

Transcription:

High Data Rate Characterization Report EQRF-020-1000-T-L-SMA-P-1 Mated with: QSE-xxx-01-x-D-A and SMA-J-P-x-ST-TH1 Description: Cable Assembly, High Speed Coax, 0.8 mm Pitch Samtec, Inc. 2005 All Rights Reserved

Table of Contents Introduction...3 Product Description...3 Results Summary...5 Time Domain Data...5 Impedance...5 Timing Measurements...5 NEXT...6 FEXT...6 Frequency Domain Data...7 Insertion Loss...7 Return Loss...8 SWR...10 Near End Crosstalk...11 Test Procedures...13 Fixturing:...13 Time Domain Testing...15 Impedance:...15 Propagation Delay:...15 Skew:...15 NEXT and FEXT:...15 Frequency Domain Testing...16 Equipment...18 Time Domain Testing...18 Samtec, Inc. 2005 Page:ii All Rights Reserved

Introduction This testing was performed to evaluate the electrical performance of the EQRF series of high-speed cable systems. Testing was performed in accordance to the High Performance Electrical Interconnect (HPEI) SFF-8416, Level 1 testing standards when applicable. Time domain and frequency domain measurements were made. Time domain measurements included impedance, propagation delay, crosstalk and skew. Frequency domain measurements were preformed using Tektronix s IConnect and Measurement XTractor software (Version 3.6.0) and included insertion loss (IL), return loss (RL), standing wave ratio (SWR), near end crosstalk (NEXT) and far end crosstalk (FEXT). All measurements were made utilizing test boards specifically designed for this project and are referred to as test board in this report. The test boards were identified as PCB- 100465-TST-02 and PCB-100465-TST-03. Product Description The sample consists of forty 1-meter long RG-316 coaxial cables. At one end of the assembly each cable terminates to a small transition PCB having a QTE header connector soldered to the PCB. The QTE connector contains 20 pins per row. The other ends of the cables are terminated in SMA male connectors (plugs). There is a small label near the SMA end of each cable bearing a number that corresponds to the QXE terminal number at the other end of the assembly. Figure 1 on the following page is a picture of the termination configurations of the test sample. One sample was tested. The actual sample part number tested is shown below in Table 1, which also identifies End 1 and End 2 of the assembly. Two lines, the longest and the shortest electrical paths, of the sample were tested. Length Part Number Termination End 1 Termination End 2 1000 mm EQRF-020-1000-T-L-SMA-P-1 QTE-020-01-X-D-A SMA-P-C-H-ST-CA1 Table 1: Sample Description Samtec, Inc. 2005 Page:3 All Rights Reserved

Figure 1: Test Sample Configuration Note: The measurements made from End 1, QTE-020-01-X-D-A, were impedance, and time domain and frequency domain NEXT. Measurements made from End 2, SMA-P-C-H-ST-CA1, were insertion loss, return loss, SWR, and time domain and frequency domain FEXT. Samtec, Inc. 2005 Page:4 All Rights Reserved

Results Summary Time Domain Data Impedance Impedance measurements were performed using a filtered risetime of 100 ps. Note that all measurements were performed with the cable assembly mated to the respective connector/test board. Data was measured at the cable connector, cable termination and 200 ps into the cable. Assembly Path End Option End 1 Cable End 1 Z Min (Ω) Z Max (Ω) Z Nom (Ω) EQRF-020-1000-T-L-SMA-P-1 Long 45.5 59.7 47.7 Short 39.1 52.3 47.7 Table 2: Impedance Measurements Timing Measurements Skew was calculated as the difference between the propagation delay of the longest and the shortest electrical paths. End 1 of the assembly was the source end for these measurements. The results are tabulated below. Assembly EQRF-020-1000-T-L-SMA-P-1 Table 3: Timing Measurements Path Propagation Delay (ns) Long 5.095 Short 5.074 Skew (ns).021 Samtec, Inc. 2005 Page:5 All Rights Reserved

NEXT The near end crosstalk was measured in the time domain and converted to a percentage and reported below in Table 4. The incident pulse amplitude from the TDR was 240 mv. The acquired data was measured using a filtered rise time of 100 ps. The End 1 heading in Table 4 represents the near-end cable assembly connector, i.e. the source end. All NEXT measurements were performed with the cable assembly mated to the respective connector/test board. Since most of the crosstalk occurs in the connectors, the values in Table 4 represent the crosstalk that occurs in the near-end mated cable assembly and the test board connectors. Assembly EQRF-020-1000-T-L-SMA-P-1 Path END1 NEXT (mv) NEXT (%) Long 32.4 13.5 Short 28.4 11.8 Table 4: % NEXT FEXT The far end crosstalk was measured in the time domain and converted to a percentage and reported below in Table 5. The incident pulse amplitude from the TDR was 240 mv. The acquired data was measured using a filtered rise time of 100 ps. The End 2 heading in Table 5 represents the near-end cable assembly connector, i.e. the source end. All FEXT measurements were performed with the cable assembly mated to the respective connector/test board. The values in Table 5 represent the crosstalk measured at the far end of the assembly. Assembly EQRF-020-1000-T-L-SMA-P-1 Path END 2 FEXT (mv) FEXT (%) Long 6.8 2.8 Short 3.0 1.3 Table 5: % FEXT Samtec, Inc. 2005 Page:6 All Rights Reserved

Frequency Domain Data Insertion Loss Figure 2: EQRF-020-1000-T-L-SMA-P-1 Insertion Loss Short Path Figure 3: EQRF-020-1000-T-L-SMA-P-1 Insertion Loss Long Path Samtec, Inc. 2005 Page:7 All Rights Reserved

Return Loss Figure 4: EQRF-020-1000-T-L-SMA-P-1 QXE End Return Loss Short Path Figure 5: EQRF-020-1000-T-L-SMA-P-1 QXE End Return Loss Long Path Samtec, Inc. 2005 Page:8 All Rights Reserved

Figure 6: EQRF-020-1000-T-L-SMA-P-1 SMA End Return Loss Short Path Figure 7: EQRF-020-1000-T-L-SMA-P-1 SMA End Return Loss Long Path Samtec, Inc. 2005 Page:9 All Rights Reserved

SWR 5.0 4.5 4.0 3.97 SWR 3.5 3.0 SWR EQRF-020-1000-T-L-SMA-P-1 Short Path 2.5 2.0 1.73 1.5 1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Freq (GHz) Figure 8: EQRF-020-1000-T-L-SMA-P-1 SWR Short Path 5.0 4.5 4.0 3.5 3.47 SWR 3.0 2.5 SWR EQRF-020-1000-T-L-SMA-P-1 Long Path 2.0 1.5 1.45 1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Freq (GHz) Figure 9: EQRF-020-1000-T-L-SMA-P-1 SWR Long Path Samtec, Inc. 2005 Page:10 All Rights Reserved

Near End Crosstalk Figure 10: EQRF-020-1000-T-L-SMA-P-1 NEXT Short Path Figure 11: EQRF-020-1000-T-L-SMA-P-1 NEXT Long Path Samtec, Inc. 2005 Page:11 All Rights Reserved

Far End Crosstalk Figure 12: EQRF-020-1000-T-L-SMA-P-1 FEXT Short Path Figure 13: EQRF-020-1000-T-L-SMA-P-1 FEXT Long Path Samtec, Inc. 2005 Page:12 All Rights Reserved

Test Procedures Fixturing: All measurements were performed using the test boards specifically designed for this project. The test boards have trace lengths of 2.375 inches and provide for the interconnection to the EQRF cable by use of replaceable SMA connectors. Test board PCB-100465-TST-02 has a THRU reference trace. Figure 14 below shows how the THRU reference trace was utilized to compensate for the losses due to the coaxial test cables, SMA launches, and the test board traces during testing. Reference trace Coax Cable Coax Cable TDT TDR Tektronix 11801B SD26 Ch3 &Ch4 SMA Launches Tektronix 11801B SD24 Ch1 & Ch2 Figure 14: Test setup for Thru Reference Acquisition Measurements were then performed using the test boards as shown in Figure 15. A picture of the test board and cable is shown in Figure 16. Coax Cable Cable under test Coax Cable TDT TDR Tektronix 11801B SD26 Ch3 & Ch4 SMA Launches Tektronix 11801B SD24 Ch1 & Ch2 Figure 15: Characterization test setup Samtec, Inc. 2005 Page:13 All Rights Reserved

Figure 16: Test setup with Test PCBs and EQRF cable. The cable terminations had a particular S & G configuration. The respective signal line numbers are shown in Table 6 below (there are a total of 20 positions per row). All adjacent lines are terminated where applicable. G 4 G G 10 12 G G 18 20 22 24 G G G G 34 36 38 40 G 3 G G 9 11 G G 17 19 21 23 G G G G 33 35 37 39 Table 6: Grounding scheme and respective signal line numbers Table 7 below shows the signal line numbers corresponding to the short and long paths for the different configurations tested. Path Assembly Long Short EQRF-020-1000-T-L-SMA-P-1 39 18 Table 7: Long Path and Short Path Signal Line Numbers Samtec, Inc. 2005 Page:14 All Rights Reserved

Time Domain Testing Impedance: The Tektronix 11801B oscilloscope was set up in TDR (time domain reflectometry) mode using a 100-pS filtered risetime and 16 averages. The horizontal setup of the TDR used 512 point record length and a horizontal scale of 200 ps/div to allow the near end connector and a portion of the cable to be displayed. All impedance measurements were made at the near-end connector, near-end cable termination and 200 ps into the cable. Propagation Delay: The propagation delay was measured and skew calculated by first acquiring a thru reference pulse of the reference trace. Using the delay function of the TDR, set at 50% amplitude of the reference pulse, the sample was inserted and the sample delay was measured. The TDR delay function calculates the sample delay by subtracting the delay measurement of the reference pulse from the delay measurement of the sample plus the test board traces. Skew: Skew is defined as the difference between of the propagation delays of the longest (maximum delay) and the shortest (minimum delay) electrical paths. NEXT and FEXT: Near end crosstalk (NEXT) and far end crosstalk (FEXT) measurements were made using the Tektronix 11801B oscilloscope. A thru reference of the coaxial test cables, SMAs, and reference board was performed to determine the pulse amplitude of the TDR generator (see Figure 14). To acquire NEXT, a signal was applied using the oscilloscope pulse generator. NEXT was measured on an adjacent signal line at the near end (see Figure 17). To acquire FEXT, a trace was driven with the oscilloscope pulse generator. FEXT was measured on an adjacent trace at the far end (see Figure 18). All adjacent lines were terminated, at both ends, with 50Ω SMA loads; refer to Figures 17 and 18. Samtec, Inc. 2005 Page:15 All Rights Reserved

Frequency Domain Testing All frequency domain measurements were made using the Tektronix 11801B oscilloscope. Testing was performed using a risetime of 35 ps. The horizontal scale was set to 5 ns/div, the record length was set to 5120 points and the number of averages was set to 128. These values were selected to ensure the ratio between the number of points and the window length was long enough to capture the highest frequencies and still yield a small enough frequency step to gain adequate resolution. Either End 1 or End 2 of the assembly was the source end for the frequency domain measurements depending on the measurement performed. All adjacent lines were terminated, at both ends, with 50Ω SMA loads; refer to Figures 17 and 18. Attenuation: Insertion Loss test setup losses were compensated for by acquiring a thru measurement (reference output pulse) of the coaxial test cables, SMAs, and the reference trace (see Figure 14 on page 11). A thru measurement of an assembly was taken and then post processed by using Tektronix s IConnect software (Version 3.6.0). The result is the insertion loss of the cable assembly. Return Loss: An open circuit reference measurement was taken using a signal trace on a test fixture board without mating connector to the cable assembly. A matched reflection waveform of the cable assembly, i.e. with the cable assembly terminated in a 50-Ω SMA load on the far end test board, was acquired and then post processed by using Tektronix s IConnect software (Version 3.6.0). The result is the return loss of the cable assembly. Near and Far End Crosstalk: NEXT and FEXT were measured in the time domain using the oscilloscope and then converted to frequency domain data using Tektronix s IConnect software (Version 3.6.0). Initially a thru reference measurement of the coaxial test cables, SMAs, and reference board was performed to compensate for the test setup losses (see Figure 14). To acquire NEXT a trace was driven using the oscilloscope pulse generator. NEXT was measured, in the time domain, on an adjacent trace (see Figure 17). NEXT was then post processed using Tektronix s IConnect software to generate the NEXT of the cable assembly in the frequency domain. To acquire FEXT a trace was driven using the oscilloscope pulse generator. FEXT was measured, in the time domain, on an adjacent trace at the far end (see Figure 18). FEXT was then post processed using Tektronix s IConnect software to generate the FEXT of the cable assembly in the frequency domain. Samtec, Inc. 2005 Page:16 All Rights Reserved

EQRF sample Ch1 & 2 Ch3 & 4 SMAs NEXT test FEXT test Tektronix 11801B Figure 17: NEXT Measurement Setup. Coax EQRF Sample Coax TDT TDR Tektronix 11801B SD26 Ch3 & Ch4 SMA Launches Tektronix 11801B SD24 Ch1 & Ch2 Figure 18: FEXT Measurement Setup Samtec, Inc. 2005 Page:17 All Rights Reserved

Equipment Time Domain Testing Tektronix 11801B Oscilloscope Tektronix SD26 Sampling Head Tektronix SD24 TDR/Sampling Head Samtec, Inc. 2005 Page:18 All Rights Reserved